The Young Scientist Award, 23rd International Symposium on Microelectronics and Packaging (2025)
Best Paper Presentation Award, the Korea Microelectronics and Packaging Society (2025)
Best Paper Presentation Award, The 3rd China-Korea-Japan Joint Symposium on Composite Materials, Guangzhou, China (2025)
The Young Scientist Award, 22nd International Symposium on Microelectronics and Packaging, was held in conjunction with the 18th International Conference on Reliability and Stress-Related Phenomena in Nanoelectronics (2024)