Embedded Files
Patterned Electrical Brain Stimulation by a Wireless Network of Implantable Microdevices
Lee, A. H.*, Lee, J.*, Leung, V., Larson, L., & Nurmikko, A. (2024).
Nature Communications.
An asynchronous wireless network for capturing event-driven data from large populations of autonomous sensors
Lee, J.*, Lee, A. H.*, Leung, V., Laiwalla, F., Lopez-Gordo, M. A., Larson, L., & Nurmikko, A. (2024).
Nature Electronics, 7(4), 313-324
https://doi.org/10.1038/s41928-024-01134-y
Versatile On‐Chip Programming of Circuit Hardware for Wearable and Implantable Biomedical Microdevices
Lee, A. H.*, Lee, J.*, Leung, V., & Nurmikko, A. (2023).
Advanced Science, 10(36), 2306111.
https://doi.org/10.1002/advs.202306111
Neural recording and stimulation using wireless networks of microimplants
Lee, J., Leung, V., Lee, A. H., Huang, J., Asbeck, P., Mercier, P. P., … & Nurmikko, A. (2021).
Nature Electronics, 4(8), 604-614.2306111. https://doi.org/10.1038/s41928-021-00631-8
Wireless addressable cortical microstimulators powered by near-infrared harvesting
Lee, A. H.*, Lee, J.*, Jang, J., Nurmikko, A., & Song, Y. K. (2021).
ACS sensors, 6(7), 2728-2737. https://doi.org/10.1021/acssensors.1c00813
Decoding speech from spike-based neural population recordings in secondary auditory cortex of non-human primates
Heelan, C.*, Lee, J.*, O’Shea, R., Lynch, L., Brandman, D. M., Truccolo, W., & Nurmikko, A. V. (2019).
Communications biology, 2(1), 466.
https://doi.org/10.1038/s42003-019-0707-9
A scalable and low stress post-CMOS processing technique for implantable microsensors
A. H. Lee, J. Lee, F. Laiwalla, V. Leung, J. Huang, A. Nurmikko, and Y. K. Song
Micromachines, 11(10), pp. 925, 2020.
A 0.01-mm2 mostly digital capacitor-less AFE for distributed autonomous neural sensor nodes
J. Huang, F. Laiwalla, J. Lee, L. Cui, V. Leung, A. Nurmikko, and P. P. Mercier
IEEE Solid-State Circuits Letters, 1(7), pp. 162-165, 2019.
Conformal hermetic sealing of wireless microelectronic implantable chiplets by multilayered atomic layer deposition (ALD)
J. Jeong, F. Laiwalla, J. Lee, R. Ritasalo, M. Pudas, L. Larson, V. Leung, and A. Nurmikko
Advanced Functional Materials, 29(5), 1806440, 2018.
Conference Proceedings
Conference Proceedings
A.-H. Lee*, J. Lee*, V. Leung, S. Cash, and A. Nurmikko, “Minimally invasive subdermal wireless EEG sensor arrays for home monitoring of epilepsy”, IEEE Biomedical Circuits and Systems Conference pp. 1-5, IEEE, 2023. (Co-first author)
J. Lee*, A.-H. Lee*, V. Leung, … and A. Nurmikko, “Asynchronous wireless network for transmission of neural data from thousands of autonomous microimplants”, IEEE Biomedical Circuits and Systems Conference, pp. 1-5,IEEE, 2023. (Co-first author)
V. Leung, A.-H. Lee, J. Lee, S. Alluri, … and A. Nurmikko, “Improving wireless power transfer efficiency for distributed brain implants using auto-tune OVP”, IEEE Biomedical Circuits and Systems Conference, pp. 1-5,IEEE, 2023. (Coauthor)
A. H. Lee*, J. Lee*, K. Choquette, Y. K. Song, and A. Nurmikko, “A distributed ensemble of wireless intracortical microdevices for charge-balanced photovoltaic current stimulation”, In The 10th International IEEE EMBS Conference on Neural Engineering (NER), pp. 613-616, IEEE, 2021. (Co-first author, Number of citations: 3)
F. Laiwalla*, J. Lee*, A. H. Lee, E. Mok, V. Leung, S. Shellhammer, … and A. Nurmikko, “A distributed wireless network of implantable sub-mm cortical microstimulators for brain-computer interfaces”, In 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), pp. 6876-6879, IEEE, 2019. (Co-first author, Number of citations: 28)
J. Lee, E. Mok, J. Huang, L. Cui, A. H. Lee, V. Leung, P. Mercier, S. Shellhammer, L. Larson, P. Asbeck, R. Rao, Y. K. Song, A. Nurmikko, and F. Laiwalla, “An implantable wireless network of distributed microscale sensors for neural applications”, In The 9th International IEEE EMBS Conference on Neural Engineering (NER), pp. 871-874, IEEE, 2019. (First author, Number of citations: 54)
V. W. Leung, L. Cui, S. Alluri, J. Lee, J. Huang, E. Mok, … and F. Laiwalla, “Distributed microscale brain implants with wireless power transfer and Mbps bi-directional networked communications”, In 2019 IEEE Custom Integrated Circuits Conference (CICC), pp. 1-4, IEEE, 2019. (Coauthor, Number of citations: 21)
H. Cai, M. Lokhandwala, J. Zhu, C. Kilfoyle, J. Lee, L. Larson, … and V. W. Leung, “A software-defined radio for wireless brain implants network”, In Proceedings of the 24th Annual International Conference on Mobile Computing and Networking, pp. 852-854, 2018. (Coauthor, Number of citations: 5)
J. Lee, and A. V. Nurmikko, “Multi-coil high efficiency wireless charger system for hermetically sealed biomedical implants”, In 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS), pp. 1-4, IEEE, 2018. (First author, Number of citations: 1)
J. Lee, F. Laiwalla, J. Jeong, C. Kilfoyle, L. Larson, V. W. Leung, and A. Nurmikko, “Wireless power and data link for ensembles of sub-mm scale implantable sensors near 1GHz”, In 2018 IEEE Biomedical Circuits and Systems Conference (BioCAS), pp. 1-4, IEEE, 2018. (First author, Number of citations: 36)
V. W. Leung, J. Lee, S. Li, S. Yu, C. Kilfovle, L. Larson, A. Nurmikko and F. Laiwalla, “A CMOS distributed sensor system for high-density wireless neural implants for brain-machine interfaces”, In ESSCIRC 2018-IEEE 44th European Solid-State Circuits Conference (ESSCIRC), pp. 230-233, IEEE, 2018. (Coauthor, Number of citations: 47)
Y. K. Song, J. Lee, J. Jang, C. E. Lee, and A. H. Lee, “A neural recording microimplants with wireless data and energy transfer link”, In 2018 6th International Conference on Brain-Computer Interface (BCI), pp. 1-5, IEEE, 2018. (Coauthor, Number of citations: 1)
Page updated
Google Sites
Report abuse