fab tool Qualifications

Bonding & Packaging Equipment (7)

1. Finetech Flip‑Chip Bonder

2. EVG Wafer Bonding System 501 - MNMS

3. Disco DAD3240 Automatic Dicing Saw

4. Dynatex DXE‑5 Die Expander

Planarization Systems

1. Strausbaugh CMP

2. CMP Wet Sink

3. GnP Poli 500 CMP

Lithography Tools (14)

Exposure Systems

1. Dymax 2000 UV Flood System

2. Heidelberg MLA150 Maskless Aligner

3. ASML DUV Stepper Model 5500/300

4. EVG Double-Sided Aligner 620 - MNMS

Photoresist Coat / Develop

1. SVG 8626 6" Lift‑Off Resist and BARC Coat Track

2. SVG 6" Spin Coater

3. SVG 6" Developer

4. Picotrack Coater System

5. Picotrack Developer System

6. Headway Manual‑Load Photoresist Spinner (at msink3)

7. Headway Stand‑Alone Manual‑Load Photoresist Spinner

Other Tools

1. HMDS Vapor Prime Oven

2. Matrix 106 Resist Removal System

3. ASAP‑Liftoff M6100

Deposition Systems (8)

Sputterers

1. AJA - 8-Gun DC Metal Sputtering System - MNMS

Evaporators

1. CHA Solution E‑Beam Evaporator

2. Electron Beam 10 kW 6‑pocket Evaporator

Chemical Vapor Deposition (CVD)

1. Applied Materials Epi Si & Ge Deposition

2. Oxford Plasmalab 80plus PECVD System

3. Oxford Plasmalab System 100 PECVD System (two entries)

4.  Applied MicroStructures, Model 100, Molecular Vapor Deposition

Etching Systems (12)

Vapor Etch

1. uEtch HF Vapor Release System

Plasma Etch

1. Technics C Plasma Etching System

2. YES‑G500 Plasma Cleaning System

Reactive Ion Etch (RIE)

1. Plasma‑Therm Parallel Plate Etcher

2. AMAT Centura MxP+ Etch Chamber B

Inductively Coupled Plasma with Bias

1. Lam7 Metal (Al) TCP Etcher

2. Lam8 Poly‑Si TCP Etcher

3. STS Advanced Silicon Etch (ASE)

4. STS Advanced Planar Source Oxide Etch System

5. STS ICP - DRIE Pegasus

6. AMAT Centura Compound Etch Chamber A

7. AMAT Centura Metal Etch Chamber C

Metrology, Testing & Inspection (18)

Electrical Measurements

1. CDE ResMap Four‑Point Probe (automated mapper 2"–12")

2. Everbeing EB‑8 Analytical Probe Station

Topography

1. Park Systems Atomic Force Microscope

2. KLA‑Tencor Alpha‑Step D‑600 Profilometer

Film Thickness & Index

1. Angstrom Sun Spectroscopic Ellipsometer

2. NanoSpec Film Thickness Measurement System

3. Nanospec/AFT Thin Film Measurement System
   
   Structure & Composition

1. Oxford Instruments X‑MaxN Energy‑Dispersive Spectrometer (EDX)

2. Flexus Thin Film Stress Measurement

3. Biomate 3 UV‑VIS Spectrophotometer

4. E+H Wafer Geometry Gauge

Imaging & Microscopy

1. Keyence VHX‑7000 Digital Microscope

2. Zeiss Axioplan2 Linewidth Measuring System

3. Olympus LEXT OLS4000 3D Laser Confocal Microscope

E‑Beam Imaging

1. Zeiss Scanning Electron Microscope

2. FEI Nova NanoSEM 650 Scanning Electron Microscope

Wet Chemical Processing Tools (11)

1. Photoresist Strip & Pre‑Furnace Metal Clean Sink

2. Metal Contaminated PR Strip Sink

3. Manual Spin Coat & Develop Sink

4. KOH and TMAH Silicon Etch Sink

5. Refractory Metal Processing Sink

6. VLSI MOS Clean Sink

7. Acid/Base Batch Processing Sink

8. Non‑MOS Clean Sink

9. Amatepi MOS Sink

10. General Purpose Sink

11. Tousimis 915B Critical‑Point Dryer

Thermal Processing Systems (15)

Furnaces

1. Tystar1 MOS Gate Oxidation (Atmospheric)

2. Tystar2 MOS Dry/Wet Oxidation & Anneal (Atmospheric)

3. Tystar3 NON‑MOS Dry/Wet Oxidation & Anneal (Atmospheric)

4. Tystar4 Atmospheric Dry/Wet Oxidation (NON‑MOS)

5. Tystar5 200 mm Wet/Dry Oxidation

6. Tystar9 NON‑MOS Clean Silicon Nitride (Si₃N₄) & SiC LPCVD

7. Tystar10 MOS Clean Polycrystalline Silicon LPCVD

8. Tystar11 MOS Clean Low‑Temperature Oxide (LTO) LPCVD

9. Tystar12 Non‑MOS Clean LTO LPCVD

10. Tystar14 MOS 200 mm LPCVD Nitride and HTO

11. Tystar15 Non‑MOS 200 mm Poly‑Si LPCVD

12. Tystar16 Non‑MOS 200 mm LTO LPCVD

13. Tystar17 Non‑MOS Low‑Stress Nitride & High‑Temp Oxide LPCVD

14. Tystar19 MOS Clean Si‑Ge LPCVD

15. Tystar20 Non‑MOS Clean Si‑Ge LPCVD

Ovens

1. YES Vacuum Oven

2. Small Vacuum Oven for Polymer Curing

3. Small Vacuum Oven for Low‑Temperature Anneal