Patents

Patents Filed in India:

Singh, Malkeet., Singh, Harpreet., Berndt, Charles Christopher., (2018) “A Technology and Process for Coating a Substrate with Swarf Particles,” Application No: 201811029355., Date of Filing: 03/August/2018. Request for Examination Filed: YES
Singh, Malkeet., Singh, Harpreet., Berndt, Charles Christopher., Sarkar, Prabir., (2019) “A Technology and Process for 3D Printing Using Swarf Particles,” Application No: 201923001267., Date of Filing: 10/January/2019. Request for Examination Filed: YES

Patent Filed in US:

1. Singh, Malkeet., Singh, Harpreet., Berndt, Charles Christopher., (2019) “A Technology and Process for Coating a Substrate with Swarf Particles,” US Patent Application No. 16/352,331., Date of Filing: 13/March/2019. Request for Examination Filed: YES

2. Singh, Malkeet., Singh, Harpreet., Berndt, Charles Christopher., Sarkar, Prabir., (2019) “A Technology and Process for 3D Printing Using Swarf Particles,” (Under processing)