Dr. SATYANARAYAN

Publications ( Peer Reviewed International Journal Papers)

Satyanarayan and K.N.Prabhu, “Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solder on copper substrates with different surface textures,” Journal of ASTM International, Vol. 7(9), 2010, JAI103052 (American Society for Testing and Materials Publications, Impact Factor (IF) 1.33). https://www.astm.org/jai103052.html

Satyanarayan and K.N Prabhu, “Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates”, Materials Science and Technology, 27(7) (2011), 1157-62 (Maney Publications, UK acquired by Taylor & Francis Group, RG Journal IF: 1.8). https://doi.org/10.1179/026708310X12815992418337

Satyanarayan and K.N. Prabhu, “Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy,” Advances in Colloid and Interface Science, 166 (2011) 87-118 (Ranked 10th among the top 25 hottest articles by Science Direct, July to September 2011). (Elsevier Publications, IF 15.6). https://doi.org/10.1016/j.cis.2011.05.005

Satyanarayan and K.N. Prabhu “Wetting Characteristics of Sn-0.7Cu lead-free solder alloy on copper substrates,” Materials Science Forum 710 (2012), 569-574 (Trans Tech Publications, IF 0.48) https://doi.org/10.4028/www.scientific.net/MSF.710.569

K. N. Prabhu, Parashuram Deshapande and Satyanarayan, “Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, impact and tensile properties,” Materials Science and Engineering A, 553 (2012), 64-70 (Elsevier Publications, IF 6.4). 10.1016/j.msea.2011.11.035

Satyanarayan and K. N. Prabhu “Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrate,” Journal of Materials Science: Materials in Electronics 23 (2012), 1-9 (Springer Publications, IF 2.8). https://doi.org/10.1007/s10854-012-0644-6

K. N. Prabhu, M. Varun and Satyanarayan, “Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel coated aluminium substrate,” Journal of Materials Engineering and Performance, 22 (2013), 723–728 (Springer Publications, IF 2.3). https://doi.org/10.1007/s11665-012-0339-4

Vignesh U. Nayak, K. N. Prabhu, Nicole Stanford and Satyanarayan, “Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates, Transactions of the Indian Institute of Metals 65(6) (2012), 713–717 (Springer Publications, IF 1.6). https://doi.org/10.1007/s12666-012-0193-y

Satyanarayan and K. N. Prabhu, “Reactive wetting of Sn-2.5Ag-0.5Cu solder on copper and silver coated copper substrates,” Journal of Materials Science: Materials in Electronics, 24 (2013), 1714 – 1719 (Springer Publications, IF 2.478).

Satyanarayan and K.N. Prabhu, “Comparison of spreading behaviour and development of interfacial microstructure in Sn-0.7Cu, Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu lead-free solder alloys on Fe-42Ni substrate,” Materials Science and Technology 29(4) (2013) 464-473 (Maney Publications, UK, acquired by Taylor & Francis Group,RG Journal Impact: 1.8). http://dx.doi.org/10?1179/1743284712Y.0000000162

Satyanarayan and K. N. Prabhu, “Study of Reactive Wetting of Sn-0.7Cu and Sn-0.3Ag-0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates,” World Academy of Science, Engineering and Technology, International Journal of Materials and Metallurgical Engineering, 73(2013), 952-955. doi.org/10.5281/zenodo.1073036

Pradeep Bhagwath, K.N. Prabhu and Satyanarayan, “Wetting behavior of reactive and non–reactive wetting of liquids on metallic substrates”, World Academy of Science, Engineering and Technology, International Journal of Materials and Metallurgical Engineering 73 (2013), 978-981. doi.org/10.5281/zenodo.1063356

N.V. Ballal, A. Tweeny, K. Khechen, K. N. Prabhu, Satyanarayan and F. R. Tay “Wettability of Root Canal Sealers on Intraradicular Dentine Treated with Different Irrigating Solutions, Journal of Dentistry 41(6) (2013), 556-560 (Elsevier Publications, IF 4.4). https://doi.org/10.1016/j.jdent.2013.04.005

Satyanarayan and K. N. Prabhu “Spreading behaviour and evolution of IMCs during reactive wetting of SAC solders on smooth and rough copper substrates,” Journal of Electronic Materials 42(8) 2013 2696-2707 (Springer Publications, IF 2.1). 10.1007/s11664-013-2619-7

Satyanarayan and K. N. Prabhu “Solder joint reliability of Sn-0.7Cu and Sn-0.3Ag-0.7Cu lead-free solder alloys solidified on copper substrates with different surface roughness,” Materials Science and Technology 29(12) (2013), 1430-1440 (Maney Publications, UK, acquired by Taylor & Francis Group, RG Journal Impact: 1.8). ttps://doi.org/10.1179/1743284713Y.0000000287

Satyanarayan and K.N. Prabhu, “Wetting behavior of Lead free solders on copper substrates,” Vol.1, pp. 3-5, March 2013. IET Digital Library, DOI: 10.1049/cp.2013.2550, ISBN: 978-1-84919-868-4

Kiran N. Bhat, K. N. Prabhu and Satyanarayan, “Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds”, Journal of Materials Science: Materials in Electronics, 25(2), (2014) 864-872 (Springer Publications, IF 2.8). DOI10.1007/s10854-013-1658-4

Satyanarayan and K.N. Prabhu “Solder joint reliability of Sn-Cu and Sn-Ag-Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses,” Materials Science Forum, Vols. 830-831, (2015). pp. 265-269 (Trans Tech Publications, IF 0.48) https://doi.org/10.4028/www.scientific.net/MSF.830-831.265

Satyanarayan, S. Tanaka, A. Mori and K. Hokamoto, "Welding of Sn and Cu Plates Using Controlled Underwater Shock Wave", Journal of Materials Processing Technology, Vol 245, July 2017, Pages 300–308. (Elsevier Publications, IF 6.3) https://doi.org/10.1016/j.jmatprotec.2017.02.030

Satyanarayan and Jayaram Bhat, “Recent Advances on Al-Sn Alloys with Ternary Alloying Elements”, Research and Development in Material Science 4(3), 2018. (Crimson Publishers) 10.31031/RDMS.2018.04.000587

Satyanarayan, A. Mori and K. Hokamoto “Underwater shock wave weldability window for Sn-Cu plates” Journal of Materials Processing Technology Vol 267, May 2019, Pages 152-158, (Elsevier Publications, IF 6.3). https://doi.org/10.1016/j.jmatprotec.2018.11.044

Satyanarayan, Kumaraswamy and K. N. Prabhu, “The effect of thermal ageing on solder/substrate interfacial microstructures during reflow of Sn-37Pb and Sn–3Ag–0.5Cu”, Transactions of the Indian Institute of Metals, Jan 2019, pp. 1-5, (Springer Publications, IF 1.6). https://doi.org/10.1007/s12666-019-01583-6

Satyanarayan and Jayaram Bhat, "Effect of Cooling Medium on Microstructure, Impact and Hardness Properties of Al-15Sn Alloy" Transactions of the Indian Institute of Metals, April 2019, pp. 1-7 (Springer Publications, IF 1.6). https://doi.org/10.1007/s12666-019-01670-8

Satyanarayan, S. Tanaka and K. Hokamoto, "Underwater Explosive Welding of Tin and Aluminium Plate" Materials Research Proceedings, Vol. 13, pp 149-153, 2019, Materials Research Forum LLC., Millersville PA, USA https://doi.org/10.21741/9781644900338-25

Kumaraswamy M C and Satyanarayan, "A Review on Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications", Journal of Electronic Materials 42 (9) (2019) pp. 1-12 (Springer Publications, IF 2.1). https://doi.org/10.1007/s11664-019-07623-7

Book Chapter : Satyanarayan, S. Tanaka, A. Mori and K. Hokamoto, "Explosive Welding of Sn and Al Plates Using Controlled Underwater Shock Wave" (Book Chapter-ISBN:978-1-53618-342-9) (https://novapublishers.com/shop/recent-advances-in-welding/) October 2020

Shankarappa Kalgudi, Pavithra G P, K N Prabhu, Praveennath G Koppad, Venkate Gowda C, and Satyanarayan, "Effect of Surface Treatment on Wetting Behavior of Copper", Materials Today Proceedings, Vol 3, P3, 2021, pp 295 (Elsevier Publications IF 2.59 ). https://doi.org/10.1016/j.matpr.2020.01.379

Jayaram Bhat and Satyanarayan "A Review on Effect of Alloying Elements and Heat Treatment on Properties of Al-Sn Alloy" Materials Today Proceedings Vol 3, P3, 2021, pp 340 ISSN 2214-7853 (Elsevier Publications, IF 2.59). https://doi.org/10.1016/j.matpr.2020.01.617

Kumaraswamy M C and Satyanarayan "Study on Thermal Resistance of Brass with and without coating of Metallic surface" Materials Today Proceedings Vol 3, P3, 2021, pp 335, ISSN 2214-7853 ( Elsevier Publications, IF 2.59 ) https://doi.org/10.1016/j.matpr.2020.02.076

Rashmi K. R, Arjun S Rao, Satyanarayan, Veena Devi, Shastrimath V, Jayarama A, Richard Pinto, "Simulation and analysis of P(VDF-TrFE) cantilever-beams for low frequency applications" Materials Today Proceedings Vol 3, P3, 2021, pp 335, ISSN 2214-7853 (Elsevier Publications, IF 2.59) https://doi.org/10.1016/j.matpr.2020.02.698

Preetam Castelino, A. Jayarama, Satyanarayan, Peter Fernandes, Shriganesh Prabhu, Siddhartha Duttagupta, Richard Pinto, "Role of UV irradiated nafion in power enhancement of hydrogen fuel cells", International Journal of Hydrogen Energy, Vol 46, Issue 50, 2021, pp. 25596-2560 (Elsevier Publications, IF 7.2) https://doi.org/10.1016/j.ijhydene.2021.05.058

Rajath Raj U.K, Saurav Manikantan, Likhith Poojary, Vaishnav, Satyanarayan,"An Influence of Substrate Thickness on Electrical Conductivity of Dip-soldered Copper Joints", Journal of Mines, Metals & Fuels (JMMF), Vol.69, No.12a, December, 2021 (Scopus) https://i-scholar.in/index.php/jmmf/article/view/217772/0

Srushti S Shetty, Shashidhara Bhat, Iddya Karunasagar, Richard Pinto, Satyanarayan,“A review on metal-oxide based trace ammonia sensor for detection of renal disease by exhaled breath analysis”, Materials Today: Proceedings, Vol. 55, Part 1, 2022, Pages 113-117, ISSN 2214-7853 (Elsevier Publications, IF 2.59). https://doi.org/10.1016/j.matpr.2021.12.411

Kumar Swamy M C, Satyanarayan, Richard Pinto, “Study on Thermal Contact Resistance of Low Melting Alloy used as Thermal Interface Material' Materials Today: Proceedings, Vol. 66, Part 4, 2022, Pages 2508-2512 (Elsevier Publications, IF 2.59). https://doi.org/10.1016/j.matpr.2022.06.581

Kumar Swamy M C, Satyanarayan, Richard Pinto, “Characterisation and Investigation of Performance of Sn-Bi Alloy Used as a Thermal Interface Material" Journal of Materials Science: Materials in Electronics (JMSE), (2023) 34:1077 (Springer Publcations, IF 2.99). https://doi.org/10.1007/s10854-023-10480-0

Poornima Hulipalled, Veerabhadrappa Algur, Veerabhadraiah Lokesha, Sunil Saumya, Satyanarayan, “Interpretable Ensemble Machine Learning Framework to Predict Wear Rate of Modified ZA-27 Alloy”, Tribology International, Vol. 188, 2023, 108783 (Elsevier Publications, IF 6.2). https://doi.org/10.1016/j.triboint.2023.108783

Kusammanavar Basavaraj, K Elangovan, Shankar S, Satyanarayan, “Effects of Al2O3 Concentration in Ethylene Glycol on Convection Heat Transfer Coefficient”, International Journal of Vehicle Structures & Systems, 15(3) 2023 (Scopus) https://doi.org/10.4273/ijvss.15.3.12

Kusammanavar Basavaraj, K Elangovan, Shankar S, Anand Kulkarni, Satyanarayan, “Effects of Reynolds Number on the Volume Concentration of Al2O3 in Ethylene Glycol”, International Journal of Vehicle Structures & Systems, 15(3) 2023 (Scopus) https://doi.org/10.4273/ijvss.15.3.13

**PATENT GRANTED ( Indian Patent No: 487817 Date of Grant: 22.12.2023, Application Number- 201941035383) Preetham Castelino, Sohan Poojari, Sunny Ramniwas Sharma, Poojari Prashant Shekar, Chirag Satish Poojari, Jayarama Arasalike, Satyanarayan, Richard Pinto, Shriganesh Prabhu, Siddhartha Prakash Duttagupta- INVENTION TITLE - "A Process for Enhancing Hydrogen Fuel Cells Performance Fuel Cells Performance With NAFION Proton Exchange Membrane Optimal". (Date of Filing 03/09/2019)

**PATENT FILED: (Application Number- TEMP/E-1/8519/2024-CHE, 202441007383, filed date 03/02/2024) Richard Pinto, Jayarama Arasalike, Satyanarayan, Shriganesh Prabhu, Siddhartha Prakash Duttagupta, Arnab Datta, Sanjog Nagarkar, INVENTION TITLE - "A Novel Photocatalytic Hydrogen Fuel Cell Device with In-Situ Hydrogen Generation" (Applied February 2024).

Book Chapter 1: Kambeyanda Rahul Machaiah, Satyanarayan, Shigeru Tanaka Daisuke Inao and K. Hokamoto “Underwater Explosive Welding of Tin and Nickel Plates and Characterization of Their Interfaces” Book : Advanced Joining Technologies, (Taylor & Francis, CRC Press), 1st Edition, 13 March 2024, eBook ISBN9781003327769, Pub. Location: Boca Raton, https://doi.org/10.1201/9781003327769

Book Chapter 1: Satyanarayan, Veerabhadrappa Algur, Kusammanavar Basavaraj, “Effect of heat treatment and it’s behavior on mechanical properties of Pure Titanium”, Futuristic Trends in Mechanical Engineering, e-ISBN: 978-93-5747-352-1, IIP Series, Volume 3, Book 3, Part 5, pp. 219-228, 2024. https://www.doi.org/10.58532/V3BIME3P5CH1

Book Chapter 3 : Kusammanavar Basavaraj, K Elangovan, Veerabhadrappa Algur, Satyanarayan, "Sedimentation Method To Evaluate Stable Cuo Based Nanofluid For Heat Transfer Applications", IIP Series, Futuristic Trends in Mechanical Engineering, Volume 3, May, 2024, Page no.30-46, e-ISBN: 978-93-5747-352-1, https://www.doi.org/10.58532/V3BIME3P1CH3

Chiranth H.S, Pavan Kumar H.R, Sachin Rathod, Karnam Manojkuma Y, Satyanarayan, Basavaraj Kusammanavar, “A Review on Optimum Substrate Surface Roughness to Create Better Wetting”, Materials Open Research, 21/02/2024, 3:5 (https://doi.org/10.12688/materialsopenres.17683.1)

***PATENT GRANTED ( Indian Patent Design Application No: 416786-001, Cbr Number: 208174, Design No: 416786-001 Date of Grant: 13.5.2024) Dr. Poornima Hulipalled, Dr. Veerabhadrappa Algur, Dr. Deena Sunil, Dr. V. Lokesha, Dr. Satyanarayan, Mr. Kshitish Kumar Mohanta, Dr. Jyoti Shinde, Mr. Vishal Chaubey, INVENTION TITLE - "Alloy Testing Design".

Satyanarayan, Kazuyuki Hokamoto, Shigeru Tanaka, Akihisa Mori and Daisuke Inao, "The effect of interfacial morphology and weldability window on tin and aluminium plates welded plates using regulated water Shockwaves", Welding in the World, Vol. 68, 2941-2951, 12.09.2024 (Springer Publications, Q1, IF 2.4, 26.3.2025 https://link.springer.com/article/10.1007/s40194-024-01834-1

Chennaveera Swamy J M, Veerabhadrappa Algur, Satyanarayan, Kumar Swamy M.C. "Effect of Casting Moulds on Grain Morphology, Mechanical and Tribological Property of Sn-Cu Alloy" Bulletin of Materials Science, 48 (52), 2025, 1-7 (Springer Publications, Q3, IF 1.9, 26.3.2025) https://doi.org/10.1007/s12034-025-03412-7

Bhat Jayarama, Satyanarayan, B.H. Vadavadagi, Gouda Shivakumar, Algur Veerabhadrappa "Effect of Heat Treatment on Mechanical Properties of Aluminum Tin (Pb Free) Bearing Material" , Materials Research Proceedings, 55 (2025) 7-1, Materials Research Forum LLC https://doi.org/10.21741/9781644903612-2

Kusammanavar Basavaraj, Satyanarayan, Anand Kulkarni, "Optimization of Process Parameters in Explosive Welding Using Machine Learning" Materials Research Proceedings, 55 (2025) 51-56, Materials Research Forum LLC https://doi.org/10.21741/9781644903612-9

A Gyanesh Kumar Rao, Satyanarayan, Suresh Ganesh Kulkarni, “Implosive Reactive Armour to enhance explosive welding on hard surfaces in modern warfare” Materials Research Proceedings, 55 (2025) 79-84, Materials Research Forum LLC https://doi.org/10.21741/9781644903612-13

Satyanarayan, K Narayan Prabhu, Lead-Free Solders For High-Temperature Applications, Materials Research Proceedings, 55 (2025) 136-140, Materials Research Forum LLC https://doi.org/10.21741/9781644903612-20

Kumar Swamy M C, Satyanarayan, "Characterization and Thermal Performance of Sn-Bi Alloy Used as a Thermal Interface Material" Materials Research Proceedings, 55 (2025) 148-155, Materials Research Forum LLC https://doi.org/10.21741/9781644903612-22

Kusammanavar Basavaraj, K Elangovan, Satyanarayan, “Experimental Analysis of Stability of Copper Oxide (CuO) Nanofluids Using Sedimentation Method", Novel Materials and Technologies for Energy and Environment Applications, Volume 1. NMTE2A 2024. Springer Proceedings in Materials, vol 77 (27.7. 2025). Springer, Singapore. https://doi.org/10.1007/978-981-96-6107-7_15

Abhishek B, Jayarama A, Satyanarayan, Shashi Kumar Kumara Swamy, M. G. Ananda Kumar, Sriganesh S. Prabhu, Richard Pinto, Enhanced Durability of Nafion Membranes for Hydrogen Fuel 2 Cells, Chemical Engineering Journal (UNDER CONSTRUCTION)

Jayaram Bhat and Satyanarayan "Effect of Nickel as an Alloying Element on Grain Morphology and Mechanical Properties of Al-15Sn Alloy" (UNDER CONSTRUCTION )
Satyanarayan, Shigeru Tanaka,, Kazuyuki Hokamoto, "Characterisation of Interfacial Morphology of Explosive Welded Tin and Copper Plates" (UNDER CONSTRUCTION)
M G Anandakumar and Satyanarayan, "A Review on Hydrogen: Its Embrittlement, Handling Systems, and Improved Welding Techniques for Structural Integrity (UNDER CONSTRUCTION)

PREPRINT: Satyanarayan, Rajath Raju, Veerabhadrappa Algur, Kumar Swamy M.C., Jayarama A, Kusammanavar Basavaraja, "An Investigation on Effects of Modes of Cooling on Mechanical Property of Sn-Cu Alloy", 19th May 2023, PREPRINT (Version 1) available at Research Square https://doi.org/10.21203/rs.3.rs-2943612/v1 (This is a preprint; it has not been peer-reviewed by a journal. )

Other International Journals

Suhail Khan, S. C Hegde, Pratheek S, S. Shettigar and Satyanarayan, “Effect of Sonication Time, Concentration, Shape and Size of Nano Particle on Thermal Conductivity of Al2O3 /Water Nano Fluid”, International Journal of Engineering Research & Technology (IJERT), (2015) pp. 141 - 144

Hithesh G Shetty, Ranjan Kishor, Navaneeth P, Kishore, Satyanarayan "Interfacial reaction between liquid tin and solid metals", International Journal of Science & Engineering Development Research, Vol.3, Issue 5, page no.186 - 189, May-2018.

Varun Kumar B, Ganesha M S, Basavaraj A Patil, Acharya Sudarshan, Jayaram Bhat, Satyanarayan "Effect of heat treatment on tribiological properties of Al-Sn alloy", International Journal of Science & Engineering Development Research, Vol.3, Issue 5, page no.398 - 402, May-2018.

Koushik N. , Jameson Keisham, Avinash Poojary, Lathesh, Shankarappa Kalgudi, Pavithra G.P., Satyanarayan, "Electrochemical Etching on Copper Surfaces to Achieve Superhydrophobicity", International Journal of Manufacturing and Materials Processing, Vol.3, Issue 1, 2019, Page no. 1-6.

Prasanna S Y, Moinodin Sha, Kalyan Kumar, Shreedhar B, Veerendra Kumar, Satyanarayan, "Effect of Casting Moulds on Tribological Properties of Al−Sn Alloy", International Journal for Research Trends and Innovation, Vol.4, Issue 5, page no.15 - 18, May - 2019.

Veerabhadrappa Algur,, Vithal Rao Chavan, C Thotappa, Latha B, Satyanarayan, Poornima Hulipalled, V Lokesha, “Multicriteria Optimization in Drilling Process of Glass Fibre Reinforced Polymer Using Grey Based Taguchi Analysis” International Journal of Manufacturing and Materials Processing, Vol. 8, Issue 2, 2022, ISSN: 2582–5046

Satyanarayan, Chiranth. H .S, Paigambar Nadaf, Akhil Sharma, Veerabhadrappa Algur, Kumarswamy M C, "A Study on Stress Analysis of Aluminium Alloy Solidified in Metallic Moulds", International Journal of Manufacturing and Materials Processing. 10(02), 2024, p. 10-15.

International Conference (Papers Presented/Proceedings)

Satyanarayan, K.N. Prabhu and Kumar, G: “Wetting behaviour and evolution of microstructure of Sn-1.75Ag-4.5Zn solder,” Proceedings of the International Conference on Recent Trends in Materials and Characterization (RETMAC) 2010, 14-15 February 2010, NITK, Surathkal.

Satyanarayan and K. N. Prabhu: “Wetting behaviour of Sn-Ag-Zn solders on silver coated copper substrates,” Proceedings of NMD-ATM 2010, 14-16 November 2010, IISc, Bangalore.

Satyanarayan and K.N. Prabhu, “Wetting behavior of Sn-Ag-Zn solders on Zinc coated copper substrates,” Proceedings of the 8th International Symposium on Surface Protective Coatings and Paint Expo 2011, The Society for Surface Protective Coatings (SSPC), , 3-5, March 2011, New Delhi.

Satyanarayan and K.N. Prabhu, “Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates,” Proceedings of the International Conference on Advences in Metallic materials and Manufacturing processes for strategic sectors (ICAMPS 2012), January 19-21, 2012, Trivendrum, Kerala.

Vignesh U. Nayak, K. N. Prabhu, Nicole Stanford and Satyanarayan, “Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates, Proceedings of the 5th International Conference on Solidification Science and Processing (ICSSP5), November 19‐22, 2012, Bhubaneswar.

Satyanarayan and K.N. Prabhu, “Study of reactive wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu lead free solders during solidification on nickel coated Al substrates,” Proceedings of the International Conference on Aerospace, Mechanical, Automotive and Materials Engineering (ICAMAME 2013), January 30-31, 2013, Dubai, UAE. (DST Sponsered)

Pradeep Bhagwath, K.N. Prabhu and Satyanarayan, “Wetting behavior of reactive and non–reactive wetting of liquids on metallic substrates”, Proceedings of the International Conference on Aerospace, Mechanical, Automotive and Materials Engineering (ICAMAME 2013), January 30-31, 2013, Dubai, UAE.

Satyanarayan and K.N. Prabhu, “Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses,” Proceedings of the International Conference on Advances in Metallic materials and Manufacturing processes for strategic sectors (ICAMPS 2015), May 13-15, 2015, Trivendrum, Kerala.

Hithesh G Shetty, Kumarswamy M C and Satyanarayan, “Effect of Reflow and Isothermal Aging Temperature on Sn-Pb and Pb-free Solder/Substrate Interfacial Regions”, 12th International Student Conference on Advanced Science and Technology (ICAST 2017), 23 - 25 November, 2017, Taiwan.

Sandesh G Shetty, Kumar Swamy MC and Satyanarayan, “Study Of Thermal Resistance On Interface Materials”, 12th International Student Conference on Advanced Science and Technology (ICAST 2017), 23 - 25 November, 2017, Taiwan.

Hithesh G Shetty, Santosh A Goudar and Satyanarayan, “Assessment of Mechanical Properties of Hair Fibre Reinforced Polymer Composite” International Conference on Recent Vistas In Science and Technology and Its Relevance To Biological Sciences, 2nd March 2018, Alva’s college, Vidyagiri, Moodabidri.

Kumar swamy M C and Satyanarayan, “Assessment of Thermal Contact Resistance for Brass and Bronze Metal Alloys”, 7th International Engineering Symposium - IES 2018, March 7-9, 2018, Kumamoto University, Japan.

Satyanarayan, Kumarswamy M C and K.N. Prabhu, “Reflow and Thermal Aging Effects on Sn-37Pb and Sn–3Ag–0.5Cu Solder/Cu Substrate Interfacial Microstructure" International Conference on Advances in Metallic materials and Manufacturing processes for strategic sectors (ICAMPS 2018), October 25-27, 2018, Trivendrum, Kerala.

Hithesh G Shetty, Ranjan Kishor, Virendra Kumar and Satyanarayan, "Investigation on Diffusion between Liquid Tin and Substrates for Electronic Applications", 7th World Conference on Applied Sciences, Engineering & Management (WCSEM) 26-27 October 2018, ABS-Paris, France.

Harsha Raj and Satyanarayan, "Review on High-temperature Pb-free Solder Alloys", 8th International Engineering Symposium - IES 2019, March 13-15, 2019, Kumamoto University, Japan .

Sagar B S, Satyanarayan and Prashanth N, "Study on Stress Analysis and Fatigue Damage Calculation for Civilian Aircraft Wing Attachment Bracket", 8th International Engineering Symposium - IES 2019, March 13-15, 2019, Kumamoto University, Japan.

Satyanarayan (Keynote on) "Overview on Diffusion between Solder and Base Metals for Electronic Applications", in International Conference on Laser Deposition (iCOLD) held at Alva's Institute of Engineering and Technology, in Association with Indian Institute of Technology Madras (IITM) during November 27-29, 2019.

Kumarsway M C and Satyanarayan "Study on Thermal Resistance of Brass with and without coating of Metallic surface" presented in "International Conference on Laser Deposition (iCOLD)" held at Alva's Institute of Engineering and Technology, in Association with Indian Institute of Technology Madras (IITM) during November 27-29, 2019 (BEST Poster Presentation AWARD - 1st Place) -

Satyanarayan (Invited Talk) "Study on Interfacial Reaction between Liquid Tin and Metallic Substrates" in 3rd International Conference on Material Strength and Applied Mechanics (MSAM 2020, Online Conference, December 6-9, 2020), China

Rajath Raj, U K, Saurav Manikantan, Satyanarayan, "Investigation on Effect of Casting Mould on Tribological and Mechanical Properties of Al-Sn Alloys" in International Conference on Frontiers in Engineering, Science, and Technology (ICFEST-2020), December 18-19, 2020,Organized By Dept. of Mechanical Engg, Yenepoya Institute of Technology (YIT), Moodbidri

Kumarswamy M C and Satyanarayan, “Study on Thermal Contact Resistance of Low Melting Alloy used as Thermal Interface Material" presented in " International Conference on Recent Advances in Engineering Materials (ICRAEM - 2022, Online)" held at Alva's Institute of Engineering and Technology in Association with Diligentec Solutions during Online) during 03 – 05, March 2022 (Best Paper Award).

Satyanarayan “Effect of Cooling Modes on Mechanical Property of Sn-0.7Cu Solder Alloy” The 5th International Conference on Material Strength and Applied Mechanics (MSAM 2022), August 19-22, 2022 Qingdao, Shandong, China (Best Paper Presentation Award).

Chiranth H S,Veerabhadrappa Algur, Kusammanavar Basavaraj, Satyanarayan,“An Influence of Mould Geometries on Mechanical Properties of Solidified Aluminium Alloy – A Simulation Study” The 17th International Student Conference on Advanced Science and Technology (ICAST 2022), December 1 – 2, 2022, Kumamoto University, Japan, (Research Session),

Kumarswamy and Satyanarayan,“Assessment of Thermal Contact Resistance for low melting Alloys” The 17th International Student Conference on Advanced Science and Technology (ICAST 2022), (Research Session), December 1 – 2, 2022, Kumamoto University, Japan,

Akshar N, Kumarswamy and Satyanarayan,“Study of Thermal Resistance on Interface Materials” The 17th International Student Conference on Advanced Science and Technology (ICAST 2022), (Research Session), December 1 – 2, 2022, Kumamoto University, Japan,

Kumarswamy and Satyanarayan, (Invited Talk) “A Characterization and Investigation on Thermal Performance of Low Melting Alloys (LMAs) as Thermal Interface Materials (TIMs)” International Conference on Laser Deposition (iCOLD) Defence Institute of Advanced Technology (DIAT), Pune, March 23 – 25, 2023.

Chennaveera Swamy J M, Satyanarayan, Veerabhadrappa Algur and Kumarswamy M C, “Effect of Cooling Media on Mechanical Properties of Sn-Cu Solder Alloy”, PFAM29, 6th September to 8th September 2023, IIT Tirupati.

Chiranth H S, Veerabhadrappa Algur, Satyanarayan, “Effect of Metallic Mould Geometry on Microstructure and Mechanical Property of Solidified Pure Tin”, 18th to 20th September 2023, International Student Conference on Advanced Science and Technology (ICAST), Organized by: Hasanuddin University, Makassar, Indonasia in association with Kumamoto University, Japan,

Akshar N, Kumarswamy M C, Satyanarayan, “An Investigation on Effect of Heat Treatment on Pure Titanium (Grade 2) and its behavior on Wear Properties” 18th to 20th September 2023, International Student Conference on Advanced Science and Technology (ICAST 2023), Organized by: Hasanuddin University, Makassar, Indonasia in association with Kumamoto University, Japan.

Satyanarayan, K Hokamoto "An Effect of Isothermal Aging Characteristics on Explosive Welded Sn/Cu Plates Using Regulated Underwater Shockwaves” the International Symposium on Advanced Materials for Extreme Environments (AMEE), Beijing, organized by Beijing Institute of Technology, China, August 18-20, 2023 (Online)

Kusammanavar Basavaraj, K Elangovan, Satyanarayan, “Experimental Analysis of Stability of Copper Oxide (CuO) Nanofluids Using Sedimentation Method”. 2nd International Conference on Novel Materials and Technologies for Energy and Environment Applications (NMTE2A), 17th and 18th February 2024, BITS Pilani, Hyderabad

National Conference (Papers Presented/Proceedings)

Satyanarayan and K.N. Prabhu, “Wetting behavior of Lead free solders on copper substrates,” Proceedings of National Conference on Recent Trends in the Coming Decades (CRT-2013), 27-28 Sept. 2013 Ujire, India, Vol.1, pp. 5,3-5, March 2013. IET Digital Library, DOI: 10.1049/cp.2013.2550, ISBN: 978-1-84919-868-4

Suhail Khan, S. C Hegde, Pratheek S, S. Shettigar and Satyanarayan, “Effect of sonication time, concentration, shape and size of nano particle on thermal conductivity of Al2O3 /water nano fluid”, National conference on Emerging Research Areas In mechanical Engineering (ERAME – 2015), 27 - 28 March, 2015, Bengaluru.

Shikhar V Jain, Vishnuprasad Shetty and Satyanarayan, "Review on Wettability of Micro and Nano Particle Fluids" International Conference on Advanced Ceramics and Nanomaterials for Sustainable Development (ACeND-2018), 19th -21st, September 2018 in Christ University Campus, Bangalore

Satyanarayan (Invited talk) "Investigation on Effect of Casting Moulds/Cooling Media on Microstructure, Tribological and Hardness Properties of Al−Sn Alloy", National Conference on Recent Advances in Mechanical Engineering and Technology (NCRAMET-19) @ Yenepoya Institute Of Technology (YIT), Moodbidri, 29th to 30th, April, 2019.

Nandana M Hegde and Satyanarayan, “Sn-Pb ಹಾಗೂ Sn-Ag-Cu ಮಿಶ್ರ ಲೋಹ ಬೆಸುಗೆಗಳು ಮತ್ತು ತಾಮ್ರದ ತಲಾಧಾರದ ನಡುವಿನ ಅಂತರ್ಮುಖಿ ಪ್ರತಿಕ್ರಿಯೆಗಳ ಮೇಲೆ ಮರುಪ್ರವಾಹ ಮತ್ತು ಐಸೋಥರ್ಮಲ್‌ ಏಜಿಂಗ್‌ ತಾಪಮಾನದ ಪರಿಣಾಮಗಳು” National Conference on Science and Technologies in Aerospace & Defence Sectors organised by Kannada Samskritika Sangha, Council of Scientific and Industrial Research (CSIR), National Aerospace Laboratories (NAL) , Bengaluru on 15th July 2022 (Best Paper Presentation Award).

Membership of Professional Bodies

Managing Guest Editor (ICRAEM 2022) - Materials Today : Proceedings(Elsevier Publications)
Managing Guest Editor (iCOLD 2019) - Materials Today : Proceedings (Elsevier Publications)
Editorial Board Member for American Journal of Mechanical and Materials Engineering by Science Publishing Group.
Editorial Board Member for International Journal of Manufacturing and Material Processing
Editorial Board Member for SCIREA Journal of Materials.
Life Member - Indian Welding Society (L01854).
Founder Life Member - Society for Failure Analysis (FLM-SFA-0421).
Life Member - India Society for Technical Education (LM-111025)

Workshops Organized

Coordinator for the Two days workshop on “Manufacturing & Applications of Advanced Materials” held on 27th- 28th January 2014 at Alva’s Institute of Engineering & Technology.

Coordinator for the Two days National workshop on “Thermal Properties of Materials” held on 27th- 28th January 2015 at Alva’s Institute of Engineering & Technology.

Coordinator for the One day National workshop on “Nanofluids: Applications for Heat Transfer And Energy Systems” 28th September 2017, at Alva’s Institute of Engineering & Technology.

Coordinator for the One day workshop on “Advances in Welding Practices”, 22nd March – 2018 in Association with Kumamoto University, Japan.

Coordinator & Convener for the One Day National Workshop on “Advanced Ceramics for Engineering Applications”, 21st September 2019 at Alva’s Institute of Engineering &Technology in Association with Indian Ceramic Society Karnataka Chapter, Karnataka, Bangalore.

International/National level Responsibilities

- Technical Program Committee Member for The 5th International Conference on Material Strength and Applied Mechanics (MSAM 2024), July 29-August 1, 2024 Győr, Hungary (https://www.msamconf.org/TPC )

- Technical Program Committee Member for The 5th International Conference on Material Strength and Applied Mechanics (MSAM 2022), August 19-22, 2022 Qingdao, Shandong, China (http://msamconf.org/TPC )

- Technical Program Committee Member for 4th International Conference on Advanced Materials and Ecological Environment (AMEE2022), to be held online during December 17-18, 2022, organized by Hubei Zhongke Institute of Geology and Environment Technology, China (https://www.ameeconf.com/committee )

- Technical Session Chair for 8th World Conference on Applied Sciences, Engineering and Management (WCSEM 2019) at Shree Devi Institute of Technology, Kenjar, Mangalore during 26-28 September 2019.

- Technical Program Committee for the International Conference on Material Engineering and Materials Science (MEMS2019) December-14, 2019,Wuhan, Hubei, China.

- Key note speaker for the 7th World Conference on Applied Sciences, Engineering and Management (WCSEM-2018) organized jointly by the Basha Research Corporation (BRCORP) and the American Business School of Paris during 26-27 October 2018 at Paris, France.

- International Technical Committee 4th International Conference on Earth Sciences And Engineering (ICEE–2017) 29th – 31st August, 2017, Andalas University, Padang, Indonesia.

- Coordinated the MOUs of Alva’s Institute of Engineering Technology with Kumamoto University, Japan and V & G Industrial Testing Laboratories, Mangalore

- Technical Session Chair for International conference on advances in Manufacturing, Materials and Energy Engineering (IconMMEE2018) 2 - 3 March 2018, MITE, Moodbidri, India

- Technical Session Chair for National Conference on Advances in Mechanical Engineering (NAME) 20 - 21 April 2018, JNN College of Engineering, Shivmoga, Karnataka, India
- Event management committee of 39th ISTE Annual convention and the National Conference held on 18th – 20th December 2009 at NITK Surathkal.

Workshops/Seminars/Webinar Attended

1. “Electron Microscopy”, on 8-10 March, 2008, NITK- Surathkal,

2. “Quenching and Distortion control”, on 28-30 September 2008, NITK- Surathkal

3. “Process modeling in Iron making & Steel making” 7-8, September 2009, N.I.T.K, Surathkal, 2009 Mangalore.

4. NRC-M Winter Workshop on ‘X-Ray Diffraction Methods’, 26-31 December 2011, IISc Bangalore

5. “Inter-relationships between Processing of Metals, Microstructure and Properties” 3rd September, 2011 NITK Surathkal.

6. NRC-M Symposium on ‘Mechanical Behaviour of Materials’, 30 & 31 January 2012, IISc Bangalore

7. Workshop on ‘Engineering Failure Analysis’, August 1-2, 2014, NITK- Surathkal.

8. Five Days Workshop On Software Applications In Mechanical Engineering, 22nd to 26th January – 2018, Alva’s Institute of Engineering and Technology, August 9, 2019.1

9. National Seminar On, “Frontiers In Materials”, 29th October 2019, Department of Metallurgical and Materials Engineering, NITK, Surathkal

10. Webinar on“To Guide Students to Select Meaningful Engineering Projects”, 13th June, 2020, Dassault Systemes, Pune (La Foundation)

11. Workshop on “Introduction to Fusion 360°” 3rd January 2023, organized by Medini Technologies, Bangalore

12. 354th Plastic Processing Symposium, "Current status and prospects of extreme material creation and processing technology" December 14, 2023 (Thursday), Kumamoto University, Japan