Publications

Journal

  1. Myunghoi Kim and Sunkyu Kong, "Efficient Approach for Electrical Design and Analysis of High-Speed Interconnect in Integrated Circuit Packages," Electronics, vol. 9, no. 303, Feb., 2020.

  2. M. Kim, "A Dual-Perforation Electromagnetic Bandgap Structure for Parallel-Plate Noise Suppression in Thin and Low-Cost Printed Circuit Boards," Electronics, vol. 8, no. 719, 2019.

  3. M. Kim, "Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards," Electronics, vol. 8, no. 299, 2019.

  4. M. Kim, "Unit-Cell-Based Domain Decomposition Method for Efficient Simulation of a Truncated Electromagnetic Bandgap Structure in High-Speed PCBs," Electronics, vol. 7, no. 9, Sep. 2018.

  5. M. Kim, "A Miniaturized Electromagnetic Bandgap Structure Using an Inductance-Enhanced Patch for Suppression of Parallel Plate Modes in Packages and PCBs," Electronics, vol. 7, no. 5, May, 2018.

  6. M. Kim and S. Ahn, "A Compact and Multi-Stack Electromagnetic Bandgap Structure for Gigahertz Noise Suppression in Multilayer Printed Circuit Boards," Applied Sciences, vol. 7, no. 8, 804, Aug. 2017.

  7. M. Kim, "Periodically Corrugated Reference Planes for Common-Mode Noise Suppression in High-Speed Differential Signals," IEEE Trans. Electromagn. Compat., vol. 58, no. 2, pp. 619-622, April 2016.

  8. M. Kim, "Multi-stack Technique for a Compact and Wideband EBG Structure in High-Speed Multilayer Printed Circuit Boards," ETRI J., vol. 38, no. 5, pp. 903-910, Oct. 2016.

  9. M. Kim, "A stepped-impedance true time delay line using GaAs MMIC technology," IEICE Electronics Express, Vol. 13 (2016) No. 13 pp. 20160463, July, 2016

  10. M. Kim and D. G. Kam, “Wideband and Compact EBG Structure with Balanced Slots,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 5, no. 6, pp. 818-827, June., 2015.

  11. M. Kim, “A Compact EBG Structure with Wideband Power/Ground Noise Suppression using Meander-Perforated Plane,” IEEE Trans. Electromagn. Compat, Vol. 57, no. 3, pp. 595-598, June, 2015.

  12. M. Kim and D.G. Kam, “A Wideband and Compact EBG Structure With a Circular Defected Ground Structure,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 4, no. 3, pp. 496-503, Mar., 2014.

  13. M. Kim, S. Kim, B. Bae, J. Cho, J. Kim, and D. S. Ahn, “Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise,” ETRI J., Vol. 35, no. 5, Oct., 2013.

  14. M. Kim, K. Koo, Y. Shim, C. Hwang, J. S. Pak, S. Ahn, and J. Kim, “Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multi-layer PCBs,” IEEE Trans. Electromagn. Compat., Sep., 2012.

  15. M. Kim, K. Koo, J. Kim, and J. Kim, “Vertical Inductive Bridge EBG (VIB-EBG) Structure with Size Reduction and Stopband Enhancement for Wideband SSN Suppression,” IEEE Microw. Wireless Compon. Lett., Vol. 22, no. 8, pp. 403-405, Aug., 2012.

  16. M. Kim, K. Koo, C. Hwang, Y. Shim, J. Kim, and J. Kim, “A Compact and Wideband Electromagnetic Bandgap Structure using a Defected Ground Structure for Power/Ground Noise Suppression in Multi-layer Packages and PCBs,” IEEE Trans. Electromagn. Compat., Vol. 54, no. 3, pp. 689-694, June, 2012.

  17. H. Kim, J. Cho, M. Kim, K. Kim, J. Lee, H. Lee, K. Park, K.-S. Choi, H.-C. Bae, J. Kim, and J. Kim, “Measurement and Analysis of a High-Speed TSV Channel,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 2, no. 10, pp. 1672-1685, Oct., 2012.

  18. M. Shin, M. Kim, J. Kim, J. Kim, and S. Ahn, “Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 4, no. 1, pp. 94-99 Jan., 2014.

  19. K. Koo, M. Kim, J. Kim, J. Kim, and J. Kim, “Vertical Noise Coupling from On-chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3D-IC,” IEEE Trans. Compon. Packag. Manufac. Tech., Vol. 3, no. 3, pp. 476-488 Mar., 2013.

  20. C. Hwang, Y. Shim, K. Koo, M. Kim, J. S. Pak, and J. Kim, “An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor,” IEEE Microw. Wireless Compon. Lett., Vol. 21, no. 8, pp. 439-441, Aug. 2011.

  21. J. Lee, Y.-J. Park, M. Kim, C. Yoon, J. Kim, and K.-H. Kim, “System-On-Package Ultra-Wideband Transmitter Using CMOS Impulse Generator,” IEEE Trans. Microw. Theory Tech., Vol. 54, no. 4, 1667-1674, Apr. 2006

Conference

  1. M. Kim, K. Koo, and J. Kim, “Noise Isolation Modeling of Partial EBG Power Bus Using Segmentation Method and Cavity Model in Multi-layer PCBs,” IEEE EMCS, USA, Aug. 2011.

  2. M. Kim, K. Koo, S. Kong, B. Bae, S. Lee, and J. Kim, “Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs,” IEEE APEMC, Korea, May 2011.

  3. M. Kim, C. Yoon, W. Lee, H. Sung, and J. Kim, “Power/Ground Noise Mitigation Using Z-shape Partial Electromagnetic Bandgap (ZP-EBG) Structure for Ultra-Wideband (UWB) System,” AP-RASC, Japan, Sep. 2010.

  4. M. Kim, C. Yoon, K. Koo, C. Hwang, H. Sung, and J. Kim, “Suppression of Power/Ground Noise Using Meshed-Planar Electromagnetic Bandgap (MP-EBG) Structure for Ultra-Wideband (UWB) System-in-Package (SiP),” IEEE EMCS, USA, Jul. 2010.

  5. M. Kim, J. Lee, Y.-J. Park, and J. Kim, “System-on-Package Ultra Wideband Transmitter with Integrated Bandpass Filter and Broad Band Planar Antenna,” IEEE ECTC, May 2005.

  6. K. Koo, M. Kim, and J. Kim, “Vertical Noise Coupling from On-chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3D-IC,” Design Con 2012, USA, Jan. 2012.

  7. E. Song, K. Koo, M. Kim, J. S. Pak, and J. Kim, “Decoupling Capacitor Stacked Chip (DCSC) in TSV-based 3D-ICs,” IEEE EPEPS, USA, Oct. 2011.

  8. J. Cho, M. Kim, J. Kim, J. S. Pak, H. Lee, J. Lee, K. Park, and J. Kim, “Through-Silicon Via (TSV) Depletion Effect,” IEEE EPEPS, USA, Oct. 2011.

  9. K. Koo, M. Kim, S. Lee, and J. Kim, “Measurement and analysis of vertical noise coupling on low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC,” IEEE EMCS, USA, Aug. 2011.

  10. S. Kong, M. Kim, K. Koo, S. Ahn, B. Bae, and J. Kim, “Analytical expressions for maximum transferred power in wireless power transfer systems,” IEEE EMCS, USA, Aug. 2011.

  11. M. Shin, M. Kim, K. Koo, S. Kong, and J. Kim, “Design and experimental verification of on-chip signal integrity analyzer (OSIA) scheme for eye diagram monitoring of a high-speed serial link,” IEEE EMCS, USA, Aug. 2011.

  12. H. Kim, J. Cho, J. Kim, M. Kim, J. Lee, H. Lee, K. Park, J. Kim, and J. Kim, “Channel Design for Wide System Bandwidth in a TSV based 3D IC,” IEEE Workshop on SPI, Italy, May 2011.

  13. K. Koo, M. Kim, S. Lee, and J. Kim, “Estimation of Vertical Noise Coupling on 900MHz Low Noise Amplifier from 200MHz On-chip Switching-mode Power Supply in 3D-IC,” IEEE APEMC, Korea, May. 2011.

  14. B. Bae, Y. Shim, M. Kim, J. Cho, and J. Kim, “Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter with Off-chip PDN Effects,” IEEE APEMC, Korea, May 2011.

  15. H. Sung, M. Kim, W. Lee, C. Yoon, K. Koo, J. Kwon, and J. Kim, “Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in printed circuit boards (PCBs),” IEEE EPTC, Singapore, Dec. 2010.

  16. H. Sung, E. Song, M. Kim, Y. Shim, S. Kong, J. Kwon, and J. Kim, “Design of Toroidal Current Probe Embedded in Multi-layer Printed Circuit Boards for Electrostatic Discharge(ESD) Detection,” IEEE EDAPS, Singapore, Dec. 2010.

  17. W. Lee, M. Kim, H. Sung, J. S. Pak, and J. Kim, “Clock Distribution Scheme Using Uniform Phase and Uniform Amplitude Standing Wave of Planar Cavity,” AP-RASC, Japan, Sep. 2010.

  18. K. Koo, J. Kim, M. Kim, and J. Kim, “Impact of PCB Design on Switching noise and EMI of Synchronous DC-DC buck Converter,” IEEE EMCS, USA, Jul. 2010.

  19. C. Yoon, M. Shin, Y. Shim, M. Kim, J. Cho, and J. Kim, “A Noise Coupling Effect on Reference Voltage Level of Triggering Circuit in Non-coherent UWB Communication System,” IEEE EMC Kyoto, Japan, Jan. 2009.

  20. C. Yoon, J. Lee, M. Kim, Y.-J. Park, H. Park, H. Lee, and J. Kim, “Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator,” IEEE EPTC, Singapore, Dec. 2006.

  21. J. Lee, M. Kim, M. D. Rotaru, M. K. Iyer, and J. Kim, “Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multilayer PCBs,” IEEE EMC, USA, Aug. 2004.