"FlawMatch: Conditional Defect Image Generation via Flow Matching for Improved Surface Defect Classification"
Hyunwoo Oh, Seunghee Choi, Jinho Baek, {Dong-Jin Kim*, Junegak Joung*} (* Co-corresponding authors)
Advanced Engineering Informatics (AEI), 2025. (Impact Factor 9.9)
[PDF]
"Semi-Supervised Image Captioning by Adversarially Propagating Labeled Data"
Dong-Jin Kim, Tae-Hyun Oh, Jinsoo Choi, and In So Kweon.
IEEE Access, 2024. (Impact Factor 3.4)
[PDF]
"Empirical study on using Adapters for debiased Visual Question Answering"
Jae Won Cho, Dawit Mureja Argaw, Yeongtaek Oh, Dong-Jin Kim, In So Kweon
Computer Vision and Image Understanding (CVIU), 2023. (Impact Factor 4.5)
[PDF]
"Counterfactual Mix-Up for Visual Question Answering"
{Jae Won Cho*, Dong-Jin Kim*}, Yunjae Jung, In So Kweon (* Co-first authors)
IEEE Access, 2023. (Impact Factor 3.9)
[PDF]
"Local Pseudo-Attributes for Long-Tailed Recognition"
Dong-Jin Kim, Tsung-Wei Ke, Stella X. Yu
Pattern Recognition Letters (PRL), 2023. (Impact Factor 5.1)
Also presented at the "Self-Supervised Learning: Theory and Practice" workshop in conjunction with NeurIPS 2022.
"Modeling Semantic Correlation and Hierarchy for Real-world Wildlife Recognition"
Dong-Jin Kim, Zhongqi Miao, Yunhui Guo, Stella X. Yu
IEEE Signal Processing Letters (SPL), 2023. (Impact Factor 3.201)
[PDF]
Also presented at "Workshop on Human in the Loop Learning" in conjunction with NeurIPS 2022.
"MCDAL: Maximum Classifier Discrepancy for Active Learning"
{Jae Won Cho*, Dong-Jin Kim*}, Yunjae Jung, and In So Kweon (* Co-first authors)
IEEE Transactions on Neural Networks and Learning Systems (TNNLS), 2022. (Impact Factor 14.255)
Also presented at "The Workshop on Fine-Grained Visual Categorization" in conjunction with CVPR 2022.
"Dense Relational Image Captioning via Multi-task Triple-Stream Networks"
Dong-Jin Kim, Tae-Hyun Oh, Jinsoo Choi, and In So Kweon.
IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), 2022. (Impact Factor 24.314)
[PDF][arXiv] [Project] [Dataset] [code]
Received Qualcomm Innovation Award 2019.