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General Chairs
General Chairs
Prof. Aryan Kaushik is an Associate Professor at Manchester Met, UK, since 2024. Prior to that, he has been an Assistant Professor on senior grade with University of Sussex, UK, from 2021-24, and with University College London, UK (2020-21), University of Edinburgh, UK (2015-19), and Hong Kong University of Science and Technology, Hong Kong (2014-15). He has also held visiting appointments at Imperial College London, UK (2019-20), University of Bologna, Italy (2024), University of Luxembourg, Luxembourg (2018), Athena RC, Greece (2021), and Beihang University, China (2017-19, 2022). He has been External PhD Examiner internationally such as at Universidad Carlos III de Madrid, Spain, in 2023. He has been an Invited Panel Member at the UK EPSRC ICT Prioritisation Panel in 2023, Editor of three books on ISAC (2024 Edition), 6G NTN (2025 Edition) and ESIT (2025 Edition) by Elsevier, and several journals such as IEEE Open Journal of the Communications Society (Best Editor Award 2023), IEEE Communications Letters (Exemplary Editor 2023), IEEE Internet of Things Magazine (including the AI for IoT miniseries), IEEE Communications Technology News (initiated the IEEE ComSoc Podcasts series), and several special issues such as in IEEE Wireless Communications, IEEE Network, and many other IEEE venues. He has been an invited/keynote and tutorial speaker for over 80 academic and industry events, and conferences globally such as at IEEE ICC 2024, IEEE GLOBECOM 2023 and 2024, IEEE VTC-Spring 2023 and 2024, IEEE ICMLCN 2024, IEEE WCNC 2023, IEEE MeditCom 2023 and 2024, One6G Summit 2023 and 2024, and many other events worldwide. He has been chairing in Organizing and Technical Program Committees of 10 flagship IEEE conferences such as IEEE ICC 2024 and 2025, IEEE ICMLCN 2024 and 2025, and IEEE WCNC 2023 and 2024, etc. He has been General Chair of over 20 workshops for IEEE ComSoc conferences such as at IEEE ICC 2024 and 2025, IEEE GLOBECOM 2023 and 2024, IEEE WCNC 2023, 2024 and 2025, IEEE PIMRC 2022, 2023 and 2024, and several others.
Prof. Marco Di Renzo (Fellow, IEEE) received the Laurea (cum laude) and Ph.D. degrees in electrical engineering from the University of L’Aquila, Italy, in 2003 and 2007, respectively, and the Habilitation à Diriger des Recherches (Doctor of Science) degree from University Paris-Sud (currently Paris-Saclay University), France, in 2013. Currently, he is a CNRS Research Director (Professor) and the Head of the Intelligent Physical Communications group at Paris-Saclay University – CNRS and Cen-traleSupelec, Paris, France. He is a Founding Member and the Academic Vice Chair ISG on Reconfigurable Intelligent Surfaces (RIS) within ETSI. He is a Fellow of the IEEE, IET, and AAIA; an Ordinary Member of the European Academy of Sciences and Arts, an Ordinary Member of the Academia Europaea; and a Highly Cited Researcher. Also, he holds the 2023 France-Nokia Chair of Excellence in ICT, and was a Fulbright Fellow at City University of New York, USA, a Nokia Foundation Visiting Professor, and a Royal Academy of Engineering Distinguished Visiting Fellow. He served as the Editor-in-Chief of IEEE COMML during the period 2019-2023, and he is now serving in the Advisory Board.
Dr. Xueli An is the Head of 6G Network Architecture Research Group at Huawei Technologies Duesseldorf GmbH, Munich Research Center, Germany. Within Huawei, she leads the next generation mobile communication enabled vertical industry related research and corresponding industry development related activities. She has long experience in 5G research and deep engagement with the 5G enabled Industry 4.0 ecosystem. She serves as 5G-ACIA working group “Use cases and Requirements” vice chair since 2018. She is the vice chair of NetworldEurope Enabling Technologies for Future Vertical Ecosystem Transformation Working Group since 2020. Her current research focuses on 6G network architecture design and she also takes the role as working group “Communication and Dissemination” chair position in One6G Association since 2021. She has many peer-reviewed international journal/conference publications and filed/granted patent applications, etc. She received her Master and Ph.D. degrees in Electrical Engineering from Delft University of Technology, Netherlands.
Prof. Boya Di is an Assistant Professor at the School of Electronics, Peking University, China. She obtained her PhD degree from the Department of Electronics, Peking University in 2019. Prior to that, she received the B.S. degree in electronic engineering from Peking University in 2014. Her current research interests include reconfigurable intelligent surfaces, edge computing, vehicular networks, and aerial access networks. She received best doctoral thesis award from China Education Society of Electronics in 2019. She is also recipient of 2021 IEEE ComSoc Asia-Pacific Outstanding Paper Award.
Mr. Miguel Dajer is a veteran of the telecom industry having spent the last 30 years working in different wireless technologies at Bell Laboratories, Lucent, Alcatel-Lucent and Futurewei Technologies. Mr. Dajer is currently the USA wireless R&D VP for Futurewei Technologies and Director or the company’s NJ Research Center. Mr. Dajer worked at Bell Laboratories, Lucent Technologies and Alcatel Lucent for the 25 years prior to his current position. During his tenure at the wireless labs he occupied several key positions in Radio Access Network Hardware and Software product development and life cycle management, basestation platform development, systems engineering and architecture and technology introduction of wireless products. Since joining Futurewei, Mr. Dajer has worked towards establishing a strong wireless solutions presence in North America along with innovation and technology labs that supports Huawei’s MBB wireless product solutions. His lab research focuses on 5G evolution to 5.5G and beyond 5G+ network architectures for the support of massive connectivity, high bandwidth and delay sensitive applications, fundamental technologies to enable these solutions, including signal processing, antenna systems, role of big data and machine learning on wireless communication and the standardization of such solutions.
Dr. Ishtiaq Ahmad is a researcher at 6G Mobile Research Lab at Czech Technical University in Prague. He received a B.S. degree in electrical engineering from the University of Engineering and Technology, Peshawar, Pakistan, in 2007, and the M.S. and Ph.D. degrees in electronic engineering from Inha University, South Korea, in 2014 and 2019, respectively. He is a Lecturer at Electrical Engineering Department, Gomal University, Pakistan since 2008. His research interests include interference management in 3GPP LTE-A and 5G/6G systems, public safety and mobile ad-hoc networks (especially for UAV), cellular-V2X technology, maritime and underwater communications, and applications of artificial intelligence technologies. He was a recipient of the Jungseok International Scholarship for his M.S. and Ph.D. degrees at Inha University due to his excellent academic career. He received the Outstanding Research Award and the Excellent Student Award from Inha University, in 2019. He serves as a Lead Guest Editor for numerous prestigious IEEE journals and magazines.
Steering Committee
Steering Committee
TPC Chairs
TPC Chairs
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