Heewon Kim
Post-Doc.
Korea University (RICT)
harry0475 (at) korea.ac.kr
Heewon Kim
Post-Doc.
Korea University (RICT)
harry0475 (at) korea.ac.kr
Affiliation
612D Techno Complex Research Center, Korea University, Anam-dong, Seongbuk-gu, Seoul, Republic of Korea
About Me
I am currently a postdoctoral researcher in Research Institute of Information and Communication Technology (RICT) at the Korea University. I received with my B.S and Ph.D degrees from Korea University, Seoul, South Korea in 2021 and 2026, respectively, with my advisor Sangheon Pack.
My CV can be downloaded here (Last Updated: Mar’26).
Research Interests
I am broadly interested in Software Defined Network (SDN), Programmable Data Plane (PDP), In-Network Computing (INC), Large Language Model (LLM). However, my current research can be categorized as the following topics:
Monitoring and Management for Network Systems
Intelligence Processing in Network Systems
Data Aggregation in Distributed Systems
Recent News
[2026.3] ★★ (First Author) LUCID is accepted at IEEE SECON 2026 (Full-paper, Top-tier Conference - KIISE: A, NRF: IF 1)
[2026.03] I joined Korea University as a Postdoctoral Researcher
[2026.02] ★★ I am selected for the Sejong Science Fellowship (Domestic Track)
[2026.01] ★★ I received KU Graduate School Achievement Awards 2025
[2026.01] (Co-Author) FreshINT is accepted at IEEE INFOCOM 2026 (Workshop)
[2025.12] My Ph.D degree is successfully defended
[2025.09] (First Author) Auto-INT is accepted at ACM CoNEXT 2025 (Poster)
[2025.08] ★★ (First Author) MALOI is accepted at IEEE ComMag (JCR 2024 Top 7.2%)
[2025.07] (Co-Author) CALAHO is accepted at IEEE OJ-COMS (JCR 2024 Top 18.7%)
[2025.06] ★★ (First Author) FAT-INT is accepted at ACM CoNEXT 2025 (Full-paper, Top-tier Conference - KIISE: S, NRF: IF 3)
[2025.05] ★★ I am invited in Top-Conference Session (with TINIEE) at KCC 2025
[2025.04] (Co-Author) "Split Computing for Mobile Devices: Energy and Latency Perspective" is accepted at IEEE TSC (JCR 2024 Top 13.0%)
[2024.11] ★★ I received Student Travel Grant from SECON
[2024.10] ★★ (First Author) TINIEE is accepted at IEEE SECON 2024 (Full-paper, Top-tier Conference - KIISE: A, NRF: IF 1)
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