Publications

Publications - Google Scholar

2020

[33] A. O. Watanabe, M. Ali, S. Y. B. Sayeed, R. R. Tummala, and P. M. Raj, “A Review of 5G Front-End Systems Package Integration,” IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1–1, 2020.
[32] A. O. Watanabe, T. H. Lin, M. Ali, Y. Wang, V. Smet, P. M. Raj, M. M. Tentzeris, R. R. Tummala, and M. Swaminathan, “Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias,” IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 12, pp. 5082–5092, 2020.
[31] A. O. Watanabe, B. K. Tehrani, T. Ogawa, P. M. Raj, M. M. Tentzeris, and R. R. Tummala, “Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 3, pp. 531–533, 2020.
[30] A. O. Watanabe, H. Ito, R. P. Markondeya, R. R. Tummala, and M. Swaminathan, “Low-Loss Impedance-Matched Sub-25-µm Vias in 3-D Millimeter-Wave Packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 5, pp. 870–877, 2020.
[29] A. O. Watanabe, M. Ali, R. Zhang, S. Ravichandran, T. Kakutani, P. M. Raj, R. R. Tummala, and M. Swaminathan, “Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications,” in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 89–94.
[28] M. Ali, A. O. Watanabe, T. H. Lin, D. Okamoto, M. R. Pulugurtha, M. M. Tentzeris, and R. R. Tummala, “Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 9, pp. 1515–1523, 2020.
[27] T. H. Lin, K. Kanno, A. O. Watanabe, P. M. Raj, R. R. Tummala, M. Swaminathan, and M. M. Tentzeris, “Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications,” IEEE Antennas and Wireless Propagation Letters, vol. 19, no. 11, pp. 1963–1967, 2020.
[26] Y. Wang, A. O. Watanabe, N. Ogura, P. M. Raj, and R. Tummala, “Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration,” Journal of Electronic Materials, vol. 49, no. 11, pp. 6737–6745, 2020.
[25] M. Ali, A. Watanabe, T. Kakutani, P. M. Raj, R. R. Tummala, and M. Swaminathan, “Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates,” in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1376–1382.
[24] P. Nimbalkar, F. Liu, A. Watanabe, D. Weyers, M. Kathaperumal, C. P. Lin, F. Naohito, T. Makita, N. Watanabe, A. Kubo, M. Swaminathan, and R. Tummala, “Fabrication and reliability demonstration of 5m redistribution layer using low-stress dielectric dry film,” in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 62–67.
[23] T. Kakutani, D. Okamoto, Z. Guan, Y. Suzuki, M. Ali, A. Watanabe, M. Kathaperumal, and M. Swaminathan, “Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at High Frequency for mmWave Applications,” in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 653–659.

2019

[22] A. O. Watanabe, Y. Wang, N. Ogura, P. M. Raj, V. Smet, M. M. Tentzeris, and R. R. Tummala, “Low-loss additively-deposited ultrashort copper-paste interconnections in 3d antenna-integrated packages for 5g and iot applications,” in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019, pp. 972–976.
[21] A. O. Watanabe, T. H. Lin, M. Ali, T. Ogawa, P. M. Raj, M. M. Tentzeris, R. R. Tummala, and M. Swaminathan, “3D Glass-Based Panel-LevelPackage with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications,” in 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G), 2019, pp. 1–3.
[20] F. Liu, C. Nair, G. Khurana, A. Watanabe, B. H. DeProspo, A. Kubo, C. P. Lin, T. Makita, N. Watanabe, and R. R. Tummala, “Next generation of 2-7 micron ultra-small microvias for 2.5 d panel redistribution layer by using laser and photolithography technologies,” in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019, pp. 924–930.
[19] M. Ali, A. Watanabe, T.-H. Lin, M. R. Pulugurtha, M. M. Tentzeris, and R. R. Tummala, “3d glass package-integrated, high-performance power dividing networks for 5g broadband antennas,” in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019, pp. 960–967.
[18] T. Sun, R. G. Spurney, A. Watanabe, P. R. Pulugurtha, H. Sharma, R. Tummala, and F. Yoshihiro, “3d packaging with embedded highpower-density passives for integrated voltage regulators,” in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019, pp. 1300–1305.
[17] F. Liu, G. Khurana, R. Zhang, A. Watanabe, B. H. DeProspo, C. Nair, R. R. Tummala, and M. Swaminathan, “Innovative sub-5-µm microvias by picosecond uv laser for post-moore packaging interconnects,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 10, pp. 2016–2023, 2019.
[16] M. Ali, A. Watanabe, T. Lin, M. Tentzeris, R. Tummala, and P. Raj, “Ultra-wideband, glass package-integrated power dividers for 5g and mm-wave applications,” in 2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting. IEEE, 2019, pp. 863–864.
[15] S. Ravichandran, K. Q. Huang, M. u. Rehman, S. Erdogan, A. Watanabe, N. Nedumthakady, F. Liu, M. Kathaperumal, and M. Swaminathan, “Packaging Approaches for mm Wave and Sub-THz Communication,” in 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G), 2019, pp. 1–5.
[14] H. Ito, K. Kanno, A. Watanabe, R. Tsuyuki, R. Tatara, M. Raj, and R. R. Tummala, “Advanced low-loss and high-density photosensitive dielectric material for rf/millimeter-wave applications,” in 2019 International Wafer Level Packaging Conference (IWLPC). IEEE, 2019, pp. 1–6.
[13] N. Ogura, S. Ravichandran, T. Shi, A. Watanabe, S. Yamada, M. Kathaperumal, and R. Tummala, “First demonstration of ultra-thin glass panel embedded (gpe) package with sheet type epoxy molding compound for 5g/mm-wave applications,” in International Symposium on Microelectronics, vol. 2019, no. 1. International Microelectronics Assembly and Packaging Society, 2019, pp. 000202–7.

2018

[12] Atom O. Watanabe, T. Lin, T. Ogawa, M. R. Pulugurtha, V. Sundaram, M. M. Tentzeris, R. R. Tummala, “Ultra-thin 3D Glass-based 5G Modules with Seamless Antenna-to-transceiver Signal Transmissions,” 68th IEEE Electronic Components and Technology Conference, (ECTC) 2018.
[11] Atom O. Watanabe, Pulugurtha Markondeya Raj, Denny Wong, Ravi Mullapudi, Rao Tummala, "Multilayered Electromagnetic Interference Shielding Structures for Suppressing Magnetic Field Coupling." Journal of Electronic Materials 47.9 (2018): 5243-5250.
[10] Atom O. Watanabe et al., "Design and demonstration of ultra-thin 3D glass-based 5G modules with low-loss interconnects," 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, 2018, pp. 180-183.
[9] Muhammad Ali, Fuhan Liu, Atom Watanabe, P. Markondeya Raj, Venkatesh Sundaram, Manos M. Tentzeris, and Rao R. Tummala. "First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications." IEEE Microwave and Wireless Components Letters (2018).
[8] M. Ali, F. Liu, Atom Watanabe, P. M. Raj, V. Sundaram, M. Tentzeris, R. Tummala, "Miniaturized High-Performance Filters for 5G Small-Cell Applications," 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2018, pp. 1068-1075.
[7] G. Park, Y. Kim, K. Cho, J. Park, A. Watanabe, P. MarkondeyaRaj, V. Sundaram, K. Son, H. Park, J. Kim et al., “Design and analysis of receiver channels of glass interposers for 5g small cell front end module,” in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2018, pp. 107–109.

2017

[6] Atom O. Watanabe, M. Ali, B. Tehrani, J. Hester, H. Matsuura, T. Ogawa, M. R. Pulugurtha, V. Sundaram, M. M. Tentzeris, R. R. Tummala, “First Demonstration of 28GHz and 39GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017. [pdf]
[5] V. Sundaram, B. Deprospo, N. Gezgin, A. O. Watanabe, P. M. Raj, F. Liu, W. Puckett, S. Graham, R. R. Tummala, “Integrated Copper Heat Slugs and EMI shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF IC’s,” 67th IEEE Electronic Components and Technology Conference, (ECTC) 2017, Orlando, FL, United States, May 30 - June 2, 2017. [pdf]
[4] T. Lin, P. M. Raj, A. Watanabe, V. Sundaram, R. Tummala and M. M. Tentzeris, "Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications," 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), Pittsburgh, PA, 2017, pp. 911-915.

2016

[3] Atom O. Watanabe, S. Jeong, S. Kim, Y. Kim, J. Min, D. Wong, R. Mullapudi, P. M. Raj, R. R. Tummala, Y. Kim, J. Kim, "Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites," in 66th IEEE Electronic Components and Technology Conference, (ECTC) 2016, May 31, 2016 - June 3, 2016, Las Vegas, NV, United States, 2016, pp. 206-210. [pdf]

2015

[2] A. Truong, A. O. Watanabe, P. A. Mortemousque, K. Ando, T. Sato, T. Taniyama, and K. M. Itoh, "Interfacial Spin-Glass-Like State in Mn₅Ge₃ Single Crystalline Films Grown on Germanium Substrates," Phys. Rev. B 91, 214425 (2015). [pdf]

2014

[1] A. Truong, A. O. Watanabe, T. Sekiguchi, P. A. Mortemousque, T. Sato, K. Ando, and K. M. Itoh, "Evidence of a Perpendicular Magnetocrystalline Anisotropy in a Mn5Ge3 Epitaxial Thin Film Revealed by Ferromagnetic Resonance," Phys. Rev. B 90, 224415 (2014). [pdf]

Review Activities

IEEE Transactions on Components, Packaging and Manufacturing Technology (T-CPMT): 2019 – Present
IEEE Transactions on Microwave Theory and Techniques (T-MTT): 2020 – Present
Cambridge University Press International Journal of Microwave and Wireless Technologies: 2020 – Present
ELSEVIER Applied Materials Today: 2019 – Present

Award

IEEE Electronic Packaging Society Japan Chapter Young Award 2018

Received the award for his paper entitled “Design and Demonstration of Ultra-thin 3D Glass-based 5G Modules with Low-loss Interconnects.” The paper demonstrates seamless antenna-to-transceiver signal transitions on large and ultra-thin glass-based 5G modules with impedance-matched transmission lines and microvias with high-precision and low-loss re-distribution layer design and fabrication for 5G communications at the 28 GHz band. [Link]

Most Popular Conference Paper 2017

Most Popular Conference Paper 2017 in IEEE Electronics Packaging Society (EPS)

First Place - Best Student Paper (Nov. 2016)

Future Car Workshop sponsored by Georgia Institute of Technology, Semiconductor Equipment and Materials International (SEMI), IEEE, CPMT, iMAPS, iNEMI.

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