IC Packaging Substrate (SUB) Market was valued at USD 4.5 Billion in 2022 and is projected to reach USD 8.2 Billion by 2030, growing at a CAGR of 8.0% from 2024 to 2030.
The IC Packaging Substrate (SUB) market has seen significant growth from 2018 to 2022, driven by advances in semiconductor packaging technology and the increasing demand for smaller, faster, and more energy-efficient electronic devices. This demand was primarily fueled by applications in consumer electronics, automotive, and telecommunications sectors. The market experienced a surge in demand for advanced packaging solutions like system-in-package (SiP), 3D ICs, and fan-out wafer-level packaging (FOWLP), which contributed to the rise in IC packaging substrates. Between 2018 and 2022, the market witnessed technological advancements and innovations, resulting in a notable shift toward high-performance materials and better substrate designs that were capable of meeting the needs of next-generation semiconductors.
Looking ahead, from 2023 to 2033, the outlook for the IC Packaging Substrate (SUB) market is poised for substantial growth. One of the major drivers of this growth will be the continued expansion of the 5G networks, automotive electronics, and artificial intelligence (AI) technologies. With 5G networks requiring faster data processing and enhanced communication speeds, the demand for high-performance IC substrates is expected to rise significantly. Additionally, as the automotive industry adopts more advanced electronics for autonomous driving and electric vehicles, the need for robust IC packaging solutions that can withstand harsh environmental conditions will further push market demand. The integration of AI and machine learning into consumer electronics and industrial applications is also anticipated to create a significant uptick in the demand for complex packaging solutions to support powerful processors and memory systems.
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Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC
By the year 2030, the scale for growth in the market research industry is reported to be above 120 billion which further indicates its projected compound annual growth rate (CAGR), of more than 5.8% from 2023 to 2030. There have also been disruptions in the industry due to advancements in machine learning, artificial intelligence and data analytics There is predictive analysis and real time information about consumers which such technologies provide to the companies enabling them to make better and precise decisions. The Asia-Pacific region is expected to be a key driver of growth, accounting for more than 35% of total revenue growth. In addition, new innovative techniques such as mobile surveys, social listening, and online panels, which emphasize speed, precision, and customization, are also transforming this particular sector.
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Growing demand for below applications around the world has had a direct impact on the growth of the Global IC Packaging Substrate (SUB) Market
Smart Phones
PC (Tablet
Laptop)
Wearable Devices
Others
Based on Types the Market is categorized into Below types that held the largest IC Packaging Substrate (SUB) market share In 2023.
Organic Substrate
Inorganic Substrate
Composite Substrate
Global (United States, Global and Mexico)
Europe (Germany, UK, France, Italy, Russia, Turkey, etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil, Argentina, Columbia, etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
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1. Introduction of the Global IC Packaging Substrate (SUB) Market
Overview of the Market
Scope of Report
Assumptions
2. Executive Summary
3. Research Methodology of Verified Market Reports
Data Mining
Validation
Primary Interviews
List of Data Sources
4. Global IC Packaging Substrate (SUB) Market Outlook
Overview
Market Dynamics
Drivers
Restraints
Opportunities
Porters Five Force Model
Value Chain Analysis
5. Global IC Packaging Substrate (SUB) Market, By Type
6. Global IC Packaging Substrate (SUB) Market, By Application
7. Global IC Packaging Substrate (SUB) Market, By Geography
Global
Europe
Asia Pacific
Rest of the World
8. Global IC Packaging Substrate (SUB) Market Competitive Landscape
Overview
Company Market Ranking
Key Development Strategies
9. Company Profiles
10. Appendix
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