Poly (lactic acid)/poly (vinyl butyral) composites containing kaolin modified by acids and calcination (2024), Hayeong Lee, Jeong‐Ho Park, Keon‐Soo Jang, Journal of Applied Polymer Science, 141(45), e56200 

Optimizing Surface Characteristics of Stainless Steel (SUS) for Enhanced Adhesion in Heterojunction Bilayer SUS/Polyamide 66 Composites (2024), Sang-Seok Yun, Wanjun Yoon, Keon-Soo Jang, Polymers 16(19), 2737

Solvent-free Cu sintering pastes using acidic activators (2024), Seong-ju Han, Gun-woo Park, Keon-Soo Jang, Microelectronics Reliability 159, 115454

4D printing and simulation of body temperature-responsive shape-memory polymers for advanced biomedical applications (2024), Dahong Kim, Kyung-Hyun Kim, Yong-Suk Yang, Keon-Soo Jang, Sohee Jeon, Jun-Ho Jeong, Su A Park, International Journal of Bioprinting, 3035

The Role of Surface Treatment and Coupling Agents for Adhesion between Stainless Steel (SUS) and Polyamide (PA) of Heterojunction Bilayer Composites (2024), Hayeong Lee, Seung-In Song, Keon-Soo Jang, Polymers 16(7), 896

Surface treatment of stainless steel (SUS) to improve interfacial adhesion of SUS/polymer hybrid bilayer composites (2024), Gyoung Su Choi, Keon-Soo Jang, International Journal of Adhesion and Adhesives 130, 103629 

Catalysis of Silver and Bismuth in Various Epoxy Resins (2024), Hayun Jeong, Keon-Soo Jang, Polymers, 16(3), 439

Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering (2024), Seong-ju Han, Seungyeon Lee, Keon-Soo Jang, Polymers 16(3), 398  

Correction to “Electrical and Thermal Properties of Surface-Modified Copper Nanowire/Polystyrene Nanocomposites through Latex Blending” (2024), Hyeon Sik Eom, Dong Won Kim, Keon-Soo Jang, Seong Jae Lee, ACS omega 9(4), 5080-5081 

Poly (butylene terephthalate)/poly (ethylene glycol) blends with compatibilizers (2024), Hayeong Lee, Tae‐Hee Lee, Hyungsu Kim, Keon‐Soo Jang, Journal of Applied Polymer Science, e55230 

Electrical and Thermal Properties of Surface-Modified Copper Nanowire/Polystyrene Nanocomposites through Latex Blending (2023), Hyeon Sik Eom, Dong Won Kim, Keon-Soo Jang, Seong Jae Lee, ACS omega 8(49), 46955-46966 

Copper Sintering Pastes with Various Polar Solvents and Acidic Activators (2023), Seungyeon Lee, Seong-ju Han, Yongjune Kim, Keon-Soo Jang, ACS omega 8(42), 39135-39142 

Thermal, Curing, Elastic, and Mechanical Properties of Ethylene Propylene Diene Monomer/Polybutadiene/Carbon Black Composites (2023), Tae-Hee Lee, Keon-Soo Jang, Elastomers and composites 58, 142

Electromagnetic Interference Shielding Performance of Poly(styrene-co-butyl acrylate)/Carbon Nanotube Nanocomposites Fabricated by Latex Technology (2023), Yeong Jae Kim, Seung Chang Lee, Hyun Ho Park, Keon-Soo Jang, Seong Jae Lee, Industrial & Engineering Chemistry Research, 62(12), 5015-5023 

Effects of filler functionalization on filler-embedded natural rubber/ethylene-propylene-diene monomer composites (2022), SH Lee, GW Park, HJ Kim, K Chung, KS Jang, Polymers 14 (7), 3502

Physical and Chemical Compatibilization Treatment with Modified Aminosilanes for Aluminum/Polyamide Adhesion(2022), BY Lee, HG Jeong, SJ Kim, BG Kang, KS Jang, ACS omega 7 (27), 23865-23874

Mechanical, Thermal, and Rheological Properties of Phlogopite-Incorporated Polycarbonate and Polystyrene(2022), SS Yoon, SH Lee, GC Hwang, MK Choi, BG Kang, H Kim, KS Jang, Macromolecular Research, 1-10

Influence of Ionomer and Cyanuric Acid on Antistatic, Mechanical, Thermal, and Rheological Properties of Extruded Carbon Nanotube (CNT)/Polyoxymethylene (POM) Nanocomposites(2022), SS Yun, D Shin, KS Jang, Polymers 14 (9), 1849

Incorporation of alkyl‐functionalized silica nanoparticles into hydrophilic epoxy and hydrophobic polystyrene matrices(2022), BY Lee, S Park, DW Chung, KS Jang, Journal of Applied Polymer Science 139 (12), 51828

Catalysis of reduced tin oxide in various epoxy resins(2022), H Jeong, KS Jang, Materials Today Communications 30, 103178

Effects of Filler Functionalization on Filler-Embedded Natural Rubber/Ethylene-Propylene-Diene Monomer Composites(2022), SH Lee, GW Park, HJ Kim, K Chung, KS Jang, Polymers 14 (17), 3502

Near-Infrared Light-Responsive Shape Memory Polymer Fabricated from Reactive Melt Blending of Semicrystalline Maleated Polyolefin Elastomer and Polyaniline(2022), MS Heo, TH Kim, YW Chang, KS Jang, Polymers 13 (22), 3984

Electrically Conductive Silicone-Based Nanocomposites Incorporated with Carbon Nanotubes and Silver Nanowires for Stretchable Electrodes(2022), TG Kim, HS Eom, JH Kim, JK Jung, KS Jang, SJ Lee, ACS omega 6 (47), 31876-31890

Morphology, electrical conductivity, and rheology of latex-based polymer/nanocarbon nanocomposites(2022), KS Jang, HY Yeom, JW Park, SH Lee, SJ Lee, Korea-Australia Rheology Journal 33 (4), 357-366

Crystallinity-tailorable solvent-free hybrid adhesive films composed of epoxy, diacid, and poly (ethylene glycol) with curable and deoxidizing capabilities(2022), BY Lee, KS Jang, Journal of Industrial and Engineering Chemistry 100, 186-193

Phlogopite-reinforced natural rubber (NR)/ethylene-propylene-diene monomer rubber (EPDM) composites with aminosilane compatibilizer(2022), SH Lee, SY Park, KH Chung, KS Jang, Polymers 13 (14), 2318

Circular braided glass fiber/epoxy composites with helical architecture (coil spring) fabricated by p laster‐sacrificial compression molding for structural automotive applications(2022), SJ Kim, J Shin, JG Kim, KH Park, KS Jang, Journal of Applied Polymer Science 138 (19), 50405

Latent curing, chemorheological, kinetic, and thermal behaviors of epoxy resin matrix for prepregs(2022), YJ Kim, SH Choi, SJ Lee, KS Jang, Industrial & Engineering Chemistry Research 60 (17), 6153-6161

Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities(2022), BY Lee, DH Lee, KS Jang, Polymers 13 (7), 1129

Dispersibility-tailored conductive epoxy nanocomposites with silica nanoparticle-embedded silver nanowires(2022), TG Kim, JM Kim, KS Jang, SJ Lee, Polymer Testing 96, 107111

Zeta potential-tunable silica abrasives and fluorinated surfactants in chemical mechanical polishing slurries(2021), S Hong, D Han, KS Jang, Wear 466, 203590

Morphology, mechanical properties and shape memory effects of polyamide12/polyolefin elastomer blends compatibilized by glycidylisobutyl POSS (2021), DH Lee, YW Chang, KS Jang, Materials 14 (1), 27

Vertically aligned nanostructured gold microtube assisted by polymer template with combination of wet phase inversion and Cu grid mask (2020), S Kim, KS Jang, Scientific reports 10 (1), 1-8

Influence of abrasive morphology and size dispersity of Cu barrier metal slurry on removal rates and wafer surface quality in chemical mechanical planarization (2020), S Hong, D Han, J Kwon, SJ Kim, SJ Lee, KS Jang, Microelectronic Engineering 232, 111417

Lifting-Force Maximization of a Micropatterned Electroadhesive Device Comparable to the Human-Finger Grip (2020), K Choi, SH Kim, U Hwang, J Kim, IK Park, KS Jang, HJ Choi, HR Choi, ACS Applied Electronic Materials 2 (6), 1596-1602

Method of fabricating a semiconductor package (2020), KS Choi, Y Eom, KS Jang, SH Moon, HC Bae, I Jeong, WAB Junior, US Patent 10,636,761

Low-density polycarbonate composites with robust hollow glass microspheres by tailorable processing variables (2020), KS Jang, Polymer Testing 84, 106408

Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging (2020), YS Eom, KS Choi, GM Choi, KS Jang, JH Joo, CM Lee, SH Moon, JT Moon, Electronics and Telecommunications Trends 35 (4), 1-10

Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications (2019), YS Eom, KS Jang, JH Son, HC Bae, KS Choi, TRI Journal 41 (6), 820-828

Electrically conductive polystyrene nanocomposites incorporated with aspect ratio‐controlled silver nanowires (2019), JM Kim, KS Jang, SJ Lee, Journal of Applied Polymer Science 136 (36), 47927

Theoretical analysis and development of thermally conductive polymer composites (2019), SJ Kim, C Hong, KS Jang, Polymer 176, 110-117

Adhesive film for electric device and method of fabricating semiconductor package using the same (2019), J Keonsoo, YS Eom, KS Choi, SH Moon, HC Bae, US Patent App. 16/221,206

Compatibilizing effects for semicrystalline polymer‐infiltrated amorphous polymer matrix: Compatibilizing effects for semicrystalline polymer-infiltrated amorphous polymer matrix: Mechanical (toughness), thermal, and morphological behavior of compatibilized polypropylene/polycarbonate blends (2019), KS Jang, Journal of Applied Polymer Science 136 (25), 47684

Collective laser‐assisted bonding process for 3D TSV integration with NCP (2019), W Alves Braganca, YS Eom, KS Jang, SH Moon, HC Bae, KS Choi, Etri Journal 41 (3), 396-407

Rheological and electrical properties of polystyrene nanocomposites via incorporation of polymer-wrapped carbon nanotubes (2019), JS Park, JH An, KS Jang, SJ Lee, Korea-Australia Rheology Journal 31 (2), 111-118

Probing toughness of polycarbonate (PC: ductile and brittle)/polypropylene (PP) blends and talc‐triggered PC/PP brittle composites with diverse impact fracture parameters (2019), KS Jang, Journal of Applied Polymer Science 136 (9), 47110

Exploring polyethylene/polypropylene nonwoven fabrics derived from two-dimensionally co-extruded composites: Effects of delamination, consolidation, drawing and nanoparticle incorporation on mechanics, pore size and permeability (2018), KS Jang, Composites Science and Technology 165, 380-387

Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis (2018), KS Jang, YS Eom, KS Choi, HC Bae, Journal of Applied Polymer Science 135 (33), 46639

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging (2018), KS Jang, YS Eom, KS Choi, HC Bae, Polymer International 67 (9), 1241-1247

Mechanics and rheology of basalt fiber-reinforced polycarbonate composites (2018), KS Jang, Polymer 147, 133-141

Interconnection process using laser and hybrid underfill for LED array module on pet substrate (2018), KS Choi, WAB Junior, KS Jang, SH Moon, HC Bae, YS Eom, MK Cho, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1567-1573

Versatile epoxy/phenoxy/anhydride-based hybrid adhesive films for deoxidization and electrical interconnection (2018), KS Jang, YS Eom, KS Choi, HC Bae, Industrial & Engineering Chemistry Research 57 (21), 7181-7187

Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test, WA Bragança, YS Eom, J Son, KS Jang, HC Bae, SH Moon, KS Choi, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-8

Development of stacking process for 3D TSV (through silicon via) structure using laser (2017), KS Choi, WA Braganca, KS Jang, HC Bae, YS Eom, International Symposium on Microelectronics 2017 (1), 000067-000071

Low-temperature sintering behavior of ternary solder and copper powder for high-power device packaging (2017), YS Eom, KS Jang, JH Son, HC Bae, KS Choi, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

Solvent-free fluxing underfill film for electrical interconnection (2017), KS Jang, YS Eom, KS Choi, HC Bae, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology (2017), KS Choi, SH Moon, HC Bae, KS Jang, YS Eom, Electronics and Telecommunications Trends 32 (6), 17-26

Mechanically tunable dual-component polyolefin fiber mats via two-dimensional multilayer coextrusion (2016), WR Lenart, KS Jang, AM Jordan, E Baer, LSTJ Korley, Polymer 103, 328-336

Composition and methods of forming solder bump and flip chip using the same (2016), YS Eom, JT Moon, OH Sangwon, J Keonsoo, US Patent 9,462,736

Mineral filler effect on the mechanics and flame retardancy of polycarbonate composites: Talc and kaolin (2016), KS Jang, e-Polymers 16 (5), 379-386

Biphenyl-based liquid crystal precursors with alkanoate and hydroxyl group (2016), KS Jang, Molecular Crystals and Liquid Crystals 633 (1), 123-128

Phase diagrams of thermally stable, polymer‐dispersed liquid crystals: Exploring the impact of chain length and chemical structure (2016), KS Jang, LSTJ Korley, Polymer Engineering & Science 56 (4), 388-393

Composition and methods of forming solder bump and flip chip using the same (2015), YS Eom, JT Moon, OH Sangwon, J Keonsoo, US Patent 9,155,236

Harnessing the power of phase interactions-tailoring mechanics via supramolecular motifs (2015), LS Korley, S Monemian, KS Jang, ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 250

Exploring Mechanics Via Structural Interplay in Supramolecular Networks, Melt-extruded Fibers, and Liquid Crystal/Polymer Blends (2015), KS Jang, Case Western Reserve University

Biphenyl-based liquid crystals for elevated temperature processing with polymers (2014), KS Jang, JC Johnson, T Hegmann, E Hegmann, LSTJ Korley, Liquid Crystals 41 (10), 1473-1482

Probing the Interplay of Ultraviolet Cross-Linking and Noncovalent Interactions in Supramolecular Elastomers (2014), S Monemian, KS Jang, H Ghassemi, LSTJ Korley, Macromolecules 47 (16), 5633-5642

Composition and methods of forming solder bump and flip chip using the same (2014), YS Eom, JT Moon, OH Sangwon, J Keonsoo, US Patent 8,802,760

Characterization of fluxing and hybrid underfills with micro‐encapsulated catalyst for long pot life (2014), YS Eom, JH Son, KS Jang, HS Lee, HC Bae, KS Choi, HS Choi, ETRI Journal 36 (3), 343-351

Porous polyimide membranes prepared by wet phase inversion for use in low dielectric applications (2013), S Kim, KS Jang, HD Choi, SH Choi, SJ Kwon, ID Kim, JA Lim, JM Hong, International journal of molecular sciences 14 (5), 8698-8707

Composition and methods of forming solder bump and flip chip using the same (2013), YS Eom, JT Moon, OH Sangwon, J Keonsoo, US Patent 8,420,722

Synchronous vapor-phase coating of conducting polymers for flexible optoelectronic applications (2011), KS Jang, JD Nam, Optoelectronic Devices and Properties, 151-170

Synchronous vapor-phase polymerization of poly (3, 4-ethylenedioxythiophene) and poly (3-hexylthiophene) copolymer systems for tunable optoelectronic properties (2010), KS Jang, DO Kim, JH Lee, SC Hong, TW Lee, Y Lee, JD Nam, Organic Electronics 11 (10), 1668-1675

Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder (2010), JW Baek, KS Jang, YS Eom, JT Moon, JM Kim, JD Nam, Microelectronic engineering 87 (10), 1968-1972

Electrical interconnection with a smart ACA composed of fluxing polymer and solder powder (2010), YS Eom, KS Jang, JT Moon, JD Nam, ETRI Journal 32 (3), 414-421

Catalytic behavior of Sn/Bi metal powder in anhydride-based epoxy curing (2009), KS Jang, YS Eom, JT Moon, YS Oh, JD Nam, Journal of nanoscience and nanotechnology 9 (12), 7461-7466

Fabrication of poly (3-hexylthiophene) thin films by vapor-phase polymerization for optoelectronic device applications (2009), KS Jang, YS Eom, TW Lee, DO Kim, YS Oh, HC Jung, JD Nam, ACS applied materials & interfaces 1 (7), 1567-1571

In-situ blends of polypyrrole/poly (3, 4-ethylenedioxythiopene) using vapor phase polymerization technique (2009), DO Kim, PC Lee, SJ Kang, K Jang, JH Lee, MH Cho, JD Nam, Thin Solid Films 517 (14), 4156-4160

Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder (2008), YS Eom, K Jang, JT Moon, JD Nam, JM Kim, Microelectronic engineering 85 (11), 2202-2206

장건수, 엄용성Method of forming an adhesive film (접착 필름의 제조 방법) 출원번호: 1020170112780 (2017.09.04)

장건수, 엄용성, 최광성, 문석환, 배현철 Low-temperature curing process and method of fabricating a semiconductor package (저온 경화 방법 및 이를 이용하는 반도체 패키지의 제조 방법) 출원번호: 1020180030475 (2018.03.15)

엄용성, 장건수, 최광성, 문석환, 배현철 Method of forming a thermally cured layer and method of fabricating a semiconductor package using the same (열경화막의 형성 방법 및 이를 이용한 반도체 패키지의 제조 방법) 출원번호: 1020170151772 (2017.11.14)

 엄용성, 문종태, 오상원, 장건수 COMPOSITION, AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME (조성물, 및 이를 이용한 솔더 범프 형성방법 및 플립칩 형성방법) 등록번호: 1011756820000 (2012.08.14)

장건수, 엄용성, 최광성, 문석환, 배현철 Filling composition for semiconductor package (반도체 패키지 충진 조성물) 출원번호: 1020180074944 (2018.06.28)

장건수, 엄용성, 최광성, 문석환, 배현철 Adhesive film for Electric device and method of fabricating a semiconductor package using the same (접착 필름 및 이를 이용한 반도체 패키지의 제조 방법) 출원번호: 1020180053710 (2018.05.10)

엄용성, 장건수, 최광성, 문석환, 배현철 SOLDER COMPOSITION, ELECTRONIC DEVICE MANUFACTURED BY USING THE SAME, AND METHOD OF FABRICATING THEREOF (솔더 조성물, 이를 이용하여 제조된 전자 소자 및 이의 제조 방법) 출원번호: 1020170069802 (2017.06.05)

최광성, 엄용성, 장건수, 문석환, 배현철 Bonding method using laser (레이저 접합 방법) 출원번호: 1020190014642 (2019.02.07)

최광성, 엄용성, 장건수, 문석환, 배현철, 정이슬, 와그노알베스브라간사주니어 Method of fabricating a semiconductor package (반도체 패키지의 제조 방법) 출원번호: 1020180069201 (2018.06.15)