How to Re-ball BGA Chips Manually by Hand
How to Re-ball BGA Chips Manually by Hand
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Ball Grid Array:
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package
Re-balling Chips Methods:
Prepare the proper Tools -You need to prepare also proper re balling kits and a cleaning kits for further cleaning the PC board. A good and controlled hot air temperature, you need to refer to manufacturer’s manual for proper temperature settings
Contents of a Complete BGA Re-balling Kit
Contents of a Complete BGA Re-balling Kit
Contents of a Complete BGA Re-balling Kit
1. ESD-Safe Cleaning Brush.
2. BGA Re-balling Stencil.
3. BGA De-soldering Wire / Wick / Braid
4. Solder Paste.
5. Acetone or IPA Solution.
6. Soldering Flux.
7. Heat Resistant Kapton Tape or Clips to hold the BGA IC to the Stencil.
8. PCB Holder.
9. Tweezers.
10. SMD Rework Station and Soldering Iron are generally NOT a part of the Kit
Step 1. Heat with Hot Air gun & apply Liquid paste on Chip
Step 1. Heat with Hot Air gun & apply Liquid paste on Chip
Smoothly pull the chip
Smoothly pull the chip
Right place the chip on chip plate & heat with hot air gun
Right place the chip on chip plate & heat with hot air gun
Clean the PCB with liquid paste & soldering iron
Clean the PCB with liquid paste & soldering iron
Keep the right place on the chip & heat again
Keep the right place on the chip & heat again
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