Research Experience
Semiconductor Research Corporation (SRC) - JUMP 2.0: CHIMES
High Performance Computing for AI on Glass Interposer.
Monolithic 3D DRAM as a Replacement for HBM: Impacts on Signal Integrity and System Performance.
Samsung USA - Logic Path Finding Lab
Co-optimization between Backside Power Delivery Network and Backside Clock Routing for Advanced Technology.
Design Methodology for Backside Signal Routing.
Samsung Advanced Institute of Technology(SAIT) Project
Block-level design flow for 3nm Logic-on-Logic 3D IC with 1um hybrid bond pitch.
VAE-Assisted Optimizer for Architecting Mixed-Node, Mixed-Area 3D ICs
Undergraduate Research Internship
SOR Laboratory at Seoul National Univeristy
Hardware cost-aware Design Space Exploration for DNN Accelerator
VLSI Laboratory at Seoul National Univeristy
Binarization method for Graph Neural Network