ACADAMIC PROJECT

“ANALYSIS OF COMBINED HEAT TRANSFER MECHANISM FOR COOLING THE OBJECT”

"As power consumption increases, it becomes the hottest spot in an electronic system. Therefore, removing heat can be done by providing a good path for the heat to flow from the hottest spot to the atmosphere (heat sink)"

Methodology: 

1. Creating the model

2. Mesh generation

3. Applying boundary conditions

4. Applying the loads (thermal analysis)

5. comparing plain plate and heat sink with theoretical calculation

Components of heat sinks are

·       Base plate

·       Fins or Extended surfaces

BOUNDARY CONDITION:

RESULTS:

In this study, a steady state thermal analysis has been carried out on perforated heat sinks by comparing the plane plate and heat sink. The results are evaluated on the basis of temperature distribution and heat flux from the obtained analysis results the following conclusions were made are

1. The heat dissipation of the object when compared to both plain plate and heat sink, heat sink will improve the heat dissipation.

2. The comparison of both plain plate and heat sink, when heat sink added surface temperature drop is increased.

COMPARISON OF PLANE PLATE AND HEAT SINK

1. Temperature Distribution on plate without heat sink:

2. Temperature Distribution on plate with heat sink:

3. Heat flux Distribution on plate without heat sink

4. Heat flux Distribution on plate with heat sink

5. Directional heat flux on plate without heat sink

6. Directional heat flux on plate with heat sink