Heewon Kim
Post-Doc.
Korea University (RICT)
harry0475 (at) korea.ac.kr
Heewon Kim
Post-Doc.
Korea University (RICT)
harry0475 (at) korea.ac.kr
Affiliation
612D Techno Complex Research Center, Korea University, Anam-dong, Seongbuk-gu, Seoul, Republic of Korea
About Me
I am currently a postdoctoral researcher in Research Institute of Information and Communication Technology (RICT) at the Korea University. I received with my B.S and Ph.D degrees from Korea University, Seoul, South Korea in 2021 and 2026, respectively, with my advisor Sangheon Pack.
My CV can be downloaded here (Last Updated: October’25).
Research Interests
I am broadly interested in Software Defined Network (SDN), Programmable Data Plane (PDP), In-Network Computing (INC), Large Language Model (LLM). However, my current research can be categorized as three main topics:
Intelligence Processing in Network Systems
Efficient and Effective Network Monitoring
Data Aggregation in Network Systems
Recent News
[2025.09] (First Author) Auto-INT is accepted at ACM CoNEXT 2025 (Poster)
[2025.08] (First Author) MALOI is accepted at IEEE ComMag (JCR 2024 Top 9.6%)
[2025.07] (Co-Author) CALAHO is accepted at IEEE OJ-COMS (JCR 2024 Top 18.7%)
[2025.06] (First Author) FAT-INT is accepted at ACM CoNEXT 2025 (Full-paper, Top-tier Conference)
[2025.05] We are invited in Top-Conference Session (with TINIEE) at KCC 2025
[2025.04] (Co-Author) "Split Computing for Mobile Devices: Energy and Latency Perspective" is accepted at IEEE TSC (JCR 2024 Top 13.0%)
[2024.11] We received Student Travel Grant from SECON
[2024.10] (First Author) TINIEE is accepted at IEEE SECON 2024 (Full-paper, Top-tier Conference)
[2024.08] (Co-Author) QINT is accepted at IEEE CNSM (Short)
[2024.06] (Co-Author) MARTINI is accepted at ACM SIGCOMM (Workshop)
[2024.04] (First Author) FAT-INT is accepted at IEEE INFOCOM 2024 (Poster)
[2023.12] (First Author) TINIEE is accepted at EuroP4 2023 (Poster)
[2023.11] (Co-Author) Divide-and-Cache is accepted at IEEE TNSM (JCR 2022 Top 30.7%)
[2023.11] (Co-Author) SAINA is accepted at IEEE TSC (JCR 2022 Top 3.2%)
[2023.11] (Co-Author) MARINA is accepted at IEEE Network (JCR 2022 Top 4.7%)
[2023.04] (First Author) TAPINA is accepted at IEEE ICCCN 2023 (Full-paper)
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