Cross-layer resilience in low-voltage digital systems: key insights- Eric Cheng, Jacob Abraham, Pradip Bose, Alper Buyuktosunoglu, Keith Campbell, Deming Chen, Cheng-Yong Cher, Hyungmin Cho, Binh Le, Klas Lilja, Shahrzad Mirkhani, Kevin Skadron, Mircea Stan, Lukasz Szafaryn, Christos Vezyrtzis, and Subhasish Mitra, ICCD 2017