Hi! My name is Andong WANG. 

Welcome to my site!

About me:  I am a researcher in the field of Laser-Matter Interactions, especially in the breakdown regime.  

Research keywords: laser processing, internal writing, 3D processing, spatial light modulation, silicon photonics.

Brief Bio: I am currently working as a Marie-Curie Fellow in Oxford University (in the Dynamic Optics and Photonics Group with Prof. Martin BOOTH and Dr. Patrick SALTER).  Previously, I worked as a postdoc in the LP3 laboratory, Marseille, France (in the group of Dr. David GROJO). I obtained my Ph.D. degree under the supervision of Pr. Dr. Lan JIANG and Xiaowei LI from Beijing Institute of Technology, China in 2018. 



Find me also at:  

 Google scholar          ResearchGate           ORCID          Research ID  

Contact: andong.wang.sci at gmail.com



Research Direction

Direction 1: 3D inscription deep inside semiconductor materials

Direction 2: Subwavelength laser fabrication

Gallary of News

The project AdFUN was awarded the EU MSCA Postdoc Fellowship  March 28, 2022

Our paper was selected as Editor's Pick in Applied Physics Letters --July, 30, 2021

Gallary of Publications

Wang, A., Das, A., Hermann, J., & Grojo, D. (2021). Three-dimensional luminescence microscopy for quantitative plasma characterization in bulk semiconductors. Applied Physics Letters, 119(4), 041108. [PDF]

Wang, A., Das, A., & Grojo, D. (2020). Ultrafast Laser Writing Deep inside Silicon with THz-Repetition-Rate Trains of Pulses. Research (First Science Partner Journal), 2020, 8149764. [Link]

Jiang, L., Wang, A., Li, B., Cui, T., Lu, Y. (2017) Electrons Dynamics Control by Shaping Femtosecond Laser Pulses in Micro/Nano Fabrication: Modeling, Method, Application, and Measurement. Light: Science & Applications, 7, e17134.  (Review Article) [Link] 

Wang, A., Jiang, L., Li, X., Liu, Y., Dong, X., Qu, L., Duan, X., Lu, Y. (2015). Mask‐Free Patterning of High‐Conductivity Metal Nanowires in Open Air by Spatially Modulated Femtosecond Laser Pulses. Advanced Materials, 27(40), 6238-6243.  [Link]