Chip Gallery

ICs for UAV Radar Transceiver (TSMC 65nm, 2026.04)

ICs for Drone Detection Radar (GF 130nm SOI, 2026.03)

K/Ka-band PA, LNA (WinSemi GaAs Process, 2025.12)

6G Ka-LEO Transmitter & Receiver ICs with Solder Bump Package (TSMC 65nm, 2025.07)

6G Upper-mid band Transceiver IC (TSMC 65nm, 2025.04)

IC for MEMS Switch Integration & ICs for Drone Detection Radar (GF 130nm SOI, 2025.04)

6G LEO (Low Earth Orbit) Receiver Front-end IC (TSMC 65nm, 2025.01)

6G Upper-mid band Receiver Front-end IC (TSMC 65nm, 2024.10)

Q/V band Receiver IC (TSMC 65nm, 2024.03)

140-GHz Transceiver Module (UCSB, GF 22nm FD-SOI Core + InP PA)

28 GHz Four-channel Chip & 64 Channel Transceiver Module (KAIST) (IEEE JSSC 2023)

28 GHz & 28/39 GHz Integrated Circuits (KAIST, TSMC 65nm Process)