Publications

Publications (†: First Author, * Corresponding Author)

-. C. Kim†, G.-H. Lee†, St. Park*, J.-W. Jeong*
“Soft implantable devices”
In preparation

-. H. Seo†, M. Kim†, G.-H. Lee*, H. Park*, Se. Park*
“Human-robot interfaces”
Submitted

-. G.-H. Lee†, C. Majidi*
“Heat sink for AI chip packaging”
Submitted

-. Y. Lee†, M. Kim†, K. Jo†, G.-H. Lee*, S. Cho*, Se. Park*
“Strain sensor for AI”
Nature Sensors, Under review

-. G.-H. Lee†, Se. Park*, C. Majidi*
“Soft robotics and interfaces”
Nature Electronics, Under review

13. Yunheum Lee†, Sungha Jeon†, Min Kim†, Joonhee Won, Jinwook Yeo, Kyunghyun Jo, Soyeon Lee, Kieun Park, Yechan Yang, Chul Kim, Gun-Hee Lee, Seunghwa Ryu, Sungho Jo*, Seongjun Park*
“1-D Collocated Dual-Gradient Sensory Fibers for Comprehensive Sensing and Decoding of Complex Human Motion and Physiology”
Advanced Materials, 74328 (2026)

12. Hwajoong Kim†, Daehyeon Kim†, Jinho Kim, Yukye Lee, Minchang Shin, Jimin Kim, Fransiska M. Bossuyt, Gun-Hee Lee, Byeongmoon Lee, William R. Taylor, and Jaehong Lee*
“Advances and Perspectives in Fiber-Based Electronic Devices for Next-Generation Soft Systems”
npj Flexible Electronics, 9, 84 (2025)

11. G.-H. Lee†, Y, Lee†, H. Seo†, K. Jo, J. Yeo, S. Kim, J.-Y. Bae, C. Kim, C. Majidi, J. Kang, S.-K. Kang, Se. Park *
“Meter-scale heterostructure printing for high-toughness fiber electrodes in intelligent digital apparel”
Nature Communications, 16, 4320 (2025)

10. H. Seo†, G.-H. Lee†, J. Park, D.-Y. Kim, Y. Son, S. Kim, K.S. Nam, C. Yang, J. Won, J.-Y. Bae, H. Kim, S.-K. Kang, St. Park, J. Kang*, Se. Park*
“Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer”
Nature Communications, 16, 4944 (2025)

9. S. Lee†, G.-H. Lee†, I. Kang, W. Jeong, S. Kim, Y. Ahn, C. Kim, D. Kwon, M. Dickey, St. Park*, Se. Park*, J.-W. Jeong*
“Phase-change metal Ink with pH-controlled chemical sintering for versatile and scalable fabrication of variable stiffness electronics”
Science Advances, 11, eadv4921 (2025)

8. G.-H. Lee†, D. Lee†, W. Jeon†, J. Yoon, K. Ahn, K. S. Nam, M. Kim, J. K. Kim, Y. H. Koo, J. Joo, W. Jung, J. Lee, J. Nam, Se. Park *, J.-W. Jeong*, and St. Park*
“Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics”
Nature Communications, 14, 4183 (2023)

7. G.-H. Lee†, H. Kim†, J. Lee, J.Y. Bae, C. Yang, H. Kang, S. Park, S.-K. Kang, J. Kang, Z. Bao, J.-W. Jeong*, and St. Park*
“Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics”
Materials Today, 67, 84 (2023)

6. K. Park†, G.-H. Lee†, W. Lee†, J. Kang*, Se. Park *,and St. Park*
“Divide and Conquer: Design of Gallium-based liquid metal particles for soft and stretchable electronics"
Advanced Functional Materials, 2309660 (2023), Invited Review

5. G.-H. Lee†, H. Woo†, C. Yoon, C. Yang, J.-Y. Bae, W. Kim, H. Kang, S. Han, S.-K. Kang, Se. Park, H.-R. Kim*, J.-W. Jeong*, and St. Park*
“A personalized electronic tattoo for healthcare realized by on-the-spot assembly of an intrinsically conductive and durable liquid-metal-composite”
Advanced Materials, 34, 2204159 (2022)

4. G.-H. Lee†, Y. Lee†, H. Kim, D. Kwon, H. Kim, C. Yang, S. Q. Choi, Se. Park, J.-W. Jeong*, and St. Park*
“Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics”
Nature Communications, 13, 2643 (2022)

3. P. Li†, G.-H. Lee†, S. Y. Kim†, S. Y. Kwon, H.-R. Kim* and St. Park*
“From diagnosis to treatment: recent advances in patient-friendly biosensors and implantable devices”
ACS Nano, 15, 2, 1960-2004 (2021), Invited Review

2. G.-H. Lee†, G. S. Lee†, J. Byun, J. C. Yang, C. Jang, S. Kim, H. Kim, J.-K. Park, H. J. Lee, J.-G. Yook, S. O. Kim*, and St. Park*
“Deep learning-based deconvolution of mechanical stimuli with Ti3C2Tx Mxene electromagnetic shield architecture via dual-mode wireless signal variation mechanism”.
ACS Nano, 14, 9, 11962–11972 (2020)

1. G.-H. Lee†, J.-K. Park†, J. Byun, J. C. Yang, S. Y. Kwon, C. Kim, C. Jang, J. Y. Sim*, J.-G. Yook*, and St. Park*
“Parallel signal processing of a wireless pressure-sensing platform combined with machine-learning-based cognition, inspired by the human somatosensory system”
Advanced Materials, 32, 2070055 (2020)

To be continued...

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