CHICAGO PIXELS Public Documents

The main points of the file "Flier\_GregT\_V2.9.7.pdf" are about the Super Integrated Circuit Chip Semiconductor Device and its benefits.

**The Super Integrated Circuit Chip Semiconductor Device:**

  * It is a Durable, High-Temperature Electronic Integrated Circuit Chip.

  * It features higher voltages, higher frequencies, a wider band gap, and radiation hardening, all on one microchip with the hardness of diamond.

  * Industry application areas include downhole oil and gas, automotive, aerospace, avionics, and nuclear industries.

**Casing Benefits:**

  * Maximum Operating Temperature of $2,450^{\\circ}C$.

  * Absorption of radiation 600 to 4000(Barn).

  * Near hardness of diamond.

  * Minimal changes and distortions to shape in high heat environments.

**Wafer Benefits:**

  * Thermal Expansion Coefficient of $(\\times 10^{-6}/^{\\circ}C)1.1$.

  * Relative hardness 10 Mohs.

  * Maximum Service Temperature, Inert $2000^{\\circ}C$ $3630^{\\circ}F$.

  * Band Gap at 4.6 eV.

**Patent and Contact Information:**

  * A further, more detailed explanation of the functionality of this invention is available upon request.

  * Patent Number US 8,987,873 is Available for Sale OR LICENSE.

  * For more information, contact GREGORY TARCZYNSKI

  * The device is associated with Intelligent Technology Trifecta (ITTr).