tag_hash_106 Treats topics by extending concepts and procedures a step or two beyond elementary mechanics of materials and emphasizes the physical view -- mathematical complexity is not used where it is not needed. KEY TOPICS: Includes new coverage of symmetry considerations, rectangular plates in bending, plastic action in plates, and critical speed of rotating shafts. Expands the coverage of fatigue, the reciprocal theorem, semi-inverse problems in elasticity, thermal stress, and buckling.
Springs are used for various purposes in machine design as they can store energy under load, due to their elastic deformation characteristics. There are many types and profiles of springs. For a round wire helical compression or tension spring of small pitch angle, the Wahl factor, a correction factor (Cw) taking into account curvature and direct shear stress, is generally used in the design. The corresponding stress concentration factors, which may be useful for mechanics of materials problems, are obtained by taking the nominal shear stress nom as the sum of the torsional stress () and the direct shear stress () for round wire. In the case of the wire of square cross-section, nom is the sum of the torsional stress and the direct shear stress. For design calculations it is recommended that the simpler Wahl factor be used. The same value of max will be obtained whether one uses Cw or Kts. This study contains the determination of stress concentration factor and Wahl factor. For this aim, stress concentration factor charts were converted numerical values for round and square wires. These values were collected in an excel file. ANN (Artificial Neural Networks) model was developed using the data. It is an easy and convenient method, ANN model, was presented for the determination of stress concentration and Wahl factor for spring design.
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Ron Warzoha received his Ph.D. in Mechanical Engineering at Villanova University under the guidance of Dr. Amy Fleischer and is currently an Associate Professor at the United States Naval Academy. His technical areas of expertise are in nanoscale thermal transport, thermal metrology, electronics thermal management, microscopic energy carrier interactions and caloric refrigeration. He is the recipient of the US Naval Academy Apgar Award for Excellence in Teaching (2019), has over 50 published papers, owns one patent, and has recently won a major DURIP award to develop advanced nanoscale thermal characterization systems in order to better understand energy carrier interactions in electronic materials exposed to extreme environments. He is also an Associate Editor for the ASME Journal of Electronic Packaging.
Abhijit Dasgupta is Jeong H. Kim Professor of Mechanical Engineering at the University of Maryland (UMD), with research experience in the microscale and nanoscale mechanics and reliability physics of engineered materials used in conventional and additively manufactured 3D flexible electronic packaging and intelligent microsystems. He holds a Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign (UIUC), and has been a principal investigator at the Center for Advanced Life Cycle Engineering (CALCE) at UMD for over 30 years, conducting research in reliability physics, design for reliability, accelerated stress testing, and real-time health management. He has published over 300 articles and conference papers; served on editorial boards of three international archival journals; presented over 45 workshops and short courses; helped form research and educational roadmaps for the electronics industry, and provided consulting services to numerous industry leaders. He has presented numerous keynote talks at international conferences, received 6 best-paper awards and received 8 major awards in recognition of his research and educational contributions. He is an ASME Fellow, past Chair of the ASME Electronic and Photonic Packaging Division (EPPD), past member of the ASME Design, Manufacturing and Materials Segment Leadership Team (DMM-SLT) and Current Chair of Reliability Technology Working Group in the Heterogeneous Integration Roadmap (HIR) Team sponsored by IEEE/ASME/SEMI/IEPS/EDS.
Abstract: Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Accelerated experiments conducted at NREL reveal that high-lead solder joints have better reliability than sintered silver under extreme thermal cycling conditions. Furthermore, efforts to develop a crack propagation model for the high-temperature materials are described.
Spanish for Business I provides advanced-level language students with technical vocabulary and communicative skills covering business concepts as they apply to the corporate dynamics of the Spanish-speaking world, with a special emphasis on Latin America. Through readings, presentations, discussions, and video materials, we shall analyze those cultural aspects that characterize the business environment in the region as well as focus on economies and markets in light of their history, politics, resources and pressing international concerns.
Spanish 212 is an advanced-level language course that emphasizes the acquisition of the tools necessary for successful written expression in Spanish. These tools include a solid knowledge of the major points of Spanish grammar, an ample vocabulary, control of the mechanics of the language (spelling, punctuation, etc.), and a thorough understanding of the writing process. Throughout the semester students will use these tools to analyze authentic texts and to produce a variety of written assignments. By the end of the course students will have developed their awareness of the norms of standard Spanish and learned to incorporate these features into their own writing. The class will be conducted in Spanish and students are expected to speak in Spanish at all times.
Metalwork: Class I. Raw materials, production, the most importantcharacteristics. Tools for clamping, measuring and working. Processesof marking, cutting, filing, planing, thread-cutting, bending,drilling, etc. Making of exercises and simple, useful articles. ClassII. Further consideration of raw materials. Processes: More advancedwork than in Class I, then threadcutting, cold bending, riveting,grooving, soldering, etc. Simple, useful articles. be457b7860
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