Schematic of fabricated experimental test facility 

(a) Schematic illustration of DIW, Tracks on (b) polyimide substrate (c) stiff silicone wafer, (d) SEM imaging of printed track. 

(a) Track discontinuity on silicone substrate after bending (b) Apparatus of four-point probe test (c) Porosity on track (d) Conductivity vs temperature graph of the printed sample.