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첨단 패키징 기계 해석 및 시뮬레이션 연구실에 오신 것을 환영합니다.
Welcome to Our Laboratory!
We create robust electronics for the future through advanced mechanical analysis and innovative material design.
Featured News
(Sep. 2026) Professor B. S. Ma received a 5-year NRF research grant (Title: AI-Based Framework for Simultaneous Prediction of Layout-Dependent Global Warpage-Local Fracture in Semiconductor Package)
(Jul. 2026) Our collaborative paper (w/KAIST APTF & PEEL Groups) was accepted in Chemistry of Materials.
(Apr. 2026) Professor B. S. Ma gave an oral presentation at ICEP-HBS 2026 (Hiroshima, Japan).
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