Experimental Equipment

FAB

• • Photolithography

1. Spin coater 

2. Contact Aligner (MA-6 / Karl-suss)

3. Maskless Patterning System (DL-1000 HP / NanoSystemSolutions)

• Etch

  1. RIE Etcher (RIE 80 PLUS / Oxford Instruments)

  2. ICP-RIE (PlasmaPro System 100 Cobra / Oxford Instruments)

  3. Plasma Etcher 

• Deposition

  1. E-Gun Evaporator (SRN-200 / SORONA)

  2. E-beam Evaporator

  3. PECVD (PlasmaPro System 100 / Oxford Instruments)

  4. MOCVD (Thomas Swan & CO LTD)

  5. ALD (LUCIDA D / NCD)

Laboratory

• Thermal treatment

  1. RTA

  2. Tube Furnace

  3. Box Furnace

• Deposition

  1. CVD

  2. Mist-CVD

  3. PLD

• Device

  1. Wedge wire bonder system (7476D-79 / WESTBOND)