Editorial Board
1. Associate Editor, IEEE Transactions on Circuits and Systems II (TCAS-II) (2026 –)
Governance and Society Leadership
1. Board of Governors (Young Professional Representative), IEEE Circuits and SystemsSociety (CASS) (2025 –)
2. Chair, Young Professionals Circuits and Systems (YPCAS), IEEE CASS, (2025 –)
Technical Committee Leadership
1. Secretary, Technical Committee on Machine Learning Circuits and Systems (MLCAS), IEEE CASS (2025 –)
Steering Committee
1. [NEWCAS] IEEE International NEWCAS Conference (2025)
2. [ISCAS] IEEE International Symposium on Circuits and Systems (2025)
Organizing Committee
1. [ISCAS] TPC Co-Chair, IEEE International Symposium on Circuits and Systems (2026)
2. [APCCAS] YP Chair, IEEE Asia Pacific Conference Circuits and Systems (2025)
Technical Program Committee
1. [DATE] Design, Automation and Test in Europe Conference (2026): ”Track D11. Reconfigurable systems”
2. [ASPDAC] Asia and South Pacific Design Automation Conference (2025 – 2026): ”Track 3. Memory Architecture and Near/In-Memory Computing”
3. [DAC, Outstanding TPC Member Recognition] Design Automation Conference (2025): ”Track AI3-I. AI/ML Architecture Design”
4. [ISLPED] IEEE/ACM International Symposium on Low Power Electronics and Design (2025): ”Track 3.2 Emerging Technologies and Next-Generation Computing”
5. [GLSVLSI] ACM Great Lakes Symposium on VLSI (2025): ”VLSI Circuits and Design Track”
6. [ISVLSI] IEEE Computer Society Annual Symposium on VLSI (2020 – 2021): ”Digital Circuits and FPGA based Designs Track”
Session Chair
1. [DAC] Design Automation Conference (2025): ”AI3: AI/ML Architecture Design. Flattering Splatting: Gaussian Splatting, Video Processing, and Diffusion”
2. [ISLPED] IEEE/ACM International Symposium on Low Power Electronics and Design (2025): ”Session 3B: ”Twisting AI and Hardware in 3D”
3. [ASPDAC] Asia and South Pacific Design Automation Conference (2025): ”Session 4E (T3-3) Hybrid/Co-Designed Near/In Memory Computing”
4. [NVMSA] IEEE Non-Volatile Memory Systems and Applications Symposium (2024): ”Improving Reads and Reliability”
Proposals Review
1. 2024 Microelectronics Lab Call (BES) Review, Department of Energy (DoE)
Journals Review
1. KeAi Sensors International
2. ACM Transactions on Design Automation of Electronic Systems (TODAES)
3. ACM Journal on Emerging Technologies in Computing Systems (JETC)
4. IEEE Transactions on Biomedical Circuits and Systems (TBioCAS)
5. IEEE Transactions on Computers (TC)
6. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)
7. IEEE Transactions on Circuits and Systems I (TCAS-I)
8. IEEE Transactions on Emerging Topics in Computing (TETC)
9. IEEE Transactions on Very Large Scale Integration Systems (TVLSI)
10. SCIENCE CHINA Information Sciences
Conference Papers Review
1. ACM/IEEE Design Automation Conference (DAC)
2. ACM Asia and South Pacific Design Automation Conference (ASPDAC)
3. ACM Great Lakes Symposium on VLSI (GLSVLSI)
4. IEEE International Symposium on Circuits and Systems (ISCAS)
5. IEEE International Symposium on Low Power Electronics and Design (ISLPED)
6. IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS)
7. IEEE Computer Society Annual Symposium on VLSI (ISVLSI)