Most up-to-date list of publications can be found on my Google Scholar.
2025
C. Bailey, L.K. Hwang, F. Praful, H. Liu, H. Lepp, “Optimizing Advanced Semiconductor Packaging through Multi-Physics Analysis”, Appl. Phys. Rev., (invited, in preparation)
H. Lepp, L.K. Hwang, "Energy-Efficient Wafer Defect Classification using Spiking Neural Networks," FURI poster.
2024
N. Ohashi, L.K. Hwang, B. Kwon, “Physics-Informed Neural Networks for Multi-Field Visualization with Single-Color Laser Induced Fluorescence,” AI Thermal Fluids, 2024.
N. Ohashi, N. Nguyen, L.K. Hwang, B. Kwon, “MSPINN: Multiple Scale Method Integrated Physics-Informed Neural Networks for Reconstructing Transient Natural Convection,” Phys. Fluids.
N. Ohashi, L.K. Hwang, B. Kwon, “Reconstructing Invisible Fluid Fields of a Transient Natural Convection System Using a Physics-Informed Neural Network,” ASME IMECE.
C. Bailey, L.K. Hwang, F. Praful, “Packaging Modeling and Analysis for Heterogeneous Integration,” ICCAD, Invited tutorial.
R. Leigh, L.K. Hwang, "Effects of Parameter Normalization on a Physics-Informed Neural Network," SURI poster.
L. Hwang, S. Arikati, “Cell Overlap Violation Diagnostics using Machine Learning”, U.S. Patent No. 12,008,303.
2023
B. Kwon, F. Ejaz, N. Ohashi, L.K. Hwang, “Application of Machine Learning in Heat Transfer from Correlations to Design," Advances in Heat Transfer.
2022
T.-W. Huang, L. Hwang, “Task-Parallel Programming with Constrained Parallelism,” HPEC.
F. Ejaz, L.K. Hwang, J. Son, J.S. Kim, D.S. Lee, B. Kwon, “Convolutional Neural Networks for Approximating Electrical and Thermal Conductivities of Cu-CNT Composites,” Sci. Rep.
2021
F. Ejaz, L.K. Hwang, B. Kwon, “Machine Learning Approach Towards Heat Transfer Correlations in Rough Cooling Channels,” ASME IMECE.
2020
M. Kang, L.K. Hwang, B. Kwon, “Machine Learning Flow Regime Classification in 3D Printed Tubes,” Phys. Rev. Fluids, vol. 5, issue 8, pp. 081901.
F. Ejaz, L.K. Hwang, B. Kwon, “Heuristic Optimization of Ribbed Cooling Channels with Variable Length and Roughness,” Int. J. Heat Mass Transf.
B. Kwon, F. Ejaz, L.K. Hwang, “Machine Learning for Heat Transfer Correlations,” ICHMT, vol. 116, 104694.
M. Kang, L.K. Hwang, B. Kwon, “Computationally Efficient Optimization of Wavy Surface Roughness in Cooling Channel Using Simulated Annealing,” Int. J. Heat Mass Transf.
2019
L.K. Hwang, B. Kwon, M.D.F. Wong, “Optimization of Liquid Cooling Microchannel in 3D IC using Complete Converging and Diverging Channel Models,” ITHERM.
2018
L.K. Hwang, B. Kwon, M.D.F. Wong, “Accurate Models for Optimizing Tapered Microchannel Heat Sink in 3D ICs,” ISVLSI.
2014
S.T.C. Konigsmark, L.K. Hwang, D. Chen, M.D.F. Wong, “System-of-PUFs: Multi-level Security for Embedded Systems,” CODES+ISSS.
S.T.C. Konigsmark, L.K. Hwang, D. Chen, M.D.F. Wong, “CNPUF: A Carbon Nanotube-based Physically Unclonable Function for Secure Low-Energy Hardware Design,” ASP-DAC.
2012
L.K. Hwang, K.L. Lin, M.D.F. Wong, “Thermal Via Structural Design in Three-Dimensional Integrated Circuits,” ISQED.
2011
L.K. Hwang, M.D.F. Wong, “Thermal Via-Fin Design and Comparison on Various Structures for Enhanced Heat Dissipation in Three Dimensional ICs,” CRA-W/CDC WD2AT poster.