Professional Services
Membership
Member, the Institute of Electrical and Electronics Engineers (IEEE)
Member, the Korean Institute of Electromagnetic Engineering and Science (KIEES)
Editorship
Lead Guest Editor of the MDPI Electronics Special Issue on "Design, Simulation, Integration, and Measurement Technologies of 5G/B5G/6G Antennas"(2020-2021)
Society Services
IEEE Member (2018-Present)
KIEES Member (2018-Present)
Special Session Corresponding-Organizer (Corresponding-Chair) of International Symposium on Antennas and Propagation (ISAP) (2024)
Special Session Corresponding-Organizer (Corresponding-Chair) of IEEE Antennas and Propagation Symposium (AP-S/URSI) (2023)
Session Co-Chair of IEEE Global Symposium on Millimeter-Waves & Terahertz (GSMM) (2022)
Session Co-Chair of IEEE Antennas and Propagation Symposium (AP-S/URSI) (2021)
Special Session Corresponding-Organizer (Corresponding-Chair) of KIEES (2021 Winter Symposium)
Session Chair of KIEES (2021 Summer Symposium)
Outstanding Top 100 Reviewers in IEEE Transactions on Antennas and Propagation (Activity Period: June 1, 2019 ~ May 31, 2020)
Technical Reviewer in IEEE Vehicular Technology Magazine, IEEE Transactions on Wireless Communications, IEEE Transactions on Antennas and Propagation, IEEE Transactions on Plasma Science, IEEE Antennas and Propagation Magazine, IEEE Antennas and Wireless Propagation Letters, IEEE Access, MDPI Electronics, MDPI Applied Sciences, MDPI Designs, MDPI Sensors, Journal of Electromagnetic Engineering and Science
Technical Reviewer in IEEE Antennas and Propagation Symposium (AP-S/URSI) (2023)
Technical Reviewer in the 52th European Microwave Conference (EuMW) (2022)
Invited Presentations
Invited Presentation in KOPTI (Presentation title: Antenna-in-Package Module Fully Integrating with IC Chipset across mm-Wave/Sub-THz spectrum: Research Survey & Possibility) (2024.05.17.).
Invited Presentation in Session #15. (Session Title: Advanced Packaging Integration Technology) of The 7th International Conference on Advanced Electromaterials sponsored by KIEEME (Presentation title: Electronic Device Technologies for mm-Wave/THz Applications Using Special Packaging Materials: Research Overview & Possibility) (2023.11.03.).
Invited Presentation in Session #06. (Session Title: Emerging RF Technologies for Future Wireless Communication) of The 23rd RF/Analog Circuit Workshop sponsored by IEIE Korea (Presentation title: mm-Wave/Sub-THz Antenna-in-Package Module Fully Integrating with IC Chipset: Research Overview & Possibility) (2023.09.22.).
Invited Presentation in Electronics HF/SI Session of The 2022 ANSYS Simulation World Korea sponsored by ANSYS Korea (Presentation title: Design and Verification Technology of Metasurface Based mm-Wave/THz Devices for Future Radio-Wave Applications and B5G/6G Communications) (2022.10.27.).