FACILITIES

Fabrication and post-processing facilities

1. RF magnetron sputtering (with facility of co-deposition from two targets)

2. Multi-target sputtering and in-situ annealing system

3. Spin coater

4. Vacuum annealing furnace

Optoelectronic characterization facilities

1. UV-Vis-NIR spectrophotometer

2. Hall effect measurement system

3. Four point probe measurement system

4. STM/STS (attached module of SPM)

5. Conductive AFM (attached module of SPM)

6. EFM (attached module of SPM)

7. KPFM (attached module of SPM)

Microstructural characterization facilities (as a part of CIF)

1. Ambient Scanning Probe Microscope (SPM/AFM)

2. X-ray Diffractometer

3. FESEM and EDS

4. TEM

Upcoming facilities

1. FESEM with WDS

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