International Conferences


  1. Fabrication Method and Characterization of a Wireless Strain Sensor. Kyeong Jae Lee, and Sohee Kim. International Conference on Control, Automation and Systems (ICCAS), PyeongChang, Korea, Oct. 17-20, 2018.
  2. Long-term electrical properties of interfacing electrodes in bodily environments. Sohee Kim, International Union of Materials Research Societies (IUMRS), Daejeon, Korea, Aug. 19-24, 2018. (Invited)
  3. Flexible capacitive pressure sensor to measure the grasping power of premature infants. Tausif Muhammad, Je Sang Lee, and Sohee Kim. ICEAS (HEC), Seoul, S.Korea, July 17-19, 2018.
  4. Synaptic responses by planar coil-based contact-mode magnetic stimulation in the acute hippocampal slices. H. Park, J. Jo, S. Kim, and E. Chung. IEEE EMBC, Honolulu, HI, USA, July 17-21, 2018.
  5. Numerical Analysis of the Effect of Adjacent Reference Electrode Configuration in Retinal Prostheses. Namju Kim, Hee Won Seo, and Sohee Kim. IEEE EMBC, Honolulu, HI, USA, July 17-21, 2018.
  6. A study on adhesion strength between parylene interconnection cable and fluid reservoir for drug delivery to neural electrodes. JaeWon Jang, YooNa Kang, and Sohee Kim. IEEE EMBC, Honolulu, HI, USA, July 17-21, 2018.
  7. A microfluidic interconnection cable delivering pharmaceutical drugs to neural electrodes. YooNa Kang, JaeWon Jang, and Sohee Kim. IEEE EMBC, Honolulu, HI, USA, July 17-21, 2018.
  8. Three dimensional flexible microelectrodes for subretinal prosthesis. Hee Won Seo, Namju Kim, and Sohee Kim. IEEE EMBC, Honolulu, HI, USA, July 17-21, 2018.
  9. A Pilot Study of Planar Coil Based Magnetic Stimulation Using Acute Hippocampal Slice in Mice. H. J. Park, H. K. Kang, M. Wang, J. Jo, E. Chung, and S. Kim. IEEE EMBC, Jeju, Korea, Jul. 11-15, 2017.
  10. A fabrication method of an interconnection cable integrated with microfluidic channels. YooNa Kang, Namsun Chou, and Sohee Kim. IEEE EMBC, Jeju, Korea, Jul. 11-15, 2017.
  11. Development of a tube type strain sensor to measure grasping power of infants. Ik-kyu Choi, Namsun Chou, Je Sang Lee, Yong Beom Shin, and Sohee Kim. IEEE EMBC, Jeju, Korea, Jul. 11-15, 2017.
  12. A Simulation Study for a Batteryless, Wireless Strain Sensor. Kyeong Jae Lee, Namsun Chou, and Sohee Kim. IEEE EMBC, Jeju, Korea, Jul. 11-15, 2017.
  13. Development of an intrafascicular neural interface for peripheral nerve implantation. Namsun Chou, YooNa Kang, Ho-Seong Kang, Jeong-Dae Yun, Wonju Chun, Kyeong Jae Lee, HyunMin Moon, Ik-Kyu Choi, Donghak Byun, Inho Song, Dong-Jun Moon, Jin-Hee Moon, Byeong Han Lee, Jungsuk Kim, Sung-Keun You, and Sohee Kim. 15th IEEE International Conference on Rehabilitation Robotics, London, UK, Jul. 17-20, 2017.
  14. Multichannel EEG Recordings on PTZ-induced Zebrafish Epilepsy Model. Sung-Joon Cho, Donghak Byun, Tai-Seung Nam, Seok-Yong Choi, Byung-Geun Lee, Myeong-Kyu Kim and Sohee Kim. 10th European Zebrafish Meeting, Budapest, Hungary, Jul. 3-7, 2017.
  15. Long-Term Nerve Signal Recording in Canine Sciatic Nerve with a Flexible and Penetrating Microelectrode Array. Donghak Byun, Sung-Joon Cho, Jong-Hyun Lee, and Sohee Kim. IEEE-EMBS Neural Engineering Conference, Shanghai, China, May 25-28, 2017.
  16. Wearable Strain Sensors Fabricated by Silver Nanowire Patterning Method Based on Parylene Stencil Technique. Namsun Chou, and Sohee Kim, IEEE EMBC, Orlando, FL, Aug. 16-20, 2016.
  17. Highly Sensitive Capacitive Tactile Sensor based on Silver Nanowire using Parylene-C Stencil Patterning Method. Youngseok Kim, Namsun Chou, and Sohee Kim. IEEE Sensors Conference, Busan, Korea, Nov. 1-4, 2015.
  18. 3D Printed Multi-Channel EEG Sensors for Zebrafish. Sung-Joon Cho, Tai-Seung Nam, Seok-Yong Choi, Myeong-Kyu Kim, and Sohee Kim. IEEE Sensors Conference, Busan, Korea, Nov. 1-4, 2015.
  19. Development of Integrated Flexible Penetrating Microelectrode Array with Interconnection Cable for Use in Various Nervous Systems. Donghak Byun, Keonghwan Oh, and Sohee Kim. IEEE Sensors Conference, Busan, Korea, Nov. 1-4, 2015.
  20. Comparison of Pedicle Screw Designs upon Pull-out Test Using FEM. Gihyun Lee, Dong-Ah Shin, and Sohee Kim. International Biomedical Engineering Conference (IBEC), Gyeongju, Korea, Nov. 12-14, 2015.
  21. In vitro Calcium Imaging of Spontaneous Neuronal Activity. Jungmin Hong, Chanmi Yeon, Jihee Ryu, Sohee Kim, and Euiheon Chung. International Biomedical Engineering Conference (IBEC), Gyeongju, Korea, Nov. 12-14, 2015.
  22. A computational parameter study of noninvasive electrical stimulation to the epiphyseal plate. International Biomedical Engineering Conference (IBEC), H. J. Park, J. H. Ku and S. Kim, Gyeongju, Korea, Nov. 12-14, 2015.
  23. Feasibility Study of 808nm Near-Infrared Stimulation on Cultured Cells. Seongwon Min, Minsu Yoo, Youngmin Moon and Sohee Kim. International Biomedical Engineering Conference (IBEC), Gyeongju, Korea, Nov. 12-14, 2015.
  24. Temperature changes in the brain slice by NIR optical stimulation. Seongwon Min, Minsu Yoo, and Sohee Kim. Society for Neuroscience, Chicago, IL, USA, Oct. 17-21, 2015.
  25. Intramuscular electromyography measurement in zebrafish larvae using a microneedle electrode. S-J. Cho, T-S. Nam, S-Y. Choi, M-K. Kim and S. Kim. microTAS, Gyeongju, Korea, Oct. 25-29, 2015.
  26. Intramuscular Electromyography Measurement in Zebrafish Larvae Using a Microneedle Electrode. S.-J. Cho, T.-S. Nam, S.-Y. Choi, M.-K. Kim, and S. Kim. 2nd Zebrafish for Personalized & Precision Medicine Conference, Toronto, Canada, Sep. 23-26, 2015. (Invited)
  27. Acute Peripheral Nerve Signal Recording using Flexible Penetrating Microelectrode Array integrated with Interconnection Cable. Donghak Byun, Keonghwan Oh, Minsu Yoo, Kang-Il Song, Joongkee Min and Sohee Kim. IEEE EMBC, Milano, Italy, Aug. 25-29, 2015.
  28. Biomechanical effects of the geometry of ball-and-socket intervertebral prosthesis on lumbar spine using finite element method. Jisu Choi, DongAh Shin, and Sohee Kim. BIOSTEC-Bioinformatics, Lisbon, Portugal, Jan. 12-15, 2015.
  29. Needle Microelectrodes for Electromyography Recording from Zebrafish Larvae. Sung-Joon Cho, Tai-Seung Nam, Seok-Yong Choi, Myeong-Kyu Kim, and Sohee Kim. IEEE-EMBS Micro & Nanotechnology in Medicine Conference, Oahu, HI, USA, Dec. 8-12, 2014.
  30. MEMS-based microelectrode technologies to penetrate neural tissues. Sohee Kim. International Biomedical Engineering Conference (IBEC), Gwangju, Korea, Nov. 21, 2014. (Invited)
  31. Biomechanical effects of the geometry of ball-and-socket intervertebral prosthesis on lumbar spine using finite element method. Jisu Choi, DongAh Shin, and Sohee Kim. International Biomedical Engineering Conference (IBEC), Gwangju, Korea, Nov. 20-22, 2014.
  32. Study on long-term stability of the electrodes based on parylene filled PDMS. Jinmo Jeong, Namsun Chou, and Sohee Kim. International Biomedical Engineering Conference (IBEC), Gwangju, Korea, Nov. 20-22, 2014.
  33. Design of flexible interconnection cable for flexible 3-D microelectrode array. KeongHwan Oh, DongHak Byun, SungJoon Cho, and Sohee Kim. International Biomedical Engineering Conference (IBEC), Gwangju, Korea, Nov. 20-22, 2014.
  34. Fabrication of Multi-Channel EEG Electrodes for Zebrafish. S.-J Cho, Y. Kim, N. Chou, T.-S Nam, S.-Y. Choi, M.-K. Kim, and S. Kim. International Biomedical Engineering Conference (IBEC), Gwangju, Korea, Nov. 20-22, 2014
  35. AcuteNeural Recording Using Flexible and Penetrating Microelectrode Array. Donghak Byun and Sohee Kim. International Biomedical Engineering Conference (IBEC), Gwangju, Korea, Nov. 20-22, 2014. (Student Paper Award)
  36. Fabrication of the flexible coil by using microfluidic channel filled with galistan. Hanbyul Kim, Dongyoon Kim, Sohee Kim, and Sung Yang. The 6th International Symposium on Microchemistry and Microsystems, Singapore, July 30–Aug. 1, 2014.
  37. Validation of Numerical Simulation for Subdural Cortical Stimulation : Using Spherical Phantoms and Anatomically Realistic Head Phantom. Jinmo Jeong, Donghyeon Kim, Sangdo Jeong, Euiheon Chung, Sung Chan Jun, and Sohee Kim. BIOSTEC-Bioinformatics 2014, Angers, France, Mar. 3-6, 2014.
  38. A fabrication method of out-of-plane stretchable electrodes based on PDMS. N. Chou, and S. Kim. SPIE Micro+Nano Materials, Devices, and Applications 2013, Melbourne, Australia, Dec. 8-11, 2013.
  39. Computational Study on Thermal Effects of Coil-Based Implantable Magnetic Stimulation using Finite Element Analysis. H. Park, and S. Kim. IEEE EMBS Neural Engineering Conference, San diego, USA, Nov. 05-09, 2013.
  40. Fabrication of flexible eletrode array based on PDMS for long-term in-vivo use. J. Jeong, N. Chou, and S. Kim. IEEE EMBS Neural Engineering Conference, San diego, USA, Nov. 05-09, 2013.
  41. A Single Electrical Acupuncture Needle with Bipolar Electrodes for Biotissue Discrimination. G. Kang, J. -C. Kim, S. Kim, and J. -H. Lee. Biodevices2013, Barcelona, Spain, Feb. 11-14, 2013.
  42. Near infrared stimulation of globus pallidus and subthalamus. M. Yoo, H. Goo, H. Kim, M. Kim, S. Kim, and H.-I. Kim. Neuroscience 2012, New Orleans, USA, Oct. 13-17, 2012.
  43. Fabrication of Flexible Penetrating Microelectrode Arrays for Application on Curved Surfaces. D. Byun, and S. Kim. The 40th Neural Interfaces Conference, Salt Lake City, UT, June 18-20, 2012. (abstract)
  44. An Expandable ECoG (Electrocorticogram) Electrode Array based on PDMS. N. Chou, and S. Kim. The 40th Neural Interfaces Conference, Salt Lake City, UT, June 18-20, 2012.(abstract)
  45. Development of Electro-thermal Acupunctures for Physical Therapy of Ligament. G. Kang, W. Chun, J. Kim, S. Kim, and J. Lee, World Congress on Medical Physics & Biomedical Engineering, Beijing, China, May 26-31, 2012.
  46. Fabrication of stretchable and flexible electrodes based on PDMS substrate. N. Chou, S. Yoo, and S. Kim.The 25th International Conference on Micro Electro Mechanical Systems, Paris, France, Jan. 29 - Feb. 02, 2012.
  47. Largely deformable surface electrode based on PDMS for cortical recording and stimulation. N. Choo, S. Yoo, and S. Kim. IEEE EMBS Conference on Neural Engineering, Cancun, Mexico, April 27-May 01, 2011.
  48. Silicon lid for encapsulation of electronics on implantable systems. P. Tathireddy, A. Sharma, L. Rieth, S. Kim, M. Klein, M. Wilke, M. Toepper, and F. Solzbacher. Nanotech 2010, Anaheim, CA, June 21-24, 2010.
  49. Recent progress on fully integrated wireless neural interfaces based on the Utah electrode array. L. Rieth, A. Sharma, S. Kim, P. Tathireddy, R. Kier, R. Harrison, R. Normann, G. Clark, and F. Solzbacher. Neuroscience 2009, Chicago, IL, Oct. 17-21, 2009. (abstract)
  50. Wireless recordings from neocortex obtained with a fully integrated 100-channel Utah electrode array. N.M. Ledbetter, D.J. Warren, R.J. Kier, S. Kim, L.W. Rieth, R.A. Normann, F. Solzbacher, R.R. Harrison, and G.A. Clark. Neuroscience 2009, Chicago, IL, Oct. 17-21, 2009. (abstract)
  51. A Wireless Neural Interface for Chronic Recording. R.R. Harrison, R.J. Kier, S. Kim, L. Rieth, D.J. Warren, N.M. Ledbetter, G.A. Clark, F. Solzbacher, C.A. Chestek, V. Gilja, P. Nuyujukian, S.I. Ryu, and K.V. Shenoy. Proc. of the IEEE Biomedical Circuits and Systems Conference (BioCAS 2008), pp. 125-128, Baltimore, MD, Nov. 20-22, 2008.
  52. Influence of system integration and packaging for a wireless neural interface on its wireless powering performance. S. Kim, R. Harrison, and F. Solzbacher. Proc. of the 30th Annual International IEEE EMBS Conference, pp. 3182-3185, Vancouver, British Columbia, Canada, Aug. 20-24, 2008.
  53. Influence of system integration and packaging for a fully integrated wireless neural interface on its wireless performance. S. Kim, L. Rieth, and F. Solzbacher. NIH Neural Interfaces Workshop, Cleveland, OH, June 16-18, 2008. (abstract)
  54. Wireless Integrated Neural Interface Device for Chronic Neural Signal Recording. S. Kim, P. Tathireddy, L. Rieth, R. Harrison, F. Solzbacher, M. Klein, M. Toepper, H. Oppermann, and E. Jung. NSTI Nanotechnology Conference and Trade Show (Nanotech 2008), Boston, MA, June 1-5, 2008.
  55. Wireless Integrated Neural Interface Device for Chronic Neural Signal Recording. S. Kim, P. Tathireddy, L. Rieth, R. Harrison, R.A. Normann, F. Solzbacher, M. Klein, M. Toepper, and H. Oppermann. Biomedical Engineering Conference, Park City, UT, Sep. 21-22, 2007. (abstract)
  56. Electromagnetic Compatibility of Two Novel Packaging Concepts of an Inductively Powered Neural Interface. S. Kim, M. Wilke, M. Klein, M. Toepper, and F. Solzbacher. Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering, pp. 434-437, Kohala Coast, Hawaii, May 2-5, 2007.
  57. In Vitro and in Vivo Study of Temperature Increases in the Brain Due to a Neural Implant. S. Kim, P. Tathireddy, R. Normann, and F. Solzbacher. Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering, pp. 163-166, Kohala Coast, Hawaii, May 2-5, 2007.
  58. Packaging Concepts for Neuroprosthetic Implants. M. Toepper, M. Klein, M. Wilke, H. Oppermann, S. Kim, P. Tathireddy, F. Solzbacher, and H. Reichl. European Microelectronics and Packaging Conference and Exhibition (EMPC 2007), Oulu, Finland, June 17-20, 2007.
  59. System integration of the Utah Electrode Array using a Biocompatible Flip Chip Under Bump Metallization Scheme. R. Bhandari, S. Negi, L. Rieth, M. Toepper, S. Kim, M. Klein, H. Oppermann, R.A. Normann, and F. Solzbacher. Proceedings of SPIE: 14th International Symposium on Smart Structures and Materials & Nondestructive Evaluation and Health Monitoring, Vol. 6525, San Diego, CA, March 18-22, 2007.
  60. Preliminary Study of Thermal Impacts of the Microelectrodes Array Implanted in the Brain. S. Kim, R.A. Normann, R. Harrison, and F. Solzbacher. Proceedings of the 28th Annual International Conference of the IEEE EMBS, pp. 2986-2989, New York, NY, Aug. 30-Sep 3, 2006.
  61. Development of a caping process based on Si and LTCC for a wireless neuroprosthetic implant. M. Wilke, M. Töpper, S. Kim, M. Klein, K.-H. Drüe, J. Müller, M. Wiemer, V. Glaw, H. Oppermann, F. Solzbacher, and H. Reichl. Second International Workshop on SOP, SIP, SOC (3S) Electronics Technologies, Atlanta, GA, Sep 28-29, 2006. (abstract)
  62. Biocompatible SiP based on microsystem integration for wireless neural interfaces. M. Töpper, S. Kim, P. Tathireddy, M. Hutter, M. Klein, K. Buschick, V. Glaw, K. Orth, O. Ehrmann, H. Oppermann, K.-F. Becker, F. Solzbacher, and H. Reichl. Second International Workshop on SOP, SIP, SOC (3S) Electronics Technologies, Atlanta, GA, Sep. 28-29, 2006. (abstract)
  63. Chronic In Vivo Recordings with a New Implantable Wireless Neural Recording Array. F. Solzbacher, M. Toepper, L. Rieth, P. Tathireddy, S. Kim, M. Klein, and H. Reichl. NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, Aug. 21-23, 2006. (abstract)
  64. Development of a caping process based on Si and LTCC for a wireless neuroprosthetic implant. M. Wilke, M. Töpper, S. Kim, M. Klein, K.-H. Drüe, J. Müller, M. Wiemer, V. Glaw, H. Oppermann, F. Solzbacher, and H. Reichl. NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, Aug. 21-23, 2006. (abstract)
  65. Numerical Study of Thermal Impact of the 3-D Microelectrodes Array Implanted in the Brain. S. Kim, R.A. Normann, R. Harrison, and F. Solzbacher. NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, Aug. 21-23, 2006. (abstract)
  66. Wafer Level Packaging based on Electroplating for Medical Implantable Devices. M. Töpper, L. Dietrich, K. Orth, O. Ehrmann, S. Kim, M. Klein, R. Harrison, P. Tathireddy, F. Solzbacher, and H. Reichl. Proceedings of PEAKS Conference on Electrochemical Processing for Microelectronics, Whitefish, MT, June 20-23, 2006.
  67. Biocompatible Hybrid Flip Chip Microsystem Integration for Next Generation Wireless Neural Interfaces. M. Töpper, M. Klein, K. Buschick, V. Glaw, K. Orth, O. Ehrmann, M. Hutter, H. Oppermann, K.-F. Becker, T. Braun, F. Ebling, H. Reichl, S. Kim, P. Tathireddy, S. Chakravarty, and F. Solzbacher. Proceedings of the 56th Electronic Components and Technology Conference, pp. 705-708, San Diego, CA, May 30-June 2, 2006.
  68. FEA Simulation of Thin Film Coils to Power Wireless Neural Interfaces. S. Kim, O. Scholz, K. Zoschke, R. Harrison, F. Solzbacher, M. Klein, and M. Toepper. Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 1, pp. 705-708, Boston, MA, May 7-11, 2006.
  69. Polymer based thin film coils as a power module of wireless neural interfaces. S. Kim, M. Klein, M. Toepper, D. Black, R. Harrison, P. Tathireddy, and F. Solzbacher. Proceedings of the IEEE Workshop on Microelectronics and Electron Devices, Boise, ID, April 14, 2006.
  70. Feasibility of Inductive Communication Between Millimeter-Sized Robots. S. Kim, T. Knoll, and O. Scholz. Proceedings of the 1st IEEE / RAS-EMBS International Conference on Biomedical Robotics and Biomechatronics, Pisa, Italy, Feb. 20-22, 2006.
  71. Integrated neural interface arrays for neuroprosthetics applications. F. Solzbacher, R. Harrison, R. Normann, H. Oppermann, M. Klein, K.P. Koch, S. Kammer, A. Ramachandran, and S. Kim. 1st Annual Meeting of American Academy of Nanomedicine, Aug. 15-16, 2005. (abstract)
  72. Switchable LTCC/Polyimide based thin film coils. L. Rieth, S. Chakravarty, J.-M. Hsu, R.A. Normann, F. Solzbacher, M. Klein, M. Toepper, and S. Kim. NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, Sep. 7-9, 2005. (abstract)
  73. Implantable active telemetry system using microcoils. S. Kim, and O. Scholz. Proceedings of the 27th annual conference of the IEEE Engineering in Medicine and Biology, Shanghai, China, Sep. 1-4, 2005.
  74. Effect of Packaging Materials of Inductively Powered Medical Implants on Power Transmission Efficiency. S. Kim, K.P. Koch, and O. Scholz. Biomedizinische Technik 49, Ergänzungsband 2, pp. 752-753, 38. Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik (DGBMT), Ilmenau, Germany, Sep. 22-24, 2004.
  75. Evaluation and Optimization of Planar Microcoils Fabricated by Polyimide based Electroplating for the Application of Implantable Telemetry Systems. S. Kim, and O. Scholz. Proceedings of the MICRO SYSTEM Technologies 2003, Oct. 7-8, Munich, Germany, pp. 379-386, 2003.