1. Micro/Nano-scale Material Processing
1. Micro/Nano-scale Material Processing
We are developing superhydrophobic surfaces by forming micro/nanostructures on metal surfaces through laser processing.
By enhancing both water resistance and heat transfer performance, we aim to create jumping condensation surfaces that significantly improve anti-flooding properties.
Ultimately, this research can be applied to the development of high-efficiency heat transfer condensers.
(In collaboration with Professor Youngsuk Nam’s research group at KAIST.)
We are enhancing thermal efficiency by creating microstructures on metal surfaces, specifically, DBC (Direct Bonded Copper) substrates, through laser processing to increase surface area.
AlN DBC substrates are specialized materials used in power modules and device manufacturing, where high thermal conductivity is critical. This process involves directly bonding copper to ceramic materials such as aluminum nitride (AlN), which provides exceptional heat dissipation performance. Due to its superior thermal management capabilities, AlN DBC substrates play a crucial role in modern high-power electronic systems.
To maximize thermal management efficiency, we are utilizing laser processing to fabricate microstructures on DBC substrates.
(In collaboration with Professor Youngsuk Nam’s research group at KAIST.)