16.J. Varghese,  Forging a Sustainable Path in Electronics Manufacturing through Advanced Practices, Global Science Fest Kerala, India, 2024

15. J. Varghese, Materials to Device Integration for 6th Generations/International Faculty Development Program/Invited Talk-Webinar/KL University, India.

14. J. Varghese/5G to 6G Materials to Device Technology/International Faculty Development Program/Invited Talk-Webinar/FISAT, India

13. J. Varghese/Ultra-Low Temperature Co-fired Ceramics Past, Present and Future/International Webinar Series BODHANA/Invited Talk/Assumption College, India

12. J. Varghese/Multilayer Glass-Ceramics Composite Substrates /Invited Talk/ICAFM2019/CSIR-NIIST/ India

11. J. Varghese/ Sustainable Ceramics for 6th Generation Electronic Packaging/ Invited Talk/iCEE2K19/TKM College of Arts & Science, India

10. J. Varghese/ULTCC Technology/Invited Talk/ Department of Physics/Kerala University, India

9. R. Aiswarya* , J. Varghese, S. P. Anoop, G. S. Varsha , K. S. Dijith, M. T. Sebastian, K. P. Surendran, “Functional Ink for Printed Electronics”, ICAFM-2014, Kerala, India. (Poster Presentation)

8. A. S. Pushpa*, J. Varghese, K. P. Surendran and M. T. Sebastian, “Screen Printed Rutile Titania Ink for Modern Solar Tracker Era” Work shop-2013, University of Kerala, Kariavattom campus, Kerala, India. (Poster Presentation)

7. N. Joseph, J. Varghese and M. T. Sebastian, “Effect of multilayer stacking and conductive coating on EMI shielding properties of PVDF - graphene composite” IUMRS-ICA 2013, India. (Poster Presentation)

6. J. Varghese, K. P. Surendran and M. T. Sebastian, “Room temperature healing silica ink for printed electronic applications” IUMRS-ICA 2013, India. (Poster Presentation)

5. J. Varghese, M. Presume*, K. P. Surendran and M. T. Sebastian, “A Novel Dielectric Ceramic for Microwave Passive circuits” ICC – 2012, Bikaner, Rajasthan, India. (Poster Presentation)

4. J. Varghese, S. Gopinath* and M. T. Sebastian, “Effect of amorphous fillers on low loss ceramics for advanced microwave electronics”, AEMC 2011, IEEE, Kolkata, India. (Oral Presentation)

3. J. Varghese, T. Joseph and M. T. Sebastian, “Microwave dielectric properties of ZrSiO4 ceramic for MIC applications”, APSYM-2010, CUSAT, Cochin, Kerala, India. (Oral Presentation)

2. J. Varghese, T. Joseph and M. T. Sebastian, “Sol-gel derived TiSiO4 ceramics for high-k gate dielectric applications”, NSFD-XV, AIP conference proceedings, 2010, Guru Ghasidas University, Bilaspur, Chhattisgarh, India. (Poster Presentation)

1. J. Varghese, T. Joseph and M. T. Sebastian, “Synthesis and characterization of ASiO4 (A-Ti, Zr, Hf) for gate dielectric applications”, ICAFM-2009, NIIST-CSIR, Trivandrum, Kerala, India. (Poster Presentation)

1. J. Varghese, S. Ziesche, U. Partsch et.al. , Glass-Ceramics and Glasses for Microwave and THz Applications, XVIII ECers Conference & Exhibition of European Ceramic Society, 2023

1. J. Varghese, S. Ziesche, U. Partsch, Microwave Dielectric Ceramics for ULTCC Applications, 15th PACIFIC RIM CONFERENCE OF CERAMICS SOCIETIES, Shenzhen, China (Invited Talk and Session Chair), 2023

1. SiC Integration on ULTCC

1. QWED 1

2.  QWED 2

1. IMAPS

1. PAcrim 14

2. J. Varghese, Second doctoral degree dessertation presented at University of Oulu, Finland 2019.

1. J. Varghese, Bi-En Harvested, Fablab Oulu, Finland 2019.

14. J. Varghese, Second doctoral degree dessertation presented at University of Oulu, Finland 2019.

13. J. Varghese, Bi-En Harvested, Fablab Oulu, Finland 2019.

4. J. Varghese, ULTCC Project Idea, 25th ITEA Roadshow-Germany, 15.06.2023; Online

3. J.Vargese, S. Ziesche and U. Partsch, Silicate based ULTCC dielectric materials for advanced packaging applications, 12 th International Conference on Microwave Materials and Application, 25-28.9.2023

2. J. Varghese, 6th Generation Ceramic Packaging via ULTCC Sustainable Concept, MSE2020, TU Darmstadt, Germany. 11 September 2020 to 25 September 2020.  (Oral Presentation)

1. J. Varghese, M. Teirikangas, J. Puustinen, H. Jantunen, Mailadil Thomas Sebastian, Low Loss Dielectric Ink Based On Natural Zircon, CICMT-2015, Dresden, Germany. (Oral Presentation)

1. J. Varghese, H. Ohsato, R.V. Leite, M.T. Sebastian, H. Jantunen, Microwave dielectric properties of direct casted TiO2 added indialite/cordierite glass ceramic substrate, 12th Pacific Rim Conference on Ceramic and Glass Technology Conference 2017, Hawaii, USA.(Oral presentation by Prof. Hitoshi Ohsato)

1. J. Varghese, T. Siponkoski, M. Teirikangas, M. T. Sebastian, A. Uusimäki and H. Jantunen, Molybdate glasses for ULTCC applications, MMA-2016, South Korea. (Oral presentation by Prof. Heli Jantunen).

3. J. Varghese, N. Joseph, M. T. Sebastian and H. Jantunen, Structural, thermal, mechanical and microwave dielectric properties of HDPE-Y3Fe5O12 composites for telecommunication applications, MMA-2018, October 2018, Osaka, Japan. (Oral Presentation by Jobin Varghese).

2. H. Ohsato, A. Kan, J. Varghese, J-S. Kim, I. Kagomiya, H. Ogawa, M. T. Sebastian, and H. Jantunen, Volume crystallization and improved TCf of indialite/cordierite glass ceramics by TiO2 addition, ICE 2017, 8th International Conference on Electroceramics, Nagoya, Japan. (Oral presentation by Prof. Hitoshi Ohsato).

1. J. Varghese, T. Vehare, H. Ohsato, H. Jantunen and M. Iwata, A Novel LTCC Based on Indialite/Cordierite Glass Ceramics, The 34th meeting on Ferroelectric Materials and their Applications 2017, Koyoto, Japan (Work Presented By Prof. Hitoshi Ohsato).

1. H. Ohsato, J. Varghese, T. Vahera, H. Jantunen and M. Iwata, Millimeter-wave dielectrics of indialite/cordierite glass ceramics applied to LTCC and direct casting substrates, IAAM Advancement of Materials to global Excellence 25th, 24-27 March 2019, Stockholm, Sweden, ISBN: 978- 91-88252-17-3, DOI: 10.5185/afmc2019. (Keynote Lecture by Prof. Hitoshi Ohsato)

1. J. Varghese, et. al. Direct casting indialite/cordierite glass ceramic substrates for millimeter-wave dielectrics Electroceramics XVI held at Belgium 9-12 July 2018. (Oral presentation by Prof. Heli Jantunen).

1. J. Varghese, P. Ramachandran*, M. Sobocinski, T. Vahera, J. Juuti, H. Jantunen, ULTCC Material for Device Fabrication at 400 ˚C; An Upgraded Low-Cost Fabrication Technology for 5th and 6th Generation Wireless Devices, CICMT-2018; April 17-20; Avero; Portugal. (Oral presentation by Prof. Heli Jantunen)

02. J. Varghese, T. Siponkoski, M. Sobocinski, T. Vahera, and H. Jantunen, New Ultra-Low Sintering Temperature Co-fired Functional Ceramic Composites; Introducing Low-Cost Next Generation Functional Devices,2017, ICCE-25, Rome, Italy. (Invited Talk)

01. N. Joseph, J. Varghese, M. Teirikangas, M. T. Sebastian and H. Jantunen, Ultra-low sintering temperature ceramic composites of CuMoO4 through Ag2O addition for microwave applications, 2017, ICCE-25, Rome, Italy.