2023

[J60] A. Ashok, T.-K. Nguyen, M. Barton, M. Leitch, M.K. Masud, H. Park, T.A. Truong, Y.V. Kaneti, H.T. Ta, X. Li, K. Liang, T.N. Do, C.-H. Wang, N.-T. Nguyen, Y. Yamauchi, H.-P. Phan, Flexible Nanoarchitectonics for Biosensing and Physiological Monitoring Applications, Small, 2023. Accepted (IF: 15.15) 

2022

 [J59] T.-K. Nguyen, M. Barton, A. Ashok, T.-A. Truong, S. Yadav, M. Leitch, T.-V. Nguyen, N. Kashaninejad, T. Dinh, L. Hold, Y. Yamauchi, N.-T. Nguyen, H.-P. Phan, Wide bandgap semiconductor nanomembranes as a long-term bio-interface for flexible, implanted neuromodulator, Proceedings of the National Academy of Sciences USA (PNAS), 119(33), e2203287119, 2022.  [Link] (IF: 12.779)

[J58] Tong, B., T.-H. Nguyen, H.-Q. Nguyen, T.-K. Nguyen, et al., Highly sensitive and robust 3C-SiC/Si pressure sensor with stress amplification structure. Materials & Design, 2022. 224.  [Link] (IF: 12.779)

[J57] T.-K. Nguyen, S. Yadav, T.-A. Truong, M. Han, M.J. Barton, M. Leitch, P. Guzman, T. Dinh, A. Ashok, H. Vu, T.V. Dau, D. Haasmann, L. Chen, Y. Park, T.N. Do, Y. Yamauchi, J.A. Rogers, N.-T. Nguyen, H.-P. Phan, Integrated, transparent silicon carbide electronics and sensors for radio-frequency biomedical therapy, ACS Nano, 16(7), 10890–10903, 2022. [Link] (IF: 18.027)

[J56] T.-H. Vu, H. Nguyen, J. Fastier-Wooller, C.-D. Tran, T.-H. Nguyen, H.-Q. Nguyen, T. Nguyen, T.-K. Nguyen, T. Dinh, T. Bui, Y. L. Zhong, H.-P. Phan, N.-T. Nguyen, D. Dao, V. Dau, Enhanced electrohydrodynamics for electrospinning highly sensitive flexible fibre-based piezoelectric sensor, ACS Applied Electronic Materials, 4(3), 1301–1310. [Link] (IF: 3.314)

[J55] T.-A. Truong, T.-K. Nguyen, H. Zhao, K. Nguyen, T. Dinh, Y. Park, T. Nguyen, Y. Yamauchi, N.-T. Nguyen, and H. P. Phan*, Engineering stress in thin films: An innovative pathway towards three-dimensional micro and nanosystems, Small, 18(4), 202105748, 2022. (IF: 13.3) [Link] Back Cover [pdf]

2021

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[J54] T. Nguyen, T. Dinh, V. Dau, A. R. Md Foisal, P. Guzman, H. Nguyen, T. A. Pham, T.-K. Nguyen, H.-P. Phan, N.-T. Nguyen, D. Dao, Piezoresistive Effect with a Gauge Factor of 18,000 in semiconductor heterojunction Modulated by Bonded Light Emitting Diodes, ACS Applied Materials & Interfaces, 13(29), 35046-35053, 2021. (IF: 9.23)

[J53] H.-Q. Nguyen, T. Nguyen, P. Tanner, T.-K. Nguyen, A.R. Md Foisal J. Fastier-Wooller, T.-H. Nguyen, H.-P. Phan, N.-T. Nguyen, D.V. Dao, Piezotronic effect in a normally-off p-GaN/AlGaN/GaN HEMT towards highly sensitive pressure sensor, Applied Physics Letters, 118, 242104. (IF: 3.597) [Link]

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[J52] N.-K. Nguyen, T. Nguyen, T.-K. Nguyen, S. Yadav, T. Dinh, M.K. Masud, P. Singha, T.N. Do, M.J. Barton, H. Ta, N. Kashaninejad, C.H. Ooi, N.-T. Nguyen, H.-P. Phan. Wide-band-gap semiconductors for biointegrated electronics: recent advances and future directions, ACS Applied Electronics Materials, 3, 5, 1959-1981, 2021. (Cover page) [Link]

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[J51] V. T. Dau, T.T. Bui, C.-D. Tran, T.V. Nguyen, T.-K. Nguyen, T. Dinh, H.-P. Phan, D. Wibowo, B. Rehm, H.T. Ta, N.-T. Nguyen, D.V. Dao, In-Air Particle Generation by On-Chip Electrohydrodynamics, Lab on a Chip, 21, 1779-1787, 2021. (IF: 6.774) [Link]

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[J50] V.T. Dau, H. Vu, C.-D. Tran, T. Nguyen, T.-K. Nguyen, T. Dinh, H.-P. Phan, K. Shimizu, N.-T. Nguyen, D.V. Dao, Electrospray propelled by ionic wind in a bipolar system for direct delivery of charge reduced nanoparticles, Applied Physics Express, 14, 055001,2021 (IF: 3.086) [Link]

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[J49] Z. Wan, S. Wang, B. Haylock, Z. Wu, T.-K. Nguyen, H.-P. Phan, R. Sang, N.-T. Nguyen, D. Thiel, S. Koulakov, Y. Gao, M. Lobino, Q. Li, Localized Surface Plasmon Enhanced Laser Reduction of Graphene Oxide for Wearable Strain Sensor, Advanced Materials Technologies, 6, 2001191, 2021. (IF: 5.969) [Link]

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[J48] T. Nguyen, T. Dinh, V. T. Dau, C.-D. Tran, H.-P. Phan, T.-K. Nguyen, H. K. Nguyen, A.R. Md Foisal, P.G. Duran, N.-T. Nguyen, and D. V. Dao, A wearable, bending-insensitive respiration sensor using highly oriented carbon nanotube film, IEEE Sensors, 21(6), 7308, 2021. (IF: 3.076) [Link]

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[J47] T.A. Pham, L. Hold, A. lacopi, T.-K. Nguyen, H.H. Cheng, T. Dinh, D.V. Dao, H.T. Ta, N.-T. Nguyen, H.-P. Phan*, Wet oxidation of 3C-SiC on Si for MEMS processing and use in harsh environments: Effects of the film thicknesses, crystalline orientations, and growth temperatures, Sensors & Actuators A: Physics, 317, 112474, 2021. (IF: 2.904) [Link]​​

2020

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​[J46] C.-D. Tran, H.P. Pham, T. X. Dinh, T.-K. Nguyen, H.-P. Phan, T. Dinh, T. Nguyen, T.T. Bui, D.T. Chu, N.-T. Nguyen, D.V. Dao, V.T. Dau, A new structure of Tesla coupled nozzle in synthetic jet micro-pump, Sensors Actuators. A, 315, 112296, 2020. (IF: 2.904) [Link]

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[J45] T.-A. Pham, T.-K. Nguyen, R.K. Vadivelu, T. Dinh, A. Qamar, S. Yadav, Y. Yamauchi, J.A. Rogers, N.-T. Nguyen, H.-P. Phan*, A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics, Advanced Functional Materials, 30(43), 2004655, 2020. (IF: 16.836) [Link] Cover [Link]

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[J44] T. Nguyen, T. Dinh, H.-P. Phan, V.T. Dau, T.-K. Nguyen, A.P. Joy, B. Bahreyni, A. Qamar, M. Rais-Zadeh, D.G. Senesky, N.-T. Nguyen, D.V. Dao, Self-Powered Monolithic Accelerometer Using Photonic Gate, Nano Energy, 76, 104950, 2020. (IF: 16.602) [Link]

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[J43] T. Dinh, T. Nguyen, A.R. Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and D. Dao, Optothermotronic effect as an ultrasensitive thermal sensing technology for solid-state electronics, Science Advances, 6(22), eaay2671, 2020. (IF: 12.804) [Link]

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[J42] H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Qamar, T. Nguyen, V.T. Dau, J.S. Han, D.V. Dao, N.T. Nguyen, High temperature silicon-carbide-based flexible electronics for monitoring hazardous environments, Journal of Hazardous Materials, 394, 122486, 2020. (IF: 9.038) [Link]

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[J41] T. Nguyen, T. Dinh, H.-P. Phan, A.R.Md Foisal, T.-K. Nguyen, N.-T. Nguyen, D.V. Dao, Opto-electronic coupling in semiconductors: towards ultrasensitive pressure sensing, Journal of  Material Chemistry C, 8, 4713, 2020. (IF:6.641) [Link] Back cover. 

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[J40] T.-K. Nguyen, H.-P. Phan, K.M. Dowling, A. S. Yalamarthy, T. Dinh, V. Balakrishnan, T. Liu, C.A. Chapin, Q.-D. Truong, V.T. Dau, K.E. Goodson, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Lithography and etching-free microfabrication of silicon carbide on insulator using direct UV laser ablation, Advanced Engineering Materials, 22(4), 1901173, 2020. (IF: 2.319) [Link]

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[J39] T. Dinh, T. Nguyen, H.-P. Phan, T.-K. Nguyen, V. Dau, N.-T. Nguyen, D. V. Dao, Advances in rational designs and materials of high-performance stretchable electromechanical sensors, Small, 16(14)1905707, 2020. (IF: 10.856) [Link]​

2019

[J38] H.-P. Phan, Y. Zhong, T.-K. Nguyen, Y. Park, T. Dinh, E. Song, R.K. Vadivelu, M. K. Masud, J. Li, M.J.A. Shiddiky, D.V. Dao, Y. Yamauchi, J. A. Rogers, and N.-T. Nguyen, Long-lived, transferred crystalline silicon carbide nanomembranes for implantable flexible electronics, ACS Nano, 13, 10, 11572-11581, 2019 (IF: 13.903) [Link] Cited by [Nature Materials] and [Cell] 

[J37] V.-T. Nguyen, T. Dinh, A.R. Md Foisal, H.-P. Phan, T.-K. Nguyen, N.-T. Nguyen, and V.D. Dao, Giant piezoresistive effect by optoelectronic coupling in a heterojunction, Nature Communications, 10, 4139, 2019. (IF: 11.878) [Link]

[J36]   H.-P. Phan, M.K. Masud, R.K. Vadivelu, T. Dinh, T.-K. Nguyen, K. Ngo, D.V. Dao, M.J.A. Shiddiky, M.S.A. Hossain, Y. Yamauchi and N.-T. Nguyen, Transparent crystalline cubic SiC-on-glass electrodes enable simultaneous electrochemistry and optical microscopy, Chemical Communications, 2019, 55, 7978 - 7981. (IF: 6.290) (* H.-P. Phan and M.K. Masud contributed equally to this work) [Link]

[J35]   T. Dinh, V. Dau, C.-D. Tran, T.-K. Nguyen, H.-P. Phan, N.-T. Nguyen and D. V. Dao, Polyacrylonitrile-carbon nanotube-polyacrylonitrile: a versatile robust platform for flexible multifunctional electronic devices in medical applications, Macromolecular Material Engineering, 190014, 2019. (IF: 2.690) [Link]

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[J34] A.R. Md. Foisal, T. Dinh, V.-T. Nguyen, P. tanner, H.-P. Phan, T.-K. Nguyen, B. Haylock, E. Etreed, M. Lobino, and D. V. Dao, Self-powered broadband (UV-NIR) photodetector based on 3C-SiC/Si heterojunction, IEEE Transaction on Electron Device, 66(4), 1804-1809, 2019. (IF: 2.605) [Link]

[J33] H.-P. Phan, T. Dinh, T.-K. Nguyen, T. Dinh, A. Qamar, A. Iacopi, J. Lu, D.V. Dao, M. Rais-Zadeh, and N.-T. Nguyen, Wireless battery-free SiC sensors operating in harsh environments using resonant inductive coupling, IEEE Electron Device Letter, 40(4), 609-612, 2019. [Link] (IF: 3.753)  

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[J32] H. Q. Nguyen, H. A. Moghadam, T. Dinh, H.-P. Phan, T.-K. Nguyen, J. Han, N.-T. Nguyen, and D.V. Dao, Dependence of offset voltage in AlGaN/GaN van der Pauw devices under mechanical strain, Material Letter, 244(1), 66-69, 2019. [Link] (IF: 2.687)  

[J31] V. Balakrishnan, T. Dinh, T. Nguyen, H.-P. Phan, T.-K. Nguyen, D. V. Dao and N.-T. Nguyen, A hot-film air flow sensor for elevated temperatures, Review Scientific Instrument, 90, 015007, 2019. [Link] (IF: 1.428)  

[J30] T. Dinh, T.-K. Nguyen, H.-P. Phan, Q. Nguyen, J. Han, S. Dimitrijev, N.-T. Nguyen, D. V. Dao, Thermoresistance of p‐Type 4H–SiC Integrated MEMS Devices for High‐Temperature Sensing, Advanced Engineering Materials, 21(3), 1801049, 2019. [Link]   (IF: 2.319)

2018

[J29] H.-P. Phan, K.M. Dowling, T.-K. Nguyen, C.A. Chapin, T. Dinh, R.A. Miller, J. Han, A. Iacopi, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures, RSC Advances, 8, 29976-29979, 2018. (IF: 2.936) [Link]

[J28] T.-K. Nguyen, H.-P. Phan, T. Dinh, A.R. Md Foisal, N.-T. Nguyen, and D.V. Dao, High-temperature tolerance of piezoresistive effect in p-4H-SiC for harsh environment sensing, Journal of Material Chemistry C, 6, 8613-8617, 2018. (IF: 5.976) [Link]

[J27] T. Dinh*, H.-P. Phan*, N. Kashaninejad, T.-K. Nguyen, D.V. Dao, and N.-T. Nguyen, An on-chip SiC MEMS device with integrated heating, sensing and microfluidic cooling systems, Advanced Materials Interfaces, 5, 1800764, 2018. (IF: 4.834) (* H.-P. Phan and T. Dinh contributed equally to this work) [Link] 

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[J26] T.-K. Nguyen, H.-P. Phan, T. Dinh, K.M. Dowling, A.R. Md Foisal, D.G. Senesky, N.-T. Nguyen, and D.V. Dao, Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures, Material & Design, 156, 441-445, 2018. (IF: 4.525) [Link]

[J25] H.-P. Phan, T.-K. Nguyen, T. Dinh, H.H. Cheng, F. Mu, A. Iacopi, L. Hold, T. Suga, D.V. Dao, D.G. Senesky, and N.-T. Nguyen, Strain effect in highly doped n-type 3C-SiC-on-glass substrate for mechanical sensors and mobility enhancement, Physical Status Solidi A., 215(24), 1800288, 2018. (IF: 1.795) [Link] Front Cover [Link]

[J24] A.R. Md. Foisal, T. Dinh, P. tanner, H.-P. Phan, T.-K. Nguyen, E. Streed, D. V. Dao, Photoresponse of a highly-rectifying 3C-SiC/Si heterostructure under UV and visible illumination, IEEE Electron Device Letter, 39, 1219-1222, 2018. (IF: 3.048) [Link]

[J23] T.-K. Nguyen, H.-P. Phan, T. Dinh, T. Toriyama, K. Nakamura, R.A. Md Foisal, N.-T. Nguyen, D.V. Dao, Isotropic piezoresistance of p-type 4H-SiC in (0001) plane, Applied Physics Letters, 113, 012104, 2018. (IF: 3.411) [Link]

[J22]   H.-P. Phan, Karen M. Dowling, T.-K. Nguyen, T. Dinh, D.G. Senesky, T. Namazu, D.V. Dao, and N.-T. Nguyen, Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure, Material & Design, 15, 16-21, 2018. (IF: 4.525) [Link]

[J21] A.R. Md. Foisal, H.-P. Phan, T. Dinh, T.-K. Nguyen, N.-T. Nguyen, and D.V. Dao, "A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding", RSC Advances, 8, 15310-15314, 2018. (IF: 3.048) [Link]

[J20] T. Dinh, H.-P. Phan, T.-K. Nguyen, V. Balakrishnan, H. Cheng, L. Hold, I. Iacopi, N.-T. Nguyen, and D.V. Dao, "Unintentionally doped epitaxial 3C-SiC(111) nanothin film as material for highly sensitive thermal sensors at high temperatures", IEEE Electron Device Letter, 39(4), 580-583, 2018. (IF: 3.048) [Link]

[J19] T. Dinh, T.-K. Nguyen, H.-P. Phan, F.-W. Jarred, C. D. Tran, N.-T. Nguyen, and D.V. Dao, "Electrical resistance of carbon nanotube yarns under compressive transverse pressure", IEEE Electron Device Letter, 39(4), 584-587, 2018. (IF: 3.048) [Link]

[J18] T.-K. Nguyen, H.-P. Phan, J, Han, T. Dinh, A. R. M. Foisal, S. Dimitrijev, Y. Zhu, N.-T. Nguyen, and D.V. Dao, "Highly sensitive p-type 4H-SiC Van der Pauw sensor", RSC Advances, 8, 3009-3013, 2018. (IF: 3.108) [Link]

[J17] H.-P. Phan, T.-K. Nguyen, T. Dinh, A. Iacopi, L. Hold, M. J. A. Shiddiky, D. V. Dao, and N.-T. Nguyen, "Robust free-standing nano-thin SiC membranes enable direct photolithography for MEMS sensing applications", Advanced Engineering Materials, 20, 1700858, 2018. [Link] (IF: 2.319) Back cover 

2017

[J16] T.-K. Nguyen, H.-P. Phan, H. Kamble, R. Vadivelu, T. Dinh, A. Iacopi, G. Walker, L. Hold, N.-T. Nguyen, D.V. Dao, "Ultra-thin single crystalline SiC membrane as a versatile platform for biological applications", ACS Applied Materials & Interfaces, 9 (48), 41641- 41647, 2017. (IF: 7.504) [Link]

[J15] A.R. Md Foisal, A. Qamar, H.-P. Phan, T. Dinh, T.-K., Nguyen, P. Tanner, E. Streed, D.V. Dao, "Pushing the limits of piezoresistive effect by opto-mechanical coupling in 3C-SiC/Si heterostructure", ACS Applied Materials & Interfaces, 9 (46), 39921 - 39925, 2017. (IF: 7.504) [Link]

[J14] H.-P. Phan, H.H. Cheng, T. Dinh,  B. Wood, T.-K. Nguyen, F. Mu, H. Kamble, R. Vadivelu, G. Walker, L. Hold, A. Iacopi, B. Haylock, D.V. Dao, M. Lobino, T. Suga, and N.-T. Nguyen, "Single crystalline 3C-SiC anodically bonded onto glass: an excellent platform for high temperature electronics and bio applications," ACS Applied Materials & Interfaces, 9 (33), pp. 27365–27371, 2017. (IF: 7.504) [Link]

[J13] T.-K. Nguyen, T. Dinh, H.-P. Phan, C.D. Tran, A. R. Md. Foisal, Y. Zhu, and D.V. Dao, "Electrically Stable Carbon Nanotube Yarn Under Tensile Strain," IEEE Electron Device Letter, vol. 38, no. 9, pp. 1331 - 1334, 2017. (IF: 3.032) [Link]

[J12] T.-K. Nguyen, H.-P. Phan, T. Dinh, J. Han, S. Dimitrijev, P. Tanner, A. R. Md Foisal, Y. Zhu, N.-T. Nguyen, and D.V. Dao,"Experimental Investigation of Piezoresistive Effect in p-type 4H-SiC", IEEE Electron Device Letter, 38(7), 955-958, 4/2017 (IF 3.048) [Link]

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[J11] T. Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, P. Woodfield, Y. Zhu, N.-T. Nguyen, and D.V. Dao, "Solvent-Free Fabrication of Biodegradable Hot-Film Flow Sensor for Noninvasive Respiratory Monitoring", Journal of Physics D: Applied Physics, 50 (21), 215401, 2017 (IF 2.772) [Link]

[J10] H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Vatani, A. R. Md Foisal, A. Qamar, A. R. Kermany, D. V. Dao, N.-T. Nguyen, Self-sensing paper-based actuators employing ferromagnetic nanoparticles and graphite, Applied Physics Letters, 110, 144101, 2017. [2016 IF: 3.411] [Link] 

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[J9] H.-P. Phan, G. Ina, T. Dinh, T. Kozeki, T.-K. Nguyen, T. Namazu, A. Qamar, D. V. Dao, and N.-T. Nguyen, Formation of silicon carbide nanowire on insulator through direct wet oxidation, Material Letter, 196, 280-283, 2017. [2016 IF: 2.572] [Link]

2016

[J8] H.-P. Phan, T.-K. Nguyen, T. Dinh, G. Ina, A. R. Kermany, A. Qamar, J. Han, T. Namazu, R. Maeda, D. V. Dao, and N.-T. Nguyen, Ultra-high strain in epitaxial silicon carbide nanostructures utilizing residual stress amplification, Applied Physics Letters., 110, 141906, 2017. [2016 IF: 3.411] [pdf] [Link] (Selected as the Editor's pick in Vol. 110)

[J7] T. Dinh, H.-P. Phan, T.-K. Nguyen, A. Qamar, A. R. M. Foisal, N. V. Thanh, C.-D. Tran, Y. Zhu, N.-T. Nguyen and D. V. Dao, Environment-friendly carbon nanotube based flexible electronics for noninvasive and wearable healthcare, Journal of Material Chemistry C, 4, 10061-10068, 2016.  [2016 IF: 5.256] [pdf] [Link]

[J6] H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen and D. V. Dao, Nano strain-amplifier: making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects, Applied Physics Letters, 109, p. 123502, 2016. [2016 IF: 3.411] [pdf] [Link]  (Selected to the Editor's pick in Vol. 109, no. 13)

[J5] A. R. M. Foisal, H.-P. Phan, T. Kozeki, T. Dinh, T.-K. Nguyen, A. Qamar, M. Lobino, T. Namazu, and D. V. Dao, "3C-SiC on glass: an ideal platform for temperature sensors under visible light illumination,'' RSC Advances, 6 (90), 87124-87127, 2016.  [2016 Impact Factor: 3.29] [pdf] [Link]

[J4] F.-W. Jarred, H.-P. Phan, T. Dinh, T.-K. Nguyen, A. Cameron, A. Ochsner, and D. V. Dao, Novel low-cost sensor for human bite force measurement, Sensors Journal, vol. 16, no. 8, pp. 1244 (1-10), 2016.  [2015 Impact Factor: 2.033] [Link]

[J3] H.-P. Phan, T. Dinh, T. Kozeki, T.-K. Nguyen, A. Qamar, T. Namazu, N.-T. Nguyen, and D. V. Dao, The piezoresistive effect in top-down fabricated p-type 3C-SiC nanowires, IEEE Electron Device Letters, vol. 37, no.8, pp. 1029-1302, 2016  [2015 Impact Factor: 2.75] [pdf] [Link]

2015

[J2] P. H. Pham, T.-K. Nguyen, L. B. Dang, “Design and performance of a high loading electrostatic micro linear motor," Microsystem Technologies, 2015, 21(11), pp. 2469-2474. (IF: 1.195) [Link]

[J1] P. H. Pham, T. K. Dinh, L. B. Dang, T.-K. Nguyen, D. Dao, “Micro cam system driven by electrostatic comb-drive actuators based on SOI-MEMS technology," Microsystem Technologies, 2015, 21(3), pp. 699-706. (IF: 1.195) [Link]