Publications

Publications (†: First Author, * Corresponding Author)

17. Y. Lee†, M. Kim†, K. Jo†, G.-H. Lee*, S. Cho*, Se. Park*
“Strain sensor for AI”
In preparation

16. H. Seo†, M. Kim†, G.-H. Lee*, H. Park*, Se. Park*
“Human-robot interfaces”
In preparation

15. G.-H. Lee†, C. Majidi*
“Heat sink for AI chip packaging”
In preparation

14. C. Kim†, G.-H. Lee†, St. Park*, J.-W. Jeong*
“Soft implantable devices”
In preparation

13. G.-H. Lee†, Se. Park*, C. Majidi*
“Soft robotics and interfaces”
Nature Electronics, Under review (2025)

12. Hwajoong Kim†, Daehyeon Kim†, Jinho Kim, Yukye Lee, Minchang Shin, Jimin Kim, Fransiska M. Bossuyt, Gun-Hee Lee, Byeongmoon Lee, William R. Taylor, and Jaehong Lee*
“Advances and Perspectives in Fiber-Based Electronic Devices for Next-Generation Soft Systems”
npj Flexible Electronics, 9, 84 (2025)

11. G.-H. Lee†, Y, Lee†, H. Seo†, K. Jo, J. Yeo, S. Kim, J.-Y. Bae, C. Kim, C. Majidi, J. Kang, S.-K. Kang, Se. Park *
“Meter-scale heterostructure printing for high-toughness fiber electrodes in intelligent digital apparel”
Nature Communications, 16, 4320 (2025)

10. H. Seo†, G.-H. Lee†, J. Park, D.-Y. Kim, Y. Son, S. Kim, K.S. Nam, C. Yang, J. Won, J.-Y. Bae, H. Kim, S.-K. Kang, St. Park, J. Kang*, Se. Park*
“Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer”
Nature Communications, 16, 4944 (2025)

9. S. Lee†, G.-H. Lee†, I. Kang, W. Jeong, S. Kim, Y. Ahn, C. Kim, D. Kwon, M. Dickey, St. Park*, Se. Park*, J.-W. Jeong*
“Phase-change metal Ink with pH-controlled chemical sintering for versatile and scalable fabrication of variable stiffness electronics”
Science Advances, 11, eadv4921 (2025)

8. G.-H. Lee†, D. Lee†, W. Jeon†, J. Yoon, K. Ahn, K. S. Nam, M. Kim, J. K. Kim, Y. H. Koo, J. Joo, W. Jung, J. Lee, J. Nam, Se. Park *, J.-W. Jeong*, and St. Park*
“Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics”
Nature Communications, 14, 4183 (2023)

7. G.-H. Lee†, H. Kim†, J. Lee, J.Y. Bae, C. Yang, H. Kang, S. Park, S.-K. Kang, J. Kang, Z. Bao, J.-W. Jeong*, and St. Park*
“Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics”
Materials Today, 67, 84 (2023)

6. K. Park†, G.-H. Lee†, W. Lee†, J. Kang*, Se. Park *,and St. Park*
“Divide and Conquer: Design of Gallium-based liquid metal particles for soft and stretchable electronics"
Advanced Functional Materials, 2309660 (2023), Invited Review

5. G.-H. Lee†, H. Woo†, C. Yoon, C. Yang, J.-Y. Bae, W. Kim, H. Kang, S. Han, S.-K. Kang, Se. Park, H.-R. Kim*, J.-W. Jeong*, and St. Park*
“A personalized electronic tattoo for healthcare realized by on-the-spot assembly of an intrinsically conductive and durable liquid-metal-composite”
Advanced Materials, 34, 2204159 (2022)

4. G.-H. Lee†, Y. Lee†, H. Kim, D. Kwon, H. Kim, C. Yang, S. Q. Choi, Se. Park, J.-W. Jeong*, and St. Park*
“Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics”
Nature Communications, 13, 2643 (2022)

3. P. Li†, G.-H. Lee†, S. Y. Kim†, S. Y. Kwon, H.-R. Kim* and St. Park*
“From diagnosis to treatment: recent advances in patient-friendly biosensors and implantable devices”
ACS Nano, 15, 2, 1960-2004 (2021), Invited Review

2. G.-H. Lee†, G. S. Lee†, J. Byun, J. C. Yang, C. Jang, S. Kim, H. Kim, J.-K. Park, H. J. Lee, J.-G. Yook, S. O. Kim*, and St. Park*
“Deep learning-based deconvolution of mechanical stimuli with Ti3C2Tx Mxene electromagnetic shield architecture via dual-mode wireless signal variation mechanism”.
ACS Nano, 14, 9, 11962–11972 (2020)

1. G.-H. Lee†, J.-K. Park†, J. Byun, J. C. Yang, S. Y. Kwon, C. Kim, C. Jang, J. Y. Sim*, J.-G. Yook*, and St. Park*
“Parallel signal processing of a wireless pressure-sensing platform combined with machine-learning-based cognition, inspired by the human somatosensory system”
Advanced Materials, 32, 2070055 (2020)

To be continued...

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