In-Situ Multi-Functional Magnetron Sputtering System
Metal Sputter System (Face-to-Face Type)6 DC/RF Sputtering Ion Source (2 inch) + 1 Heater (< 700 oC) Wedge-Shaped Deposition via a linear motorized system Base Pressure ~ 1E-9 Torr, Targets: Co, CoFeB, Ru, Ir, Pt, Ta, W, Mo, Tb, GdOxide Sputter System (Co-Sputtering System)4 DC/RF Sputtering Ion Source (3 inch) + 1 Heater (< 1000 oC) Base Pressure ~ 1E-9Oxygen(O2), Nitrogen(N2) Reactive Sputtering SystemsPlasma Treatment SystemO2 plasma cleaning / O2 plasma ashingThermal annealing process in various gas moods (1 Heater < 700 oC) Oxidation & Nitrization via O2, N2, NO gasesPortable Magnetron Sputtering System (EASYDEP_002A)
The joint development between DGIST and Pure Vacuum Technology (PVT)SpecificationsMaximum 6 DC/RF supttering sources + maximum 6 sample holdersFull operation control via 14-inch touchscreen (sample rotation, throttle valve control, gas flow control)Inter-lock system (TMP protection) is included.All essential components (an air compressor, a water cooler, and a gas tank) are included.High Sensitivity Laser-based Magneto-Optical Kerr Effect (MOKE) Spectroscopy
SpecificationsPolar and Longitudinal MOKE measurementsMaximum magnetic field ~ 1 TLinear motor-based automatic position measurement (for wedge-type samples)12-channel voltage/current-induced MOKE measurement2 Axis Vector Field Magnet
(for Thermal Annealing System / Hall Effect Measurement System)
SpecificationsMaximum magnetic field for each magnet < 0.4 TPole gaps are fixed at 5 cm.