Publications
2023
B. Kwon, F. Ejaz, N. Ohashi, L.K. Hwang, “Application of Machine Learning in Heat Transfer from Correlations to Design (tentative)," Advances in Heat Transfer (invited).
2022
T.-W. Huang, L. Hwang, “Task-Parallel Programming with Constrained Parallelism,” IEEE High Performance Extreme Computing.
F. Ejaz, L.K. Hwang, J. Son, J.S. Kim, D.S. Lee, B. Kwon, “Convolutional Neural Networks for Approximating Electrical and Thermal Conductivities of Cu-CNT Composites,” Scientific Reports.
2021
L. Hwang, S. Arikati, “Cell Overlap Violation Diagnostics using Machine Learning” (submitted nonprovisional patent application)
F. Ejaz, L.K. Hwang, B. Kwon, “Machine Learning Approach Towards Heat Transfer Correlations in Rough Cooling Channels,” ASME IMECE.
2020
M. Kang, L.K. Hwang, B. Kwon, “Machine Learning Flow Regime Classification in 3D Printed Tubes,” Physical Review Fluids, vol. 5, issue 8, pp. 081901.
F. Ejaz, L.K. Hwang, B. Kwon, “Heuristic Optimization of Ribbed Cooling Channels with Variable Length and Roughness,” Journal of Heat Transfer.
B. Kwon, F. Ejaz, L.K. Hwang, “Machine Learning for Heat Transfer Correlations,” International Communications on Heat and Mass Transfer, vol. 116, 104694.
M. Kang, L.K. Hwang, B. Kwon, “Computationally Efficient Optimization of Wavy Surface Roughness in Cooling Channel Using Simulated Annealing,” International Journal of Heat and Mass Transfer.
2019
L.K. Hwang, B. Kwon, M.D.F. Wong, “Optimization of Liquid Cooling Microchannel in 3D IC using Complete Converging and Diverging Channel Models,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM).
2018
L.K. Hwang, B. Kwon, M.D.F. Wong, “Accurate Models for Optimizing Tapered Microchannel Heat Sink in 3D ICs,” IEEE Computer Society Symposium on Very-Large-Scale Integration (ISVLSI).
2014
S.T.C. Konigsmark, L.K. Hwang, D. Chen, M.D.F. Wong, “System-of-PUFs: Multi-level Security for Embedded Systems,” International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS).
S.T.C. Konigsmark, L.K. Hwang, D. Chen, M.D.F. Wong, “CNPUF: A Carbon Nanotube-based Physically Unclonable Function for Secure Low-Energy Hardware Design,” Asia and South Pacific Design Automation Conference (ASP-DAC).
2012
L.K. Hwang, K.L. Lin, M.D.F. Wong, “Thermal Via Structural Design in Three-Dimensional Integrated Circuits,” International Symposium on Quality Electronic Design (ISQED).
2011
L.K. Hwang, M.D.F. Wong, “Thermal Via-Fin Design and Comparison on Various Structures for Enhanced Heat Dissipation in Three Dimensional ICs,” CRA-W/CDC Workshop on Diversity in Design Automation and Test (WD2AT).