Japan Semiconductor Process Tapes Market was valued at USD 0.27 Billion in 2022 and is projected to reach USD 0.52 Billion by 2030, growing at a CAGR of 8.0% from 2024 to 2030.
The Japanese semiconductor industry is experiencing significant growth, with companies like Rapidus leading the charge in developing advanced chip technologies. This surge in semiconductor demand has heightened the need for specialized materials, particularly process tapes used in manufacturing. These tapes play a crucial role in various stages of semiconductor production, including backgrinding and dicing, ensuring the integrity and performance of the final products.
The primary types of semiconductor process tapes utilized in Japan are:
Backgrinding Tapes: Employed during the backgrinding process to protect wafers from mechanical stress and contamination, ensuring the preservation of wafer integrity.
Dicing Tapes: Used in the dicing process to hold wafers securely while they are cut into individual chips, maintaining alignment and preventing damage.
These tapes are essential in applications such as:
Integrated Circuits (ICs): Fundamental components in electronic devices, requiring precise manufacturing processes to meet performance standards.
Micro-Electro-Mechanical Systems (MEMS): Devices integrating mechanical and electrical components, necessitating delicate handling during production.
Advanced Packaging: Techniques that enhance the functionality of semiconductors, demanding high-quality materials to ensure reliability and efficiency.
To meet the escalating demand, companies like Furukawa Electric are investing significantly in expanding production capacities for semiconductor process tapes. In May 2022, Furukawa Electric announced a JPY 7.0 billion investment to increase production at their Mie Works, with operations slated to commence in April 2025. This investment aims to ensure a stable supply of high-quality tapes, supporting the growth of sectors such as IoT, autonomous driving, and 5G technologies.
The market for semiconductor process tapes in Japan is projected to grow at a Compound Annual Growth Rate (CAGR) of 3.5%, with the market size expected to reach approximately US$ 1,246.5 million by 2030. This growth is driven by the increasing demand for semiconductors across various applications, including consumer electronics, automotive, and telecommunications.
In summary, the Japanese semiconductor process tapes market is evolving rapidly to support advancements in semiconductor technologies. The continuous development of high-performance tapes is crucial to meet the industry's demands, ensuring the production of reliable and efficient semiconductor devices.
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Mitsui Chemicals Tohcello
Lintec
Denka
Nitto
Furukawa Electric
D&X
AI Technology
Taicang ZHANXIN Adhesive Materials Co
Shanghai Jingshen (Fine Coating) New Material Co
Shanghai Guk Tape Technology Co
Suzhou Boyan Jingjin Photoelectric Co
Kunshan Boyi Xincheng Polymer Material Co
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By the year 2030, the scale for growth in the market research industry is reported to be above 120 billion which further indicates its projected compound annual growth rate (CAGR), of more than 5.8% from 2023 to 2030. There have also been disruptions in the industry due to advancements in machine learning, artificial intelligence and data analytics There is predictive analysis and real time information about consumers which such technologies provide to the companies enabling them to make better and precise decisions. The Asia-Pacific region is expected to be a key driver of growth, accounting for more than 35% of total revenue growth. In addition, new innovative techniques such as mobile surveys, social listening, and online panels, which emphasize speed, precision, and customization, are also transforming this particular sector.
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Growing demand for below applications around the world has had a direct impact on the growth of the Japan Semiconductor Process Tapes Market
Polyimide Tapes
PTFE (Teflon) Tapes
Silicone Tapes
Wafer Dicing
Printed Circuit Board (PCB) Manufacturing
Packaging
Electronics Assembly
High-Temperature Adhesives
Medium-Temperature Adhesives
Low-Temperature Adhesives
No Adhesive
Consumer Electronics
Automotive
Aerospace
Healthcare
Thin (< 2 mils)
Medium (2-5 mils)
Thick (> 5 mils)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
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1. Introduction of the Japan Semiconductor Process Tapes Market
Overview of the Market
Scope of Report
Assumptions
2. Executive Summary
3. Research Methodology of Verified Market Reports
Data Mining
Validation
Primary Interviews
List of Data Sources
4. Japan Semiconductor Process Tapes Market Outlook
Overview
Market Dynamics
Drivers
Restraints
Opportunities
Porters Five Force Model
Value Chain Analysis
5. Japan Semiconductor Process Tapes Market, By Type
6. Japan Semiconductor Process Tapes Market, By Application
7. Japan Semiconductor Process Tapes Market, By Geography
Asia-Pacific
China
Japan
Korea
India
Australia
Indonesia
Thailand
Philippines
Malaysia and Vietnam
8. Japan Semiconductor Process Tapes Market Competitive Landscape
Overview
Company Market Ranking
Key Development Strategies
9. Company Profiles
10. Appendix
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