2025

• Dual-MAC: Hardware Acceleration of DNN Inferences with a Customized Lightweight Brain Floating-Point Format
  Seungah Shin, Joonho Kong*, and Young Seo Lee*
  IEEE Access, vol. 13, pp. 165738-165750, September 2025. (SCIE IF: 3.6)  

• SQUAD: A Scalable Quantization Accelerator Toward Energy-Efficient On-Device Quantization-Aware Training
  Ye-Bin Kwon, Young Seo Lee*, and Young-Ho Gong*
  IEEE Access, vol. 13, pp. 159487-159498, September 2025. (SCIE IF: 3.6)  

• SHIFT ECC: A Value Converting HBM ECC Approach for Refresh Energy Efficient Integer Quantized DNN Inference
  Jae Yoon Lee, Young Seo Lee*, Young-Ho Gong, Seon Wook Kim, and Sung Woo Chung*
  IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), Reykjavik, Iceland, August 2025.  (BK21+ SCIE IF: 1)

2024

• ZEC ECC: A Zero-byte Eliminating Compression Based ECC Scheme for DRAM Reliability
  Ji Hun Kwon, Hyeong Kon Bae, Young Seo Lee, Young-Ho Gong, and Sung Woo Chung
  IEEE Access, vol. 12, pp. 100366-100376, July 2024. (SCIE IF: 3.4) 

2023

• Scale-CIM: Precision-Scalable Computing-in-Memory for Energy-Efficient Quantized Neural Networks
  Young Seo Lee, Young-Ho Gong, and Sung Woo Chung
  Journal of Systems Architecture, vol. 134, January 2023. (SCIE IF: 5.836, Top 10.9% in JCR 2021)

2022

• Stealth ECC: A Data-Width Aware Adaptive ECC Scheme for DRAM Error Resilience
  Young Seo Lee, Gun Jae Koo, Young-Ho Gong, and Sung Woo Chung
  Design, Automation and Test in Europe Conference (DATE), Antwerp, Belgium, March 2022. (BK21+ SCIE IF: 2) 

2021

• Quant-PIM: An Energy-efficient Processing-in-memory Accelerator for Layer-wise Quantized Neural Networks
  Young Seo Lee, Eui-Young Chung, Young-Ho Gong, and Sung Woo Chung
  IEEE Embedded Systems Letters (ESL), vol.13, no.4, pp.162-165, December 2021. (SCIE IF: 1.524)

• Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors
  Ji Heon Lee, Young Seo Lee, Jeong Hwan Choi, Hussam Amrouch, Joonho Kong, Young-Ho Gong, and Sung Woo Chung
  IEEE Access, vol. 9, pp. 120715-120729, August 2021. (SCIE IF: 3.367)

• Enhancing Matrix Multiplication with a Monolithic 3D based Scratchpad Memory
  Cong Thuan Do, Jeong Hwan Choi, Young Seo Lee, Cheol Hong Kim, and Sung Woo Chung
  IEEE Embedded Systems Letters (ESL), vol.13, no.2, pp.57‑60, June 2021. (SCIE IF: 1.524)

• Monolithic 3D Stacked Multiply-Accumulate Units
  Young Seo Lee, Kyung Min Kim, Ji Heon Lee, Young-Ho Gong, Seon Wook Kim, and Sung Woo Chung
  Integration, the VLSI journal, vol. 76, pp. 183-189, January 2021. (SCIE IF: 1.211)

2020

• A High‑Performance Processing‑in‑Memory Accelerator for Inline Data Deduplication
  Young Seo Lee, Kyung Min Kim, Ji Heon Lee, Jeong Hwan Choi, and Sung Woo Chung
  IEEE International Conference on Computer Design (ICCD), Abu Dhabi, UAE, November 2019. (BK21+ SCIE IF: 1) 

• Signal Strength‑Aware Adaptive Offloading with Local Image Preprocessing for Energy Efficient Mobile Devices
  Young Geun Kim, Young Seo Lee, and Sung Woo Chung
  IEEE Transactions on Computers (TC), vol.69, no.1, pp.99‑111, January 2020. (SCIE IF: 2.711) 

2019

• A High Speed Multiply-Accumulate (MAC) Unit: Case Studies on 3D Stacked FPGA and ASIC
  Young Seo Lee, Kyung Min Kim, Sang Jun Nam, Young-Ho Gong, Seon Wook Kim, and Sung Woo Chung
  Design Automation Conference (DAC), Las Vegas, USA, June 2019. (poster presented in WIP (Work-in-Progress) session)