M. Musavi, E. Irabor, A. Das, E. Alarcón, S. Abadal, “Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators,” Proceedings of the ISCAS ’25, May 2025. [PDF]

E. Irabor, M. Musavi, A. Das, S. Abadal “Exploring the Potential of Wireless-Enabled Multi-Chip AI Accelerators,” Proceedings of the AccML Workshop (HiPEAC) 2025, Barcelona, Spain, January 2025. [PDF]

(these are publications that are not formally part of EWiC, but whose contents are very much relevant to the project)

A. Bandara, A. Das, F. Rodríguez-Galán, E. Alarcon, S. Abadal, “A MAC Protocol on Collective Communications with Time Reversal for Wireless Networks within Computing Systems,” Proceedings of the ACM NANOCOM ’24, Milan, Italy, October 2024. [PDF] 

R. Medina, J. Klein, G. Ansaloni, M. Zapater, S. Abadal, E. Alarcón, and D. Atienza, “System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms”, Proceedings of the ASP-DAC 2023, Tokyo, Japan, January 2023. [PDF] 

R. Guirado, A. Rahimi, G. Karunaratne, E. Alarcón, A. Sebastian and S. Abadal, "WHYPE: A Scale-Out Architecture with Wireless Over-the-Air Majority for Scalable In-memory Hyperdimensional Computing," IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 13, no. 1, 137-149, 2023. [PDF] 

S. Abadal, R. Guirado, H. Taghvaee, A. Jain, E. Pereira de Santana, P. Haring Bolívar, M. Saeed, R. Negra, Z. Wang, K-T. Wang, M. C. Lemme, J. Klein, M. Zapater, A. Levisse, D. Atienza, D. Rossi, F. Conti, M. Dazzi, G. Karunaratne, I. Boybat and A. Sebastian “Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors,” IEEE Wireless Communications Magazine, vol. 30, no. 4, pp. 162-169, 2023. [PDF]