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Kuang-E Technology is equipped with
2 SMT lines, 3 DIP lines, and 4 box-build/ packaging lines.
Assembly Options
SMT (Surface Mount)
DIP/THT (Through-Hole)
Mixed Technology Single & Double Sided placement
PCB Size
Min Board Size: 50mm x 50mm
Max Board Size: 330mm x 250mm
Thickness: 0.4mm~3.0mm
Component Size
Chip 03015 & 01005 (0.4 x 0.2mm)
QFP 44mm, (BGA, QFN, and others)
Capability
SMT: 15K/ day
DIP: 3~5K/day (depends on product and needs)
Kuang-E Technology offers complete PCB (Printed Circuit Board ) assembly services under one roof, including parts sourcing, prototype PCBA proofing, SMT, DIP(THT), testing and packaging.
SMT Assembly
SMT Assembly
Two SMT (Surface Mount Technology) production lines are equipped with 3D SPI inspection machines and AOI inspection instruments to control production quality. The total production capacity can reach 624,000 Chips in a single day.
DIP Assembly
DIP Assembly
There are a total of 3 DIP (THT, Through Hole) production lines, using selective soldering machine, wave soldering machine, and providing lead-free auto insertion, manual repair welding services. It is also equipped with a constant temperature soldering iron and a dispenser.
Functional Testing
Functional Testing
Provide semi-finished product inspection and finished product functional test to ensure product quality. The inspection includes ICT testing, AOI inspection, and X-ray inspection.
Box-Build/ Packaging
Box-Build/ Packaging
Provide semi-finished products and finished product assembly, packaging and shipping services. Thanks to complete one-stop service, we can beter control the quality and lead time.
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