3D DRAM

 Research Topics-3D DRAM

DRAM, the main memory device in modern computing systems, has continuously improved its integration density through process scaling. With the rapid growth of AI and data-intensive applications, the demand for large-capacity memory is increasing, driving the need for highly integrated DRAM technologies. Our research group explores new scaling strategies to address these challenges. In particular, we investigate highly reliable DRAM cell operation methodologies without the storage capacitor, which has become a major bottleneck in further DRAM scaling. We also study device integration approaches beyond conventional planar transistor structures, including 3D stacked array architectures for future high-density memory systems.