Advanced Electronic Packaging Market Revenue was valued at USD 19.5 Billion in 2024 and is estimated to reach USD 34.8 Billion by 2033, growing at a CAGR of 7.4% from 2026 to 2033.
The global advanced electronic packaging market was valued at approximately USD 34.5 billion in 2022 and is expected to grow at a compound annual growth rate (CAGR) of 8.2% from 2023 to 2030. This growth can be attributed to the increasing demand for compact, high performance electronic components in industries such as telecommunications, automotive, and consumer electronics. The rise in the number of electronic devices and advancements in IoT technologies are expected to fuel the markets expansion. In addition, the trend of miniaturization in electronic components further drives the need for advanced packaging technologies such as 3D packaging, system in package (SiP), and fan out wafer level packaging (FOWLP).
Regionally, the advanced electronic packaging market is witnessing significant growth across North America, Europe, and Asia Pacific. Asia Pacific held the largest share in 2022, with a market size of approximately USD 18 billion, owing to the presence of major manufacturing hubs, particularly in China, Japan, and South Korea. North America and Europe are also experiencing considerable growth due to rising demand for high performance packaging solutions in consumer electronics and automotive industries. The increasing investments in research and development (R&D) for next generation packaging technologies provide numerous opportunities for market players, especially in emerging markets across Asia Pacific, where demand for compact and efficient electronic devices is rapidly rising.
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DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang
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By the year 2030, the scale for growth in the market research industry is reported to be above 120 billion which further indicates its projected compound annual growth rate (CAGR), of more than 5.8% from 2023 to 2030. There have also been disruptions in the industry due to advancements in machine learning, artificial intelligence and data analytics There is predictive analysis and real time information about consumers which such technologies provide to the companies enabling them to make better and precise decisions. In addition, new innovative techniques such as mobile surveys, social listening, and online panels, which emphasize speed, precision, and customization, are also transforming this particular sector.
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Growing demand for below applications around the world has had a direct impact on the growth of the Global Advanced Electronic Packaging Market
Single Chip Packaging
Multi-Chip Packaging
System-in-Package (SiP)
Flip Chip Packaging
2.5D/3D Packaging
Organic Substrates
Ceramic Substrates
Metal Substrates
Polymer Materials
Hybrid Materials
Consumer Electronics
Telecommunications
Aerospace and Defense
Automotive
Healthcare and Medical Devices
Integrated Circuits (ICs)
Passive Components
Discrete Components
Sensors
Actuators
Adiative Manufacturing (3D Printing)
Thin Film Technology
Surface Mount Technology (SMT)
Flip Chip Technology
Chip-on-Board (CoB) Technology
US (United States, US and Mexico)
Europe (Germany, UK, France, Italy, Russia, Turkey, etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil, Argentina, Columbia, etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
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1. Introduction of the Global Advanced Electronic Packaging Market
Overview of the Market
Scope of Report
Assumptions
2. Executive Summary
3. Research Methodology of Verified Market Reports
Data Mining
Validation
Primary Interviews
List of Data Sources
4. Global Advanced Electronic Packaging Market Outlook
Overview
Market Dynamics
Drivers
Restraints
Opportunities
Porters Five Force Model
Value Chain Analysis
5. Global Advanced Electronic Packaging Market, By Type
6. Global Advanced Electronic Packaging Market, By Application
7. Global Advanced Electronic Packaging Market, By Geography
US
Europe
Asia Pacific
Rest of the World
8. Global Advanced Electronic Packaging Market Competitive Landscape
Overview
Company Market Ranking
Key Development Strategies
9. Company Profiles
10. Appendix
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