Research and Development Engineer, Advanced Manufacturing Engineering R & D, SanDisk Corporation (USA/China) [2008-2009]
Role & responsibility: My area of expertise is semiconductor technology. My role in SanDisk Semiconductor was to develop die stacking for advanced system in package for flash memory products and major responsibility was to investigate the Silicon – Package Interaction for Flash memory products in SanDisk assembly line in Shanghai, China.
Norwegian University of Science and Technology (NTNU), Trondheim, NORWAY
Awarded in 2016
Indian Institute of Technology, Kharagpur, INDIA
Year of passing: 2008, C.G.P.A.: 8.88/10.00
Utkal University, Bhubaneswar, INDIA
Year of passing: 2006, Division: FIRST (University Gold medal).
Percentage of mark: 83.9%
MPC (Autonomous) College under North Orissa University, Baripada, INDIA
Year of passing: 2004, Division: FIRST (1st rank in College).
Percentage of mark: 91.5%
MPC College, Baripada, Orissa, INDIA
Year of passing: 2001, Division: FIRST (1st rank in College).
Percentage of mark: 87.2%
MKC High School, Baripada, Orissa, INDIA
Year of passing: 1999, Division: FIRST (1st rank in School & 50th rank in board).
Percentage of mark: 91.2%
All India Rank (Physics): 32
Percentile: 99.35
Qualified: Junior Research Fellowship (JRF) and Lecturership (LS)