List of Publications
https://scholar.google.com/citations?view_op=list_works&hl=en&hl=en&user=R1JoP9oAAAAJ&pagesize=80
Selected Industrial AI Systems Research
Generational Knowledge Transfer for Model Robustness & Agility: Label Augmentation for Time-Sensitive Financial Services Applications
Hongda Shen and Eren Kurshan
ACM AI in Finance Conference, ICAIF, 2024
AI versus AI in Financial Crimes & Detection: GenAI Crime Waves to Co-Evolutionary AI
Eren Kurshan, Dhagash Mehta, Tucker Balch
ACM AI in Finance Conference, ICAIF, 2024
AI-Driven Fraud, Financial and Cybercrime: Emerging Threats and The Evolving Landscape of AI versus AI
E. Kurshan, D. Mehta, T. Balch, D. Byrd,
International Journal of Semantic Computing, World Scientific Publishing, 2026
Generational Learning for Robust, Agile and Compliant Models in Dynamic Environments Through Temporal Knowledge Distillation
H. Shen, E.Kurshan, International Journal of Semantic Computing, World Scientific Publishing, 2026
3D Stacking for AI Systems: Emulating Heterogeneous 3D Architectures for AI
E. Kurshan, P. Franzon
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025
Beyond Fairness Metrics: Roadblocks and Challenges for Ethical AI in Practice
Chen, J., Storchan, V. and Kurshan, E., 2021.
arXiv preprint arXiv:2108.06217.
https://arxiv.org/abs/2108.06217
3D Stacking for AI Systems: Emulating Heterogeneous 3D Architectures for AI
E. Kurshan, P. Franzon
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025
On the Current and Emerging Challenges of Developing Fair and Ethical AI Solutions in Financial Services
Kurshan, E., Chen, J., Storchan, V. and Shen, H., 2021, November
In Proceedings of the second ACM international conference on AI in finance (pp. 1-8).
https://arxiv.org/abs/2111.01306
E Kurshan, International Journal on Semantic Computing, 2024, Issue 2, 2024
https://arxiv.org/abs/2310.15274
Towards self-regulating AI: Challenges and Opportunities of AI model Governance in Financial Services
Kurshan, E., Shen, H. and Chen, J., 2020, October
In Proceedings of the First ACM International Conference on AI in Finance (pp. 1-8).
https://arxiv.org/pdf/2010.04827
Deep Q-Network-based Adaptive Alert Threshold Selection Policy for Payment Fraud Systems in Retail Banking
Shen, H. and Kurshan, E., 2020, October.
In Proceedings of the First ACM International Conference on AI in Finance (pp. 1-7).
https://arxiv.org/pdf/2010.11062
Graph Computing for Financial Crime and Fraud Detection: Trends, Challenges and Outloook
Kurshan, Eren; Shen, Hongda
International Journal of Semantic Computing, 2020, 14.04: 565-589.
https://arxiv.org/abs/2103.03227
Financial Crime & Fraud Detection Using Graph Computing: Application Considerations & Outlook
Kurshan, Eren; Shen, Hongda; Yu, Haojie.
In 2020 Second International Conference on Trans-Disciplinary AI (TransAI). IEEE, 2020. p. 125-130.
https://arxiv.org/abs/2103.01854
Temporal Knowledge Distillation for Time-Sensitive Financial Services Applications
Honda Shen, Eren Kurshan
Arxiv, https://arxiv.org/abs/2312.16799
Knowledge-Base Graphs to Knowledge Graph-Based Computing: Integrated Semantic System for Artificial Intelligence
Eren Kurshan, Arxiv Preprint
AI Hardware and Neuromorphic Computing
3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence
Eren Kurshan, Yuan Xie, Paul Franzon
A Case for 3D Integrated System Design for Neuromorphic Computing & AI Applications
Eren Kurshan, Hai Li, Mingoo Seok, Yuan Xie,
International Journal of Semantic Computing, 2020, 14.04: 457-475.
https://arxiv.org/abs/2103.04852
3D Stacking for AI Systems: Emulating Heterogeneous 3D Architectures for AI
Eren Kurshan and Paul Franzon
IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol 15, No 6, pp. 1161-1170, June 2025
A Systems Perspective on 3D Design: What is it? What is it Good for?
Philip Emma and Eren Kurshan,
Pan Stanford Books, Chapter 1
Is 3D Chip Technology the Next Growth Engine for Performance Improvement?
Emma, P. G., & Kurshan, E. (2008)
IBM Journal of Research and Development, 52(6), 541-552.
Opportunities and Challenges for 3D Systems and Their Design
Philip Emma, Eren Kurshan
IEEE Design and Test of Computers, Volume 26, Issue 5, pp. 6-14, 2009
3D Stacking of High-Performance Processors
Philip Emma, Alper Buyuktosunoglu, Michael Healy, Krishnan Kailas, Valentin Puente, Roy Yu, Allan Hartstein, Eren Kurshan,
Pradip Bose, 2014 In Proceedings of IEEE 20th International Symposium on High Performance Computer Architecture
(HPCA), pp. 500-511, 2014
Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI Systems
Eren Kurshan and Paul Franzon
3DIC Conference, 2024, Sendai Japan
System Design & Optimization
Power and Thermal Characterization of POWER6 System
Víctor Jiménez, Francisco J Cazorla, Roberto Gioiosa, Mateo Valero, Carlos Boneti, Eren Kurshan, Chen-Yong Cher, Canturk Isci, Alper Buyuktosunoglu, Pradip Bose, In Proceedings of the 19th international conference on Parallel architectures and compilation techniques, 2010, pp. 7-18
Low-Overhead Core Swapping for Thermal Management
E Kurshan, G Reinman, S Sair, A Shayesteh, T Sherwood
Power-Aware Computer Systems: 4th International Workshop, PACS 2004 …
2005
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs
Y Chen, E Kurshan, D Motschman, C Johnson, Y Xie
IEEE/ACM International Symposium on Low Power Electronics and Design, 397-402
2011
Variation-aware thermal characterization and management of multi-core architectures
E Kurshan, CY Cher
IEEE International Conference on Computer Design, 280-285
2008