When a PCB manufacturer has a finalized PCB design, the next consideration is the most cost-effective way to manufacture the components. However, non-standard or micro PCBs present a challenge as they cannot be handled by the conveyor belt.
To address this issue, manufacturers often use a PCB panelization technique. This process involves joining smaller circuit boards together to form a single assembly of standard panel sizes. The PCB array can then be easily processed through the pipeline, and manufacturers can perform operations of their choice across the entire panel.
Once the assembly is complete, the individual boards can be separated and finished, or assembled as needed. Alternatively, a handle plate edge can be formed around the assembly to allow for easy handling and processing. PCB panelization is a convenient and efficient manufacturing process that helps reduce costs and improve efficiency.
PCB panelization is a manufacturing process that involves joining together a stack of smaller circuit boards to form a single assembly of standard panel sizes. The process offers several benefits that make it an attractive option for PCB manufacturers.
One of the main advantages of panelization is cost reduction. The more components that can be mass-produced, the lower the cost per component. By using PCB panels, manufacturers can minimize the final price of their products. Additionally, standardization is critical for consistency in the industry. Expensive machines used to process electronic components require standard-sized panels to function properly.
Moreover, the panel structure protects the PCB from shock and vibration, which are usually associated with assembly and transport processes, leading to greater product safety. Mass production of individual components is also not practical, making PCB panels popular in the industry. Furthermore, the use of PCB panels helps minimize external stress on the board, resulting in higher product quality.
There are various panelization methods for PCBs, each with its own set of techniques. Here are the three main methods and the sub-boarding techniques that work best with each:
V-Groove Paneling The V-score or V-groove method involves making V-shaped cuts along the top and bottom edges of the panels, and the scale of the board is 1/3 the thickness. This technique is commonly used, and the machine's grippers are typically used to depanel it.
Sub-Boarding Techniques for V-Groove Paneling
Manual Deletion: Workers can use tools or jigs to cut or eject individual PCBs from a PCB panel. However, this may not be the most effective technique.
Die Cutting: A machine that uses pictures and custom-made blades to fit each different panel can separate the PCB panel into individual boards.
Sawing: A pizza-knife-like tool can cut individual circuit boards from PCB panels. However, this method is not very precise and is limited to standardized PCB panels.
Tab Routing With the tab routing method, narrow tabs interconnect the individual circuit boards, which can be destroyed or snapped to separate them. This is a simple technique that can be performed manually or by automation.
Sub-Boarding Techniques for Tab Routing
Manual Deletion: Workers can cut or eject individual PCBs from a PCB panel by hand with tools or jigs.
Die Cutting: A machine using pictures and custom-made blades can cut individual circuit boards from the PCB panel.
Sub-Board Router: This machine cuts circuit boards from PCB panels using a spindle with a cutter.
Entity Tab Panel This method designs PCB arrays with solid tabs between each other, making the PCB panel stronger and reducing the effect of external stress. However, this approach limits the choice of stripping techniques to routers, laser cutters, and shaped blade tools.
Sub-Boarding Techniques for Entity Tab Panel
Die Cutting: A machine using pictures and custom-made blades can separate the PCB panel into individual boards.
Laser Cutting: This technique precisely cuts unusual shapes and is used by PCB manufacturers to separate custom-sized PCB panels or panels with miniature PCBs. However, it is not suitable for plates thicker than 1mm.
It's essential to know which panelization method to use when designing a PCB panel. V-groove paneling is not suitable for closely spaced elements, and tab routing results in rougher board edges. Die cutting, sawing, and cutting with a sub-board router are typically the best techniques for large-scale but standardized production.
Planning PCB panels is an essential part of the design process for PCB manufacturers. Designers need to carefully consider the constraints and limitations of paneling to ensure that the final product is both affordable and automated. Here are some essential tips to keep in mind when planning PCB panels.
Design Considerations:
Clearances - Designers should pay attention to the clearances between components and edges. Smaller gaps require more precise methods, and edge processing components can limit traditional panel separation methods.
Board Edge Clearance - There should be at least 0.05 inches of clearance between the component and the V-groove. Surface mount multilayer chip capacitors must be kept 1/8 inch from the scribe line. Components with large connection areas should be placed away from the grooves to prevent de-board stress from breaking the solder joint.
Jump Scores - To strengthen the array, designers should add jump scores. These are 1/2 inch separation edges on the leading and trailing sides, with V-grooves cut halfway through them. Separation edges must be removed before separating the board.
Follow Industry Standards - In cases where you are unsure of the correct parameters to set, follow industry standards.
Element Considerations:
Sensitive Electronics - Sensitive connectors and electronics can easily be damaged if placed incorrectly, especially near the V-groove. Designers should avoid placing sensitive electronics near the V-groove.
Material Considerations:
Choice of Panelization Method - The choice of panelization method largely depends on the material of the PCB. Some materials are prone to chipping during the opening process. The quality of the laminate and solder paste can also affect the final result.
Board Thickness - Board thickness is another factor to consider. Thicker boards of fragile material are more difficult to separate.
In conclusion, careful consideration of design, element, and material factors is necessary when planning PCB panels. By keeping these tips in mind, designers can ensure that the final product is both affordable and automated while maintaining the integrity of the PCB.