China, unable to access leading-edge wafer fab tools from American, European, and Japanese manufacturers, has to develop its own fab equipment. Huawei is building a giant research and development (R&D) center near Shanghai, where it plans to develop chipmaking tools that will have to be competitive with systems designed by ASML, Canon, and Nikon, reports Nikkei.
The R&D center will focus on developing lithography machines, which are essential for making chips on leading-edge nodes. For now, Huawei's partners SMIC and Hua Hong cannot get litho tools that allow them to make logic chips on 14nm/16nm FinFET-based process technologies and more advanced processes, but they can still obtain 28nm-capable lithography systems. Therefore, Huawei-developed machines will have to be at least 28nm, or better 14nm/16nm-capable. For now, ASML controls well over 90% of the lithography tools market.
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The R&D center is strategically located in the Qingpu district of Shanghai, part of a larger campus that includes facilities for Huawei's chip design unit, HiSilicon T, as well as R&D centers for wireless technologies and smartphones. The total investment for this campus is estimated at 12 billion ($1.66 billion), covering an area equivalent to approximately 224 football fields. Once completed, it will have the capacity to accommodate over 35,000 employees.
To attract top talent, Huawei is offering competitive salary packages and has already hired engineers with experience in leading chip tool builders and chipmaker. Huawei (and other China-based companies) can no longer hire U.S. citizens and holders of U.S. green cards to lead its projects. Now that ASML, Applied Materials, KLA, and Lam Research have to cut down their presence in China, Huawei and other companies in the country can hire experienced talent with Chinese citizenship.
Before being added to the U.S. trade blacklist, Huawei primarily focused on chip design, collaborating with major contract chipmakers, such as TSMC and GlobalFoundries. However, following restrictions on access to American technologies, the company shifted its focus to working with China-based contract chipmaker SMIC, the report claims. Huawei is now reportedly venturing into chip production itself, partnering with entities backed by local governments in multiple Chinese cities, including Shenzhen, Qingdao, and Quanzhou, which essentially means that it pours money into fabs operated by Huawei and co-owned by local and federal governments. Additionally, Huawei has invested in numerous local providers of chip materials in a bid to use local suppliers and invest in domestic alternatives.
Huawei OptiXstar HG8141XR-10 is a master FTTR in the Huawei FTTR for Home solution. It uses GPON technologies to implement ultra-broadband access and provides users with gigabit dual-band Wi-Fi 6 and downstream optical ports.
Huawei OptiXstar K662d is a desktop slave FTTR that works with the master FTTR in the Huawei FTTR for Home solution. It supports ultra-broadband access through optical fibers or Ethernet upstream transmission, and provides users with gigabit dual-band Wi-Fi 6 and gigabit network ports.
Huawei OptiXstar B866 is a master FTTR unit (MFU) launched by Huawei. It supports XG-PON and 10G EPON technologies to implement all-optical gigabit access for enterprises. It supports power over fiber (PoF) cables to supply power to slave FTTR units (SFUs) and works with SFUs to provide gigabit Wi-Fi coverage for enterprises. The product applies to small- and medium-sized enterprises, commercial buildings, and campus dormitories.
Huawei OptiXstar B675-1E3W is an SFU launched by Huawei. It supports ultra-gigabit broadband access through upstream fibers and provides users with gigabit dual-band Wi-Fi 6 and gigabit network ports. The device can be easily installed in a junction box (86 mm). Using a PoF cable, the device acquires both power supply and high bandwidth, solving the problem of exposed power cables and fibers and making cable routing neat and elegant.
The Wi-Fi 6 network uses technologies such as OFDMA, MU-MIMO, and 1024-QAM to make applications such as 4K video, VR, online education, and online office more reliable. It not only supports the access of more STAs, but also balances the bandwidth of each user. For example, in an electronic classroom, if there are more than 100 students, there used to be great challenges in video transmission or uplink and downlink interaction. However, Wi-Fi 6 networks can easily cope with this scenario.
Huawei master and slave FTTR units support 802.11k/v. If STAs also support 802.11k/v, they can roam seamlessly between ONTs or multiple Wi-Fi APs. In home networking solutions such as FTTR or mesh networking, ONTs and APs share the same SSID, implementing one network for the entire house and imperceptible Wi-Fi handover.
The Huawei FTTR solution uses dedicated pipe routing tools, innovative micro optical cables, and transparent optical cables, which are easy to be routed through pipes without fiber splicing. Concealed pipe routing is efficient and convenient. Transparent optical cables and PVC transparent adhesive are used for exposed cable routing. No cable ties are required, making the cabling neat without negative impacts on wall surfaces.
Robert (Bob) Peckyno is the Communication Specialist for the Wireless Inclusive Technology RERC and the Smart Tech for Paralysis Hubs within the Rehabilitation Science and Technology (RST) Department at the University of Pittsburgh. Prior to working at Pitt, Robert was most recently an Instructor and the Public Information Representative for the School of History, Philosophy, and Religion at Oregon State University. (OSU)
Robert has a diverse background beginning with an undergraduate degree in Recording Industry Management and Mass Communications from Middle Tennessee State University (MTSU) where he worked to create and promote the careers of country megastars Garth Brooks, Tricia Yearwood, and many others. He has two Master's degrees: One from the University of North Dakota (UND) where his research explored communication protocols and challenges related to the asteroid hazard and another from OSU where he worked on the NASA/ESA Cassini mission radar analysis team. As an instructor at OSU, he developed the first ever university course focused on the untold women's history of outer space.
Specifically the GPS / mapping functions on my smart phone. I am prone to "advanced alternative exploration" which is a nice way of saying getting turned around. With mapping and directions, now it is a simple matter of following instructions and magically arriving at your destination!
I have been working in the Augmented Reality development space for almost 10 years now and very much look forward to the day when it will be ubiquitous and available as a bluetooth contact lens. In the meantime, I'm looking forward to seeing what the new generation of AR wearables has to offer! When walking to work is a quest, we will have arrived. :)
I have to go with the obvious here, the smartphone. I work hard to be the best possible multi-tool that I can be - capable of helping out in every situation - and that is exactly what a smartphone is.
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Nano-processes are gradually becoming more important than ever to realize the nano-metric cutting or nano-material formation. Although FEM and molecular dynamics (MD) are popular two analytical methods, they have their own limitations as used for nanoprocess simulation such as immense calculation time cost of MD, inappropriate governing equations of FE. To compensate the drawbacks of both methods and meet the demands on nanotechnology, multi-scale modeling approach is anticipated to provide a powerful analytical tool assuring materials simulation across length/time scale. In this paper one novel multi-scale simulation method combining the material point method (MPM) and MD by handshaking approach is proposed for nano-processes, i.e. nano-metric cutting and thin film formation. Quantitative assessment items: adhesion/cutting force, flatness and densification coefficient, etc. are provided to avoid drawbacks of current qualitative manner. Finally, various simulations are conducted to validate the efficiency of proposed multi-scale simulation approach and clarify the mechanism of nano-processes. 152ee80cbc
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