Multifunctional Durability of Printed Electronics

Multiscale analysis of nanoink sintering process and long time durability of flexible electronics

Using molecular dynamics simulations, we performed analsys of thermal sintering process of Cu nanoparticles to investigate coalescence kinetics and densification according to the size of nanoparticle and sintering temperature. In view of efficiency, it has been found that smaller nanoparticle and higher sintering temperature is desirable for conductive electrodes.

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