The 1st International Workshop on Edge AI and IoT (EAI-IoT 2025)
Aug. 7, 2025, Tokyo, Japan
In Conjunction with the 34th ICCCN
Aug. 7, 2025, Tokyo, Japan
In Conjunction with the 34th ICCCN
The International Workshop on Edge AI and IoT aims to provide a comprehensive forum for discussing the convergence of artificial intelligence (AI) with edge computing and the Internet of Things (IoT). The workshop will focus on the integration of artificial intelligence (AI) at the edge of networks to enhance IoT systems. This workshop will explore how edge computing can efficiently manage data generated by IoT devices while reducing latency and bandwidth demands, ensuring real-time responsiveness in distributed environments. Key areas of discussion will include scalable edge AI architectures, federated learning for secure data processing, and communication protocols optimized for resource-constrained edge nodes. Emphasizing crosslayer design, resource management, and security, this workshop aligns with ICCCN’s commitment to advancing the performance and reliability of communication networks and distributed systems. By addressing both theoretical models and practical implementations, the workshop seeks to drive innovative solutions in edge AI and IoT that improve network performance and real-world applications like smart cities, autonomous systems, and healthcare.
Important Dates
Submission Deadline: March 1, 2025
Acceptance Notification: May 10, 2025
Camera-ready: June 2, 2025 (Hard deadline)
Registration
TBA
Conference Venue and Travel Information
Please refer to ICCCN 2025 for hotel and travel information.
Instructions for Authors
Submitted manuscripts must be formatted in standard IEEE camera-ready format (double-column, 10-pt font) and must be submitted via EDAS as PDF files (formatted for 8.5x11-inch paper). The manuscripts should be no longer than 6 pages. Submitted papers cannot have been previously published in or be under consideration for publication in another journal or conference. The workshop program committee reserves the right to not review papers that either exceed the length specification or have been submitted or published elsewhere. Submissions must include a title, abstract, keywords, author(s) and affiliation(s) with postal and e-mail address(es).
Submission link: https://easychair.org/conferences/?conf=icccn2025
Review and Publication of Manuscripts
Submitted papers will be reviewed by the workshop program committee and judged on originality, technical correctness, relevance, and quality of presentation. An accepted paper must be presented at the ICCCN 2025 venue by one of the authors registered at the full registration rate. Each workshop registration covers up to two workshop papers by an author. Accepted and presented papers will be published in the ICCCN proceedings and submitted to IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. IEEE reserves the right to exclude a paper from distribution after the conference, including IEEE Xplore® Digital Library if the paper is not presented by the author at the conference.
ICCCN 2025 Paper Submission Terms and Conditions
Authors declare that the submission is original and has not been submitted to other venue or under consideration by other venues.
Paper titles and/or author names cannot be changed and/or added to the papers once papers are submitted to ICCCN 2025 for review and in the final camera-ready manuscript.
If the paper is accepted, at least one of the authors must register at full rate and present it in person at the conference. Accepted and paid paper(s) but not presented onsite by the registered author(s) (for any reason, including visa issues, travel problems, etc.) will be published in the conference proceedings only. We strongly encourage that all authors of accepted papers apply for entry visa to USA in case one author cannot get the entry visa.
Workshop Organizers
Program Chairs:
Shuhui Yang, Purdue University Northwest, USA
Ki-II Kim, Chungnam National University, Republic of Korea
TPC Members (Tentative)
Suman Bhunia, Miami University, USA
Yu Chen, Binghamton University, USA
Mina Guirguis, Texas State University, USA
Hong Jiang, Miami University, USA
Tae-Hoon Kim, Purdue University Northwest, USA
Wei Li, Chinese Academy of Sciences, China
Anyi Liu, Oakland University, USA
Bo Luo, The University of Kansas, USA
Alexander Schwing, University of Illinois Urbana-Champaign, USA
Hamza Soury, University of Illinois at Chicago, USA
Xuefeng Xi, Suzhou University of Science and Technology, China