1. J. Jeong* and L. Tsang, "Wave scattering by metasurfaces using the fast hybrid method," Opt. Express 33, 37868-37881 (2025)
2. J. Jeong*, L. Tsang, M. Kurum, A. Colliander, Simon Yueh, et al., “Full-wave simulations of forest at L-band with Fast Hybrid Multiple Scattering Theory Method and comparison with GNSS signals,” IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing, vol. 18, pp. 5395-5405, 2025, doi: 10.1109/JSTARS.2025.3533313.
3. J. Jeong*, L. Tsang, A. Colliander, and S. Yueh, “Full-wave electromagnetic simulations of forests at L-band by using Fast Hybrid Method,” Progress In Electromagnetics Research, vol. 178, 111-127, 2023. doi:10.2528/PIER23082204.
4. J. Jeong*, L. Tsang, X. Xu, S. H. Yueh and S. A. Margulis, “Full-Wave Electromagnetic Model Simulations of P-Band Radio Signal Propagation Through Forest Using the Fast Hybrid Method,” in IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing, vol. 16, pp. 6711-6722, 2023, doi: 10.1109/JSTARS.2023.3292324.
5. J. Jeong*, L. Tsang, W. Gu, A. Colliander and S. H. Yueh, “Wave Propagation in Vegetation Field by Combining Fast Multiple Scattering Theory and Numerical Electromagnetics in a Hybrid Method,” in IEEE Transactions on Antennas and Propagation, vol. 71, no. 4, pp. 3598-3610, April 2023.
6. J. Jeong, J. Kim, N.-W. Kang, K. J. Han*, “High-frequency testing of vertical interconnection array using indirect contact probing method with an improved calibration,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 6, no. 11, pp. 1638-1647, Nov. 2016.
7. J. Jeong, J. Kim, N.-W. Kang, K. J. Han*, “Indirect contact probing method for characterizing vertical interconnections in electronic packaging,” IEEE Microwave and Wireless Components Letters, vol. 25, no. 1, pp. 70-72, Jan. 2015.
8. K. J. Han*, M. Swaminathan, J. Jeong, “Modeling of through-silicon via (TSV) interposer considering depletion capacitance and substrate layer thickness effects,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 5, no. 1, pp. 108-118, Jan. 2015. (IEEE TCPMT Best Paper Award)