Education

B.S., Chemical Engineering, Hanyang University (2013)

Ph.D., Chemical Engineering, Pohang University of Science and Technology (POSTECH) (2019)

           Advisor: Prof. Kilwon Cho

Career

Postdoc. (2019~2020), Center for Advanced Soft Electronics (CASE)

Postdoc. (2020~2022), Chemical and Biomolecular Engineering/Mechanical and Aerospace Engineering, North Carolina State University     

                  Advisor: Prof. Qingshan Wei and Prof. Yong Zhu

Postdoc. (2022~2023), Chemical Engineering, Pohang University of Science and Technology (POSTECH)

                 Advisor: Prof. Kilwon Cho

Assistant Professor (2023~present), Chemical Engineering, Kwangwoon University

Research interest

Chemical and physical modification of polymers and electronic materials

Organic/inorganic hybrid flexible/stretchable electronic devices

Wearable human/plant devices

Selected papers

1. G. Lee, O. Hossain, S. Jamalzadegan, Y. Liu, H. Wang, A. C. Saville, T. Shymanovich, R. Paul, D. Rotenberg, A. E. Whitfield, J. B. Ristaino, Y. Zhu, Q. Wei, "Abaxial leaf surface-mounted multimodal wearable sensor for continuous plant physiology monitoring", Sci. Adv. 9, 2232 (2023).

2. S. Y. Son† , G. Lee† , H. Wang, S. Samson, Q. Wei, Y. Zhu, W. You, "Integrating charge mobility, stability and stretchability within conjugated polymer films for stretchable multifunctional sensors", Nat. Commun. 13, 2739 (2022) †equally contributed.

3. G. Lee, S. Lee, D. Kim, S. H. Kim, C. Choi, S. G. Lee, K. Cho, "Anisotropic fluorinated‐elastomer‐blended micro‐dominoes for wearable triboelectric nanogenerators", Adv. Funct. Mater. 34, 2316288 (2024).

4. G. Lee, J. H. Son, S. Lee, S. W. Kim, D. Kim, N. N. Nguyen, S. G. Lee, K. Cho, "Fingerpad-inspired multimodal electronic skin for material discrimination and texture recognition", Adv. Sci. 8, 2002606 (2021).

5. D. Woo, N. Kang, H. Park, S. Myoung, G. Lee*, J. K. Kim*, C. Choi*, "Biomass-derived closed-loop recyclable chemically crosslinked polymer composites for green soft electronics", Chem. Eng. J. 488, 150818 (2024)