IEEE MASS 2019

Monterey, CA, USA

November 4 - 7, 2019

Technical Program Committee

Kaigui Bian, Peking University, China
Wei Dong, Zhejiang University, China
Mauro Femminella, University of Perugia, Italy
Bin Guo, Northwestern Polytechnical University, USA
Zongpeng Li, University of Calgary, Canada
Yunhuai Liu, Peking University, China
Rongxing Lu, University of New Brunswick, Canada
Mohammad Hossein Manshaei, Florida International University, USA
Lu Su, State University of New York at Buffalo, USA
Jiliang Wang, Tsinghua University, China
Qian Wang, Wuhan University, China
Sheng Wei, University of Nebraska-Lincoln, USA
Liyao Xiang, Shanghai Jiao Tong University, China
Lei Xie, Nanjing University, China
Jia Xu, Nanjing University of Posts and Telecommunications, China
Dejun Yang, Colorado School of Mines, USA
Jie Yang, Florida State University, USA
Panlong Yang, University of Science and Technology of China, China
Zheng Yang, Tsinghua University, China
Yuan Zhang, Nanjing University, China
Hongzi Zhu, Shanghai Jiao Tong University, China
Roberto Beraldi, Sapienza Università di Roma, Italy
Zhili Chen, Anhui University, China
Yu Cheng, Illinois Institute of Technology, USA
Haipeng Dai, Nanjing University, China
Xavier Defago, Tokyo Institute of Technology, Japan
Laura Galluccio, University of Catania, Italy
Zhangyu Guan, University at Buffalo, USA
Qiang-Sheng Hua, Huazhong University of Science and Technology, China
Bo Ji, Temple University, USA
Donghyun Kim, Kennesaw State University, USA
Ajay Kshemkalyani, University of Illinois at Chicago, USA
Mingming Lu, Central South University, China
Neeraj Mittal, The University of Texas at Dallas, USA
Rik Sarkar, University of Edinburgh, United Kingdom
Haisheng Tan, University of Science and Technology of China, China
Changda Wang, Jiangsu University, China
Liangmin Wang, Jiangsu University, China
Kui Wu, University of Victoria, Canada
Hongwei Zhang, Iowa State University, USA
Sheng Zhang, Nanjing University, China
Jian Zhao, Nanjing University, China
Stefano Basagni, Northeastern University, USA
Bastian Bloessl, Trinity College Dublin, Ireland
Sunghyun Choi, Seoul National University, South Korea
Andres Garcia-Saavedra, NEC Labs Europe, Germany
Vlado Handziski, Technische Universität Berlin, Germany
Hongxin Hu, Clemson University, USA
Josep Jornet, University at Buffalo, USA
Ramanujan K Sheshadri, NEC Labs America, USA
Florian Klingler, Paderborn University, Germany
Zhenjiang Li, City University of Hong Kong, Hong Kong
Tommaso Melodia, Northeastern University, USA
Enrico Natalizio, University of Lorraine/Loria, France
Parth Pathak, George Mason University, USA
Paul Patras, The University of Edinburgh, United Kingdom
Ioannis Pefkianakis, Hewlett Packard Labs, USA
Olga Saukh, TU Graz / CSH Vienna, Austria
Selcuk Uluagac, Florida International University, USA
Li Xiao, Michigan State University, USA
Wenyao Xu, SUNY Buffalo, USA
Qing Yang, University of North Texas, USA
Yifan Zhang, SUNY Binghamton, USA
Torsten Braun, University of Bern, Switzerland
Mingzhe Chen, Beijing University of Posts and Telecommunications, China
Heming Cui, Hong Kong University, Hong Kong
Mingjie Feng, The University of Arizona, USA
Wei Gong, University of Science and Technology of China, China
Deke Guo, National University of Defense Technology, China
He Huang, Soochow University, China
Imad Jawhar, Al Maaref University, Lebanon
Gilsoo Lee, Virginia Tech, USA
Jia Liu, Nanjing University, China
Jiqiang Liu, Beijing Jiao Tong University, China
Ming Liu, University of Electronic Science and Technology of China, China
Yonghe Liu, The University of Texas at Arlington, USA
Xiang Lu, Chinese Academy of Sciences, China
Xiaoqiang Ma, Huazhong University of Science and Technology, China
Amy Murphy, Fondazione Bruno Kessler, Italy
Pouya Ostovari, Temple University, USA
Jianping Pan, University of Victoria, Canada
Danda Rawat, Howard University, USA
Shaolei Ren, University of California, Riverside, USA
Sumudu Samarakoon, University of Oulu, Finland
Ryan Shea, Simon Fraser University, Canada
Feng Wang, University of Mississippi, USA
Jianping Wang, City University of Hong Kong, Hong Kong
Xuyu Wang, California State University, USA
Yuexuan Wang, The University of Hong Kong, Hong Kong
Wei Wei, Xi'an University of of Technology, China
Qingjun Xiao, SouthEast University of China, China
Yu Xiao, Aalto University, Finland
Hongli Xu, University of Science and Technology of China, China
Yuedong Xu, Fudan University, China
Jiao Zhang, Beijing University of Posts and Telecommunications, China
Bo Zhou, Virginia Tech, USA
Yanmin Zhu, Shanghai Jiao Tong University, China
Bo Chen, Michigan Technological University, USA
Yingying Chen, Rutgers University, USA
Mauro Conti, University of Padua, Italy
Xinwen Fu, University of Central Florida, USA
Shouling Ji, Zhejiang University, China
Fengjun Li, University of Kansas, USA
Gang Li, Deakin University, Australia
Qi Li, Tsinghua University, China
Feng Lin, University of Colorado Denver, USA
Jingqiang Lin, Chinese Academy of Sciences, China
Lannan Luo, University of South Carolina, USA
Zhen Mo, VMware, USA
Daehun Nyang, Inha University, South Korea
Bo Sheng, University of Massachusetts Boston, USA
Chiu Tan, Temple University, USA
Cong Wang, City University of Hong Kong, Hong Kong
Weichao Wang, University of North Carolina at Charlotte, USA
Zhi Wang, Tsinghua University, China
Xuetao Wei, University of Cincinnati, USA
Qiben Yan, University of Nebraska-Lincoln, USA
Kan Yang, University of Memphis, USA
Meng Yu, Roosevelt University, USA
Qiang Zeng, University of South Carolina, USA
Fan Zhang, Zhejiang University, China
Fengwei Zhang, Wayne State University, USA
Yajin Zhou, Zhejiang University, China
Yian Zhou, Google Inc., USA
Qing Cao, University of Tennessee, USA
Renato de Moraes, Federal University of Pernambuco, Brazil
Wan Du, University of California, Merced, USA
Krishna C. Garikipati, Niantic Labs, USA
Mahanth Gowda, The Pennsylvania State University, USA
Jinsong Han, Zhejiang University, USA
Liang He, University of Colorado Denver, USA
Ruobing Jiang, Ocean University of China, China
Vana Kalogeraki, Athens University of Economics and Business, Greece
Abdelmajid Khelil, Landshut University of Applied Sciences, Germany
Hyung-Sin Kim, University of California, Berkeley, USA
Song Min Kim, KAIST, South Korea
Ravi Kokku, IBM Research, USA
Linghe Kong, Shanghai Jiao Tong University, China
Vinod Kulathumani, West Virginia University, USA
Branislav Kusy, Commonwealth Scientific and Industrial Research Organisation, Australia
Kai Li, ISEP/IPP, Portugal
Shan Lin, Stony Brook University, USA
Zhidan Liu, Shenzhen University, USA
Tony Luo, Institute for Infocomm Research, Singapore
Tamer Nadeem, Virginia Commonwealth University, USA
Shijia Pan, Carnegie Mellon University, USA
Christian Poellabauer, University of Notre Dame, USA
Francesco Restuccia, Northeastern University, USA
Abusayeed Saifullah, Wayne State University, USA
Sougata Sen, Dartmouth College, USA
Longfei Shangguan, Princeton University, USA
Yiran Shen, Commonwealth Scientific and Industrial Research Organisation, Australia
Mahima Agumbe Suresh, San Jose State University, USA
Rui Tan, Nanyang Technological University, Singapore
Kanchana Thilakarathna, The University of Sydney, Australia
Shuai Wang, Southeast University, China
Myounggyu Won, University of Memphis, USA
Hirozumi Yamaguchi, Osaka University, Japan
Lei Yang, The Hong Kong Polytechnic University, Hong Kong
Nairan Zhang, Facebook, Inc., USA
Wei Zhang, Texas A&M University, USA
Dong Zhao, Beijing University of Posts and Telecommunications, China
Yuanqing Zheng, The Hong Kong Polytechnic University, Hong Kong