Research

Research Topics


ENERGY-EFFICIENT SENSOR INTERFACES

All objects surrounding us can be sensed so that we can obtain useful and various information such as voice, light, pressure, humidity, gas,  and temperature. The information is detected as electrical signals like voltage or current depending on sensors and converted to digital data by sensor interface circuits, which consist of front-end amplifiers and data converters. As a consequence, they have been widely used in many computing platforms. We focus on designing such energy-efficient interface circuits.

- H. Han, W. Choi, J. Kim, J. Sung, H.-J Choi, and Y. Chae, "A Highly-Digital PWM-Based Impedance Monitoring IC with 143.2dB DR and 17.7fFrms Resolution, IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2023.

- B. Park, I. Park, C. Park, W. Choi, Y. Na, M.-J. Lee, and Y. Chae, "A 64 × 64 SPAD-based Indirect Time-of-Flight Image Sensor with 2-tap Analog Pulse Counters," IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 10, pp. 2956–2967, Oct. 2021.

- S. Park, Y. Kim, W. Choi, Y. Lee, S. Kim, Y. Shin, and Y. Chae, "A DTMOST-Based Temperature Sensor with 3σ Inaccuracy of ±0.9°C for Self-Refresh Control in 28nm Mobile DRAM," IEEE Custom Integrated Circuits Conference (CICC), Mar. 2020.

- W. Choi, Y. Lee, S. Kim, S. Lee, J. Jang, J. Chun, K. A. A. Makinwa, and Y. Chae, "A 0.53pJ·K2 7000μm2 Resistor-Based Temperature Sensor with an Inaccuracy of ±0.35°C (3σ) in 65nm CMOS", IEEE International Solid-State Circuits Conference (ISSCC), pp. 322–323, Feb. 2018.

mINIATURIZED SENSOR PLATFORM

Rapid advances in semiconductor process scaling have enabled to realize miniaturized computing platforms implemented as the complete sensor systems. For internet-of-everything (IoE), since they can get much closer to sensing objects, the quality of the sensing signal will be greatly improved, and they will collect massive information in real life. Furthermore, the information can be used for AI applications such as feature extraction and classification. We focus on implementing the miniaturized sensor system including sensor interfaces, memory interfaces, microcontrollers, power management ICs, and clock management ICs.

- W. Choi, J. Angevare, I. Park, K. A. A. Makinwa, and Y. Chae, "A 0.9V 28MHz Dual-RC Frequency Reference with 5pJ/Cycle and ±200ppm Inaccuracy from -40°C to 85°C," IEEE International Solid-State Circuits Conference (ISSCC), pp. 434–435, Feb. 2021.

- W. Choi, T. Kim, J. Shim, H. Kim, G. Han, and Y. Chae, "A 1V 7.8mW 15.6Gb/s C-PHY Transceiver Using Tri-Level Signaling for Post-LPDDR4," IEEE International Solid-State Circuits Conference (ISSCC), pp. 402–403, Feb. 2017.

BIOMEDICAL Circuits and SYSTEMS

Recently, growing efforts have been put in exploring human brain for brain-machine interface. Medical instruments are inherently rigid and cause side effects while interfacing with flexible body. The aforementioned miniaturized sensor system has a strong benefit to reduce risk of human implantation. In particular, the neural interface can read out the output signals (either voltage or capacitance) of the microelectrodes due to ionic concentration changes generated by neuron activity. In order not to damage brain tissues and to precisely detect the neural signals, we focus on designing ultra-low-power interface circuits.

- W. Choi*, Y. Chen*, D. Kim*, S. Weaver, T. Schlotter, C. Livanelioglu, J. Liao, R. Incandela, P. Davami, G. Atzeni, S. Arjmandpour, S.-H Cho, and T. Jang, "A 1,024-Channel, 64-Interconnect, Capacitive Neural Interface Using a Cross-Coupled Microelectrode Array and 2-Dimensional Code-Division Multiplexing." IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2023.

- C. Livanelioglu*, W. Choi*, D. Kim, J. Liao, R. Incandela, G. Cristiano, and T. Jang, "A 0.0014 mm2, 1.18 TΩ Segmented Duty-Cycled Resistor Replacing Pseudo-Resistor for Neural Recording Interface Circuits," IEEE Symposium on VLSI Technology and Circuits (VLSI), pp. 62–63, June 2022.

- C. Lee, B. Kim, J. Kim, T. Jeon, W. Choi, S. Yang, J.-H. Ahn, J. Bae, and Y. Chae, "A Miniaturized Wireless Neural Implant with Body-Coupled Data Transmission and Power Delivery for Freely Behaving Animals," IEEE International Solid-State Circuits Conference (ISSCC), pp. 340–341, Feb. 2022.



Analog In-Memory Computing Systems

Recently, modern neural networks inside the AI processors have excessive memory usage. The problem is not only in storage capacity of the memory, but also processing and transmission, since it costs a lot of energy and latency. Consequently, data needs to be processed and moved from the memory to the processing unit. The in-memory computing (IMC) is an emerging paradigm. The memory is allocated with internal computing capabilities. It enables minimizing data transfer between processor and memory. Especially, the analog IMC system stands out as a potentially more energy-efficient and compact alternative than digital counterparts for internet-of-things (IoT) applications. In the hardware, the multiply-and-accumulation (MAC) operation of the whole dataset and the weights accounts for the most power- and time-consuming computations in the networks. The digital input drives the synaptic weights through the input driver or the digital-to-analog converter (DAC). Then, each multiplied output located at a single column is accumulated in analog domain, which is converted to the digital MAC result by the output converter or the analog front-end (AFE) and the analog-to-digital converter (ADC). Notably, the energy efficiency is enhanced through the design of energy efficient ADC and DAC in various ways.